PNNI-based control plane for automatically switched optical networks

Much effort has been spent on the definition of control plane protocols for automatically switched optical networks (ASON). Most of the proposals brought into the standardization for an International Telecommunications Union-Telecommunication Sector, Internet Engineering Task Force, and Optical Internetworking Forum are based on Internet protocol concepts. One such proposal is the generalized multi-protocol label switching (GMPLS), an extension of the MPLS traffic engineering control plane model that includes nonpacket switched technologies (time, wavelength, and fiber switching). Recently, the potential use of private network-network interface (PNNI) in ASONs has been discussed as an alternative proposal by the standardization bodies. The goal of this paper is to appropriately adapt asynchronous transfer mode into an optical PNNI (O-PNNI) protocol that can be used as the control plane of ASONs. The paper also provides a critical viewpoint on the potential usage of either O-PNNI or GMPLS control plane and analyzes the pros and cons of each. The methodology adopted toward devising O-PNNI hinges on reviewing PNNI along with ASON recommendations in order to determine the set of PNNI features that require adaptation. Having identified these features we engineer and present appropriate solutions relating to routing, signaling and addressing aspects.     

Experimental real-time detector of GSM terminals

The authors present an experimental real-time GSM terminal detector, to be installed in a restricted area. The detector triggers terminal signaling, which can be captured.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

On the effect of spatial variances in historical rainfall time series to CSO performance evaluation.

Historical, high-resolution rain series are the backbone of modern combined sewer overflow (CSO) structure design. These rain series are the input to the computational estimation of the performance of the measures with respect to CSO pollution abatement. However, those historical precipitation measurements are available at only a few locations. Frequently rain series have to be used from gauging stations at a significant distance. In order to judge and to compensate for this influence an estimate between rain characteristics and combined sewer outflow (CSO) performance indicators would be useful. In this paper such correlations have been sought for a collection of 37 rain series covering large areas of Europe. It was found that the mean annual rain volume can explain most of the variances for the performance indicators Number of overflows and CSO volume. For explaining the spatial differences in the efficiency of the CSO structure another rain characteristic, i.e. the maximum event with a return period of one year, is to be used.     

Parametric effects on the transient Voltage performance of a DC superconducting cable

The objective of this work was to determine the significant parameters of a 3-GW 200-kV dc superconducting cable system which influence the transient voltage distribution in the various parts of the cable. The cable system consists of four coaxial metallic cylinders. It was found that the dielectric constant and the electrical resistivity of the soil significantly affect the severity of the transient voltages; lower dielectric constant and higher resistivity of the soil will increase the magnitudes of the transient voltages by increasing the earth-return impedance. It was also found that the effect of the conductor internal impedances of the cable is insignificant. Shorting the coaxial cylinders of the cryogen flow and the cryostat will lessen the severity of the transient voltages. Grounding the second, third, and fourth cylinders at regular intervals with low-impedance grounding impedance will also improve the transient performance of the cable. More research is needed to evaluate these procedures.     

Fracture response of fibre-reinforced materials with macro/microcrack damage using the Boundary Element Technique

The Boundary Element Method (BEM) incorporating the Embedded Cell Approach (ECA) has been used to analyse the effects of constituent material properties, fibre spatial distribution and microcrack damage on the localised behaviour of transversely fractured, unidirectional fibre-reinforced composites. Three specific composites, i.e., glass fibre reinforced polyester, carbon fibre reinforced epoxy and a glass-carbon hybrid, are considered. The geometrical structures examined were perfectly periodic, uniformly spaced fibre arrangements in square and hexagonal embedded cells. In addition, numerical simulations were also conducted using embedded cells containing randomly distributed fibres. The models involve both elastic fibres and matrix, with the interfaces between the different phases being fully bonded. The results indicate that the constituent material properties (two phase composite) and spatial distribution have a significant effect on the localised stress distributions around the primary crack tip. However, the strain energy release rate associated with crack propagation is predominantly influenced by the material composition. The three-phase hybrid composite exhibited an apparent intermediate fracture toughness value, compared to the all-glass and all-carbon models. Furthermore, the strain energy release rate for the macrocrack lowers as it enters a zone of localised damage (microcracking). The presence of microcracks relaxes the stress field, which can result in a significant reduction in the energetics of the primary crack.     

TEM Studies of High Temperature Corrosion Behaviour of TiAl Intermetallics with Surface Modifications

The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl₃ diffusion coating was studied in an environment of H₂/H₂S/H₂O at 850^oC. The kinetic results demonstrate that the TiAl₃ coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al₂O₃ scale on the surface of the TiAl₃‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800^oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate.     

Self-organized public-key management for mobile ad hoc networks

In contrast with conventional networks, mobile ad hoc networks usually do not provide online access to trusted authorities or to centralized servers, and they exhibit frequent partitioning due to link and node failures and to node mobility. For these reasons, traditional security solutions that require online trusted authorities or certificate repositories are not well-suited for securing ad hoc networks. We propose a fully self-organized public-key management system that allows users to generate their public-private key pairs, to issue certificates, and to perform authentication regardless of the network partitions and without any centralized services. Furthermore, our approach does not require any trusted authority, not even in the system initialization phase.