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921.
Schubert E.F. Hunt N.E.J. Malik R.J. Micovic M. Miller D.L. 《Lightwave Technology, Journal of》1996,14(7):1721-1729
Resonant-cavity light-emitting diodes (RCLED) are novel, high-efficiency light-emitting diodes which employ optical microcavities. These diodes have higher intensities and higher spectral purity as compared to conventional LEDs. Analytical formulas are derived for the enhancement of the spontaneous emission along the optical axis of the cavity. The design rules for high-efficiency operation of RCLEDs are established. The temperature dependence of the emission intensity is analyzed in the range 20-80° and it is described by an exponential dependence with a characteristic temperature of 112 K. The modulation characteristics of RCLEDs exhibit 3 dB frequencies of 580 MHz. Eye diagrams at transmission rates of 622 Mb/s are wide open indicating the suitability of RCLEDs for high-speed data transmission 相似文献
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N Milman T Bergholt L Eriksen K Ahring NA Graudal 《Canadian Metallurgical Quarterly》1997,159(41):6057-6062
Among fertile, nonpregnant, Danish women, 33% have absent or reduced iron stores; 22% have serum ferritin values above 70 micrograms/l, i.e., iron reserves of more than 530 mg, corresponding to the net iron losses during a normal pregnancy. During pregnancy, the demands for absorbed iron increase from 0.8 to 7.5 mg/day. Controlled studies show that iron-treated pregnant women have higher serum ferritin levels, i.e., larger iron stores, and higher haemoglobin levels than placebo-treated women. A supplement of 66 mg ferrous iron daily from the beginning of the 2nd trimester prevents iron deficiency anaemia. In Denmark, general iron prophylaxis with 60-70 mg ferrous iron daily from 20 weeks of gestation is recommended by the health authorities. 相似文献
926.
Circuit sensitivity to interconnect variation 总被引:1,自引:0,他引:1
Lin Z. Spanos C.J. Milor L.S. Lin Y.T. 《Semiconductor Manufacturing, IEEE Transactions on》1998,11(4):557-568
Deep submicron technology makes interconnect one of the main factors determining the circuit performance. Previous work shows that interconnect parameters exhibit a significant amount of spatial variation. In this work, we develop approaches to study the influence of the interconnect variation on circuit performance and to evaluate the circuit sensitivity to interconnect parameters. First, an accurate interconnect modeling technique is presented, and an interconnect model library is developed. Then, we explore an approach using parameterized interconnect models to study circuit sensitivity via a ring oscillator circuit. Finally, we present an alternative approach using statistical experimental design techniques to study the sensitivity of a large and complicated circuit to interconnect variations 相似文献
927.
928.
For discontinuity analysis more and more sophisticated methods are used in the nuclear industry. The rapid development of computer technology offers the possibility to use imaging techniques. Instead of specialized focusing transducers the more flexible synthetic focusing techniques can be used. Presupposing that the material is ultrasonically isotropic and homogeneous, imaging techniques make it possible to visualize the reflectivity of the volume to be tested.Siemens developed the high speed holographic instrument Holo 3000 in cooperation with the University of Bochum. In this paper the method of Broad Band Holography is presented in the context of other imaging techniques.Different filtering methods have been investigated in order to achieve highest resolution and best signal to noise ratio with a given dataset. Different transducers respective wave modes have been applied to austenitic welds and claddings. The reconstructed image was evaluated using image processing techniques in order to investigate the possibilities to produce results easier to be quantifed than the original reconstruction.The results presented show a reliable expert tool for analysis measurements which also can be used for flaw detection. 相似文献
929.
A. T. Adorno C. R. S. Beatrice A. V. Benedetti P. L. Cabot 《Journal of Materials Science》1993,28(2):411-414
Electrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium. 相似文献
930.