Silicon-to-steel bonding using rapid thermal annealing

This paper presents the rapid, low-temperature bonding between silicon and steel using the rapid thermal annealing process. Three different thin-film adhesion layer systems including silver, gold, and nickel were utilized as the intermediate bonding material to assist the eutectic Pb/Sn bonding between silicon and steel. The bonding temperature was set at 220/spl deg/C for 20 s, with a 20-s ramp-up time. Five experiments were conducted to determine the strength of the bond, including static tensile and compressive four-point bend tests, axial extension tests, tensile bending fatigue tests, and corrosion resistance tests. The test results have shown that the gold adhesion layer is the most robust, demonstrating minimal creep during fatigue tests, no delamination during the tensile or compressive four-point bend tests, and acceptable strength during the axial extension tests. Additionally, all adhesion layers have withstood four months of submersion in various high-temperature solutions and lubricants without failure. Simulations of the axial stresses and strains that developed during the four-point bend and axial extension tests were performed and showed that the presence of the silicon die provides a local reinforcement of the bond as observed in the experimental tests.     

一种抗NLOS的TDOA定位算法

本文提出了一种抗非视线传播(Non-Line-of-Sight)干扰的TDOA定位算法。该算法采用退火与遗传算法相结合的方式，在满足给定条件的空间内搜索源点坐标值。数值仿真表明，该算法具备抗NLOS干扰的能力，与传统TDOA算法相比，该算法无需知道各基站的非视线传播干扰分布，是一种实用有效的定位算法。     

Sphere packing with a geometric based compression algorithm

An efficient algorithm for the random packing of spheres can significantly save the cost of the preparation of an initial configuration often required in discrete element simulations. It is not trivial to generate such random packing at a large scale, particularly when spheres of various sizes and geometric domains of different shapes are present. Motivated by the idea of compression complemented by an efficient physical process to increase packing density, shaking, a new approach, termed compression algorithm, is proposed in this work to randomly fill any arbitrary polyhedral or cylindrical domains with spheres of various sizes. The algorithm features both simplicity and high efficiency. Tests show that it takes 181 s on a 1.4-GHz PC to complete the filling of a cylindrical domain with a total number of 26,787 spheres, achieving a packing density of 52.89%.     

Local residence time,residence revolution,and residence volume distributions in twin‐screw extruders

This work was aimed at studying the overall, partial, and local residence time distributions (RTD); overall, partial and local residence revolution distributions (RRD) and overall, partial and local residence volume distributions (RVD) in a co‐rotating twin screw extruder, on the one hand; and establishing the relationships among them, on the other hand. Emphasis was placed on the effects of the type and geometry of mixing elements (a gear block and various types of kneading elements differing in staggering angle) and process parameters on the RTD, RRD and RVD. The overall and partial RTD were directly measured in‐line during the extrusion process and the local ones were calculated by deconvolution based on a statistical theory. The local RTD allowed comparing the mixing performance of mixing elements. Also it was confirmed both experimentally and theoretically that specific throughput, defined as a ratio of throughput (Q) over screw speed (N), controlled all the above three types of residence distributions, be they local, partial or overall. The RRD and RVD do not provide more information on an extrusion process than the corresponding RTD. Rather they are different ways of representing the same phenomena. POLYM. ENG. SCI., 48:19–28, 2008. © 2007 Society of Plastics Engineers     

状如琼，凝为脂

在我们喝的饮料粒粒橙中，为什么那些细小的橙子颗粒是悬浮在橙汁中的呢？果冻和布丁为什么是透明，且柔软有弹性的呢？去看看成分表，我们不难发现共同之处，看似不同的食品都添加了一种共同的成分——琼脂。[编者按]     

3-D MCM封装技术及其应用

介绍了超大规模集成电路（VLSI）用的3-D MCM封装技术的最新发展，重点介绍了3-D MCM封装垂直互连工艺，分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题，并对3-D MCM封装的应用作了简要说明。     

基于作业测定技术的后桥壳生产线工艺评价及优化

以某企业后桥壳生产线为研究对象,运用作业测定技术中的时间研究法,测定后桥壳各工序的标准时间,评价工艺及找到瓶颈工序;运用"5W1H"提问技术,根据"ECRS"原则,同时结合工艺设计及企业资源情况,对后桥壳生产线现有工艺进行评价及优化,改善后,使生产线的产能每天提高了10件,生产能力提高了33.57%.     

探讨某高级车库设计需要注意的几点问题

广州市现在每天增加的小汽车数量就在400辆以上，这种迅猛的增长势头除了对城市的交通运输网络造成很大的压力外，城市的停车缺口也在不断扩大，现在广州市的停车位缺口就在30万辆左右。针对这种情况，地方政府正在加大解决城市停车难问题的力度．其中一项措施就是增加建设停车库。