A multi-agent decision support system for stock trading

A distributed problem solving system can be characterized as a group of individual cooperating agents running to solve common problems. As dynamic application domains continue to grow in scale and complexity, it becomes more difficult to control the purposeful behavior of agents, especially when unexpected events may occur. This article presents an information and knowledge exchange framework to support distributed problem solving. From the application viewpoint the article concentrates on the stock trading domain; however, many presented solutions can be extended to other dynamic domains. It addresses two important issues: how individual agents should be interconnected so that their resources are efficiently used and their goals accomplished effectively; and how information and knowledge transfer should take place among the agents to allow them to respond successfully to user requests and unexpected external situations. The article introduces an architecture, the MASST system architecture, which supports dynamic information and knowledge exchange among the cooperating agents. The architecture uses a dynamic blackboard as an interagent communication paradigm to facilitate factual data, business rule, and command exchange between cooperating MASST agents. The critical components of the MASST architecture have been implemented and tested in the stock trading domain, and have proven to be a viable solution for distributed problem solving based on cooperating agents     

水溶性油墨用富马酸改性松香树脂的研制

介绍了一种水溶性富马酸改性松香树脂的制备方法 ,选取了较佳的工艺条件 ,本产品经国内几家油墨厂使用 ,结果表明适合水溶性油墨的应用要求     

激光熔覆Ni基SiC合金涂层组织与性能的研究

利用5kWCO2连续波激光器在16Mn钢基材表面对含20%(体积比)SiC陶瓷粉末的镍基自熔性合金粉末进行激光熔覆得到Ni基SiC合金涂层(NiSiC)。研究了合金涂层的组织形貌及相结构,并用单纯的镍基合金涂层(Ni60)进行了显微硬度及滑动磨损性能的对比试验。结果表明,NiSiC合金涂层由γ枝晶及其间的共晶组织组成,主要组成相为γ-Ni,γ-(Ni,Fe)固溶体和(Cr,Fe)7C3,Cr23C6及(Cr,Si)3Ni3Si等化合物。添加SiC的镍基合金涂层NiSiC比单纯的镍基合金涂层Ni60具有较高的硬度和耐磨性。     

On minimum-fuel control of affine nonlinear systems

The minimum-fuel control problem is investigated for a class of multiinput affine nonlinear systems whose associated Lie algebra is nilpotent. After preliminary notions and definitions are presented, emphasis is on the solution to the optimal control problem of the Lie algebra generated by certain system vector fields is nilpotent. Consequences of the maximum principle are deduced for such systems     

分布式光纤喇曼放大技术及其在WDM系统中的应用

介绍了分布式光纤喇曼放大技术的原理、特点和应用 ,并从受此影响的 WDM传输系统的信噪比、噪声指数和品质因数三个方面讨论了光纤喇曼放大技术在提升光纤通信系统性能方面的重要作用。     

斗晏水电站混凝土面板堆石坝趾板设计

阐述了江西省重点建设项目斗晏水电站混凝土面板堆石趾板设计，并重点介绍较大断层上趾板设计处理方式。     

中国石油未来油气勘探重点领域分析

根据近几年来的研究认识与勘探成果分析,未来几年中国石油油气勘探主要集中于如下五大重点领域:大面积低渗透岩性油气藏、成熟区复杂隐蔽油气藏、前陆盆地复杂构造油气藏、海相碳酸盐岩油气藏和渤海湾滩海第三系油气藏。     

MEMS光开关及其与光纤组装方式的研究

光开关是一种在光路中应用极其广泛的光无源器件,可用于扫描、投影、通讯等多种不同的领域,其中用于全光通讯中连接光纤之间的光开关日渐成为人们关注的焦点.高性能、低成本、又能大量生产的MEMS光开关很好地满足了全光网络对器件的要求.本文对这种MEMS光纤光开关的类型、特点以及研究现状进行了介绍,并给出了MEMS光开关与输入输出光纤的组装与自组装以及主要方式.     

Analysis on the effectiveness of the 20-H rule for printed-circuit-board layout to reduce edge-radiated coupling

This paper presents the quantified study of the electromagnetic radiation mechanism of the 20-H rule using a numerical approach that has not yet been systematically addressed. The 20-H rule is a rule-of-thumb layout technique recommended to minimize radiated fields propagating from the edges of a printed circuit board (PCB) coupling onto nearby structures. Propagating electromagnetic fields may corrupt adjacent cable assemblies, sheet metal enclosures, and aperture openings. The magnitude of this design rule is investigated using the full-wave finite-difference time-domain (FDTD) method. An analysis on whether benefits exist from use of this rule is examined and under what conditions the rule is valid when correctly implemented. The purpose of this paper is to provide insight into the validity of the 20-H rule, recognizing that every PCB will have different simulation results. FDTD is used to capture a snapshot view of field propagation. This view allows one to determine the validity of the 20-H rule at a single point of time within a dynamic structure and what may be expected when digital components are finally added to a PCB assembly, which generally negates simulated results.