Understanding trust in ms-commerce: The roles of reported experience,linguistic style,profile photo,emotional, and cognitive trust

This paper examines what influences trust in mobile social commerce environment. Drawing on trust-based acceptance model (i.e. cognitive and emotional trust) and online review features (i.e. profile photo, linguistic style, and reported experience), we examine how these factors affect trust in mobile social commerce. Hypotheses were tested using survey data. The results of our model showed that there are significant influences of profile photo, reported experience, cognitive, and emotional trust towards trust in ms-commerce. This work contributes to existing literature by examining the roles of previous trust in mobile payments and online reviews on trust in mobile social commerce.     

低剂量抑制剂Inhibex501存在下的甲烷水合物相平衡研究

含动力学抑制剂的天然气水合物相平衡研究对新型低剂量抑制剂的开发具有指导作用。在283.6 ~ 290.9 K和7.51 MPa ~ 15.97 MPa的温压范围内研究了抑制剂Inhibex501及其溶剂2-乙二醇单丁醚对甲烷水合物相平衡条件的影响。实验结果显示，0.5wt%和2.0wt%浓度的Inhibex501对甲烷水合物形成的热力学条件具有促进作用，能使甲烷水合物形成移向更高的温度或者更低的压力，而2-乙二醇单丁醚在浓度0.2wt% ~ 1.0wt%范围几乎不改变甲烷水合物形成的热力学条件，N-乙烯基己内酰胺与N-乙烯基吡咯烷酮的共聚物对水合物形成热力学条件的改变起主要作用。     

吸收式热泵耦合带式干化在热电厂煤泥掺烧上的应用分析

热电厂煤泥掺烧机组利用吸收式热泵耦合带式干化技术,不仅可对污泥进行无害化处置,同时回收利用污泥干化及电厂焚烧余热废热,减少环境热污染,提高能源利用率.     

露天转地下联合开采技术探讨

针对复杂型锰矿开采提出了由露天转地下联合开采技术，与其它采矿方法相比较，这种方法提高了回采率，降低了采矿成本。     

企业质量管理体系运行的思考

质量管理永远是企业生命的源泉,质量管理体系是一个复杂的系统工程,企业只有不断完善质量体系,进行质量管理创新,保持质量管理体系的长期有效的进行,才能在市场竞争中保持领先。     

钨掺杂二氧化钛可见光催化剂低温合成及性能研究

采用低温一步法合成了钨掺杂的二氧化钛,并用X射线衍射(XRD)、红外光谱(IR)、紫外可见漫反射光谱(UV-Vis)等方法对其结构进行了表征.发现掺杂钨的二氧化钛为锐钛矿型晶型,且在可见光区有明显的吸收.以苯酚的光催化氧化降解反应为探针,研究了催化剂的光催化性能.结果表明,本方法合成的钨掺杂的二氧化钛具有理想的可见光催化活性.     

运动饮料配方设计概论

运动中，人体生理发生一系列的变化，包括水分损失、血糖／糖原消耗、电解质损失等，导致运动中／后的疲劳和运动能力下降。以运动中人体生理特点为基础，通过讨论运动前／中／后补充水、碳水化合物及电解质的问题，论证了运动饮料配方设计的原理依据。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

低温送风系统末端装置诱导器的研究及性能评价

研究了在低温送风系统中诱导器(IDU)的结构特点、工作原理、送风方式,分析了诱导器送风口射流速度的特性,得出了诱导器空调系统的优缺点。     

通信交流供电方案初探

在通信供电系统中,与直流供电系统相比,从设计、设备技术,到运行维护管理,交流供电系统都有所滞后。借鉴直流供电系统经验,通过应用N X并联逆变器模块热插拔技术,实行分散式供电,进而改变传统的以UPS为核心的集中供电模式,则可在很大程度上解决一直困扰着我们的交流供电系统成本高和可靠性低的难题。