喷射成形高温合金沉积态组织的形成与演变

对喷射成形高温合金的组织形成及其从雾化过程的树枝晶向等轴晶组织的演变过程进行了分析，结果表明，半液态层中发生的枝晶破碎，重熔所造成的核心增殖作用为等轴晶组织的形成提供了大量结晶核心，在此基础上枝晶臂的合并，粗化以及未严重固相枝晶的粗化和均匀化产生了喷射成形材料所持有的非枝非等轴晶组织。     

冶金企业面临的严峻局面及今后工作重点

阐述了冶金企业在当前的严峻形势下，要求得生存必须转变传统观念。并提出“九五”期间的工作重点是：节能降耗、调整品种结构、提高生产率及加强决策管理。重点论述了实现节能降耗应抓好的四项工作：连铸坯一火成材与热装直轧，轧钢炉窑节能技术，轧机主传动交流调速技术及控制冷却技术。     

基于身份的指定验证者代理签名方案*

在代理签名中,原始签名人能将其数字签名权力委托给代理签名人;在指定验证者签名方案中,只有事先指定的验证者才能验证签名的有效性.综合上述两种方案的优点,利用Weil对的双线性映射,构造了一个基于身份的指定验证者代理签名方案,并对其安全性进行简要的分析.     

金银花变色与5-羟甲基糠醛等有效成分含量的相关性研究

[目的]研究不同年限金银花的外观颜色与其5-羟甲基糠醛、绿原酸含量的相关性,为金银花的质量评价提供依据.[方法]采用高效液相色谱仪测定9批金银花中5-羟甲基糠醛和绿原酸的含量,引入色差仪测定不同年限的金银花色度值L*、a*、b*,同时通过SPSS 20.0将金银花有效成分含量测定的结果与色度值进行相关性分析.[结果]储存年限越长、色泽偏黄棕色的金银花中,绿原酸含量越少,5-羟甲基糠醛含量越多;5-羟甲基糠醛和明度L*呈负相关,相关系数为-0.769 (P＜0.05);绿原酸和明度L*呈正相关,相关系数为0.757 (P＜0.05).[结论]5-羟甲基糠醛与金银花色泽变化存在相关性,能更好的将外观指标与内在成分联系起来,可作为金银花质量评价的指标.     

Red Emissive Carbon Dots Prepared from Polymers as an Efficient Nanocarrier for Coptisine Delivery in vivo and in vitro

Negatively charged fluorescent carbon dots (CDs, E_m=608 nm) were hydrothermally prepared from thiophene phenylpropionic acid polymers and then successfully loaded with the positively charged anticancer cargo coptisine, which suffers from poor bioavailability. The formed CD-coptisine complexes were thoroughly characterized by particle size, morphology, drug loading efficiency, drug release, cellular uptake and cellular toxicity in vitro and antitumor activities in vivo. In this nano-carrier system, red emissive CDs possess multiple advantages as follows: 1) high drug loading efficiency (>96 %); 2) sustained drug release; 3) enhanced drug efficacy towards cancer cells; 4) EPR effect; 5) drug release tracing with near-infrared imaging. These properties indicated that red emissive CDs prepared from polymers could be used as a novel drug delivery system with integrated therapeutic and imaging functions in cancer therapy, which are expected to have great potential in future clinical applications.     

排烟高位收水冷却塔设计

本文介绍了排烟高位收水冷却塔探索过程.结合庐江神皖合肥庐江发电厂工程介绍了排烟高位收水冷却塔的斜支柱布置、玻璃钢烟道筒壁支持体系、中央竖井及烟道支架结构及排烟高位收水冷却塔防腐设计.     

电热水器缓冲材料选择与结构设计

电热水器因其特殊的圆柱形结构,使其运输过程中垫层易碎及存储过程中堆码倾斜.以圆柱形电热水器包装材料为研究对象,分析了产品目前的运输环境,总结出了现有EPS缓冲衬垫的不足.分别对EPS材料、EPO材料进行压缩试验及断裂弯曲试验,对比发现,EPO材料更加适用于圆柱型家用电器.设计出了以EPO材料为基材的缓冲下衬垫结构,对原有EPS下衬垫进行替代,并对缓冲衬垫材料及结构的可行性进行了分析.     

新基建下的电力物联管理平台实现

面对新基建带来的海量电力设备接入的挑战,研究了高性能电力物联管理平台,从技术路线、功能设计两方面进行了设计,实现了支持海量电力设备低延时接入、海量设备长连接和支持标准多协议的接入,满足了海量电力终端与数据的可管和可控.     

基于全网信息交互的功率再平衡控制方案研究

主要研究在全网信息交互的基础上,将传统线路保护、主设备保护、安全自动装置等设备配置在统一的网络智能控制与广域保护内,各子功能模块间通过HTM实时总线进行信息交换,子功能模块之间统一采取的控制措施.主要采用的新技术包括故障后形成局部孤网的控制技术、快速恢复供电技术、基于远动装置的OSB总线数据采集技术等.通过维持局部孤网的功率再平衡并合备用电源恢复与主网的电气联系,确保电网可靠稳定运行,针对常规的二道防线、三道防线设备独立运行,不同功能之间配合困难的问题,此方法可以有效提高区域电网运行的供电连续性及可靠性.     

Low Dielectric Polyimide/Fluorinated Ethylene Propylene (PI/FEP) Nanocomposite Film for High-Frequency Flexible Circuit Board Application

The low dielectric polymer films have drawn great attention to the application as the dielectric insulating materials in high-frequency circuit boards, while the weak adhesion to the copper foils and the poor processability resulted from the fluorinated or rigid structures limited their high-frequency application. In this work, the low dielectric and high adhesive polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high-frequency flexible circuit board application is developed. It is indicated that the fluorocarbon surfactants can significantly improve the dispersion of FEP in PI substrate, and thus, the PI/FEP nanocomposite film exhibits excellent mechanical properties, including the tensile strength increases to 46.6 MPa and the elongation at the break increases to 13.7%. Importantly, at the high-frequency of 10 GHz, the 60 wt% FEP filled PI nanocomposite film displays an ultralow dielectric loss (0.006) and a reduced dielectric constant (2.69). In addition, the high-frequency flexible circuit board with the PI/FEP film as the dielectric insulating layer has a high peel strength of 0.75 N mm⁻¹, indicating this PI/FEP nanocomposite film can meet the requirements of the high-frequency flexible circuit board application.