Ag-Cu-In-Sn钎料加工工艺的研究

Ag-Cu-In-Sn系合金钎料,熔化温度在557～693℃之间,适合于电真空、半导体及微电子器件在真空或保护气氛中无钎剂中温钎焊.对In Sn含量为20%的Ag-Cu-In-Sn合金,采用强制大变形热挤压开坯的方式,得到了0.1 mm以下的薄带钎料.通过金相观察、SEM、XRD及拉伸力学试验对钎料的金相组织、相结构、熔化温度及力学性能进行了分析测试.结果表明:对In Sn含量为20%的Ag-Cu-In-Sn合金钎料,采用强制大变形热挤压开坯,可得到0.1 mm以下的薄带钎料,成材率达到60%以上;Ag-Cu-In-Sn合金主要由具有面心立方结构的富Ag的α相和具有复杂结构富Cu的β相,及少量的Cu41Sn11、Ag3 In、CuSn等中间相化合物组成;材料的抗拉强度高达495 MPa;材料的断裂机制为微孔聚集型断裂,微观组织中有明显的韧窝存在.     

Reactive sintering mechanism of Ti + Mo<Subscript>2</Subscript>C and Ti + VC powder compacts

TiC reinforced Ti-matrix composites have been synthesized successfully by reactive sintering of Ti-1.5%Fe-2.25%Mo (wt%) powder compacts with addition of Mo₂C and VC particles. The reactions for the formation of TiC particles start at 600 °C, but the distribution of TiC particles and the densification behavior in the two compacts are significantly influenced by the metal carbides (Mo₂C or VC). The compact with addition of Mo₂C has a relative density of 98% after sintering at 1300 °C for 1.5 h, but TiC particles are agglomerated in the Ti matrix. The compact with addition of VC has a relative density of about 91% after sintering at 1300 °C for 1.5 h, but TiC particles distribute more homogenously in the Ti matrix. Different TiC particle distribution and densification behaviors are attributed to the reaction rates between Ti and metal carbides and the subsequent diffusion process.