温度敏感葡聚糖凝胶的合成及其细胞相容性研究

合成了N-异丙基丙烯酰胺（NIPAAm）与葡聚糖的共聚水凝胶，利用红外光谱表征了单体和凝胶结构，研究了水凝胶在去离子水和细胞培养基中的温度响应性，并对凝胶进行了细胞培养和脱附研究．结果表明，共聚凝胶具有很好的温度敏感性和细胞相容性，可以通过控制温度变化，实现对细胞的无损伤脱附．     

In situ formation of multi scale reinforcing phases to improve performance of Al2O3-SiC C castables

In order to improve the physical properties and slag corrosion resistance of refractory materials for hot metal pretreatment, different contents of composite metal powders (CMP) were introduced into Al2O3-SiC-C refractory castables. The effect of CMP on the microstructure, physical properties and slag corrosion resistance of Al2O3-SiC-C refractory castables were studied. The results show that the multi scale reinforcing phases including flake crystals, rod shaped fibers, filamentous fibers and whiskers are in situ formed in the samples with addition of CMP, which result to the improvement of the cold modulus of rupture and cold crushing strength. When the addition of CMP is 6 wt.%, the high temperature modulus of rupture increases by 231%, the thermal shock resistance increases by 77% after thermal shock by water cooling 5 times and the percentage of the slag resistant area reduces by 37.2%.     

利用铝（100）面隧道孔制备纳米模板及有序阵列材料

高纯铝箔通常通过电化学扩面后用作铝电解电容器的阳极材料。利用铝箔（100）面隧道孔制备纳米模板。这种纳米模板的特点是制作简单、模板面积大，纳米阵列材料形状可控性强。还利用两步电化学侵蚀铝箔的特殊工艺，研制出纵横交错的TiO2纳米有序阵列材料。     

基于μC/GUI的嵌入式图形界面设计

μC／GUI是一种基于嵌入式应用的通用图形接口软件，文章在详细介绍μC／GUI特点的基础上给出了基于NHC_01型彩色液晶模块的移植实例，并提供了液晶模块与ARM7内核处理器的硬件接口框图。通过分析μC／GUI的动态内存管理机制，给出了一种基于窗口的嵌入式通用图形界面设计方法。     

铁素体球墨铸铁与20钢的闪光对焊

试验使用铁素体球墨铸铁和20钢的实心棒料进行了闪光对焊，通过改变次级电压4～8级，通电时间3～5s，观察其焊接接头组织的变化并测定其抗拉强度。结果表明，接头由三个区组成；当通电时间一定时，抗拉强度随次级电压的升高先减小后增大；当次级电压一定时，抗拉强度随通电时间的增加而增大。在次级电压为8级、通电时间为5s时，抗拉强度达最大值，为370．8MPa，是20钢母材的90.4％，是球墨铸铁母材的83.7％。     

靶向抗癌药格列卫与其治疗白血病疗效监测

Gleevec是抑制致癌的融合蛋白BCR-ABL的一种分子靶向治疗药物,BCR-ABL是一种与慢性髓细胞性白血病(CML)有关的酪氨酸激酶抑制剂。用Gleevec选择性地抑制BCR-ABL活性在治疗CML中显示出很好的效果,特别是在CML慢性期,因此,监测疗效非常重要。现就Gleevec的研究进展及如何监测其在CML中的疗效作一简单综述。     

Dynamic Multicast Session Provisioning in WDM Optical Networks with Sparse Splitting Capability

In this work, we study dynamic provisioning of multicast sessions in a wavelength-routed sparse splitting capable WDM network with an arbitrary mesh topology where the network consists of nodes with full, partial, or no wavelength conversion capabilities and a node can be a tap-and-continue (TaC) node or a splitting and delivery (SaD) node. The objectives are to minimize the network resources in terms of wavelength-links used by each session and to reduce the multicast session blocking probability. The problem is to route the multicast session from each source to the members of every multicast session, and to assign an appropriate wavelength to each link used by the session. We propose an efficient online algorithm for dynamic multicast session provisioning. To evaluate the proposed algorithm, we apply the integer linear programming (ILP) optimization tool on a per multicast session basis to solve off-line the optimal routing and wavelength assignment given a multicast session and the current network topology as well as its residual network resource information. We formulate the per session multicast routing and wavelength assignment problem as an ILP. With this ILP formulation, the multicast session blocking probability or success probability can then be estimated based on solving a series of ILPs off-line. We have evaluated the effectiveness of the proposed online algorithm via simulation in terms of session blocking probability and network resources used by a session. Simulation results indicate that our proposed computationally efficient online algorithm performs well even when a fraction of the nodes are SaD nodes.     

One-to-Many and Many-to-One Optical Chaos Communications Using Semiconductor Lasers

A theoretical construction of one-to-many (OTM) and many-to-one (MTO) chaos synchronization communications using semiconductor lasers is presented. One center laser provides strong injections (strong link) to other side lasers, and the side lasers also provide weak injections (weak link) to the center one. Simulation results show that the side lasers synchronize with the center laser through injection-locking. In addition, messages transmitted via the strong links or the weak links experience strong chaos pass filtering, enabling us to realize OTM and MTO communications.     

Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly

In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.     

Φ4.0m×60m回转窑辐射热的应用

水泥厂回转窑简体内砌筑了耐火砖隔热,但仍有部分热通过简体以辐射的形式散失到大气中,吸收利用这部分辐射热也是一项节能减排的举措.