无掩模硅图形衬底上3C-SiC的异质外延生长

采用低压化学气相沉积方法在无掩模的硅图形衬底上异质外延生长3C-SiC.硅图形衬底采用光刻和ICP刻蚀得到.图形由平行长条状沟槽和台面组成,其中沟槽宽度为1～10μm不同间隔,沟槽之间距离为1～10μm不同间隔.对于在不同的沟槽和台面尺寸区域3C-SiC的生长进行了详细研究.采用扫描电镜分别观察了不同区域的生长形貌,分析了图形衬底结构上SiC的生长行为.其中合并生长形成的空气隙结构可以释放由Si和SiC晶格失配引起的应力,从而可以用来解决SiC生长中的晶片翘曲问题,进行厚膜生长.XRD结果表明此无掩模硅图形衬底上得到3C-SiC(111)取向生长.     

MOCVD外延生长高阻GaN薄膜材料

采用MOCVD技术在非有意掺杂的条件下，在C面蓝宝石衬底上制备出了高阻的GaN单晶薄膜样品. 用扫描电子显微镜和原子力显微镜分析样品显示GaN外延膜的表面十分平整，表面粗糙度仅有～0.3nm. 样品的X射线双晶衍射摇摆曲线（0002）峰的半峰宽为5.22′，证实所生长的GaN外延层具有较好的结晶质量. 变温Hall测量发现样品的室温电阻率高达6.6e8Ω·cm, 250℃下的电阻率约为10.6Ω·cm.     

MOCVD外延生长高阻GaN薄膜材料

采用MOCVD技术在非有意掺杂的条件下,在C面蓝宝石衬底上制备出了高阻的GaN单晶薄膜样品.用扫描电子显微镜和原子力显微镜分析样品显示GaN外延膜的表面十分平整,表面粗糙度仅有～0.3nm.样品的X射线双晶衍射摇摆曲线(0002)峰的半峰宽为5.22',证实所生长的GaN外延层具有较好的结晶质量.变温Hall测量发现样品的室温电阻率高达6.6×108Ω·cm,250℃下的电阻率约为106Ω·cm.     

用气态源分子束外延生长法制备Si/SiGe/Si nPn异质结双极晶体管

用气态源分子束外延法制备了Si/SiGe/Si npn异质结双极晶体管.晶体管基区Ge组分为0.12,B掺杂浓度为1.5×101 9cm-3, SiGe合金厚度约45nm.直流特性测试表明,共发射极直流放大倍数约50,击穿电压VCE约9V;射频特性测试结果表明,晶体管的截止频率为7GHz,最高振荡频率为2.5GHz.     

The effect of δ-doping and modulation-doping on Si-doped high Al content n-AlxGa1-xN grown by MOCVD

The effect of periodic delta-doping and modulation-doping on high Al content n-Al_xGa_1-xN（x = 0.55） epilayers grown by MOCVD has been investigated.Measured by XRD,AFM,contactless sheet resistance, and Hall-effect tests,δ-doped and modulation-doped n-Al_xGa_1-xN have better crystal quality,surface morphology and electrical properties as compared with uniformly-doped n-Al_xGa_1-xN.These improvements are attributed to the SiN_x growth mask induced by 5-doping layers and the dislocation-blocking effect induced by both growth techniques.In addition,due to the broadened doping profile ascribed to enhanced dopant diffusion at high growth temperatures（1150℃） of n-Al_0.55Ga_0.45N,modulation-doped n-Al_0.55Ga_0.45N has similar properties asδ-doped n-Al_0.55Ga_0.45N.     

MOCVD epitaxy of InAlN on different templates

InAlN epilayers were grown on high quality GaN and A1N templates with the same growth parameters. Measurement results showed that two samples had the same In content of～16%,while the crystal quality and surface topography of the InAlN epilayer grown on the AlN template,with 282.3"（002） full width at half maximum （FWHM） of rocking curve,313.5"（102） FWHM,surface roughness of 0.39 nm and V-pit density of 2.8×10⁸ cm^-2,were better than that of the InAlN epilayer grown on the GaN template,309.3",339.1",0.593 nm and 4.2×10⁸ cm^-2.A primary conclusion was proposed that both the crystal quality and the surface topography of the InAlN epilayer grown on the AlN template were better than that of the InAlN epilayer grown on the GaN template. Therefore,the AlN template was a better choice than the GaN template for getting high quality InAlN epilayers.     

Luminescence distribution and hole transport in asymmetric InGaN multiple-quantum well light-emitting diodes

Asymmetric InGaN/GaN multiple-quantum well(MQW) light-emitting diodes were fabricated to expose the luminescence distribution and explore the hole transport.Under electrical injection,the sample with a wNQW active region in which the first QW nearest the p-side(QW1) is wider than the subsequent QWs shows a single long-wavelength light-emission peak arising from QW1.The inverse nWQW sample with a narrow QW1 shows one short-wavelength peak and one long-wavelength peak emitted separately from QW1 and the su...     

硅基微电子新材料SGOI薄膜研究进展

绝缘体上的锗硅技术(SiGe on Insulator,SGOI)和以它为衬底开发的应变硅技术(Strained Silicon on Insulator,sSOI)融合了SiGe技术和SOI技术二者的优点,是近年来人们广泛重视的研究热点和硅基集成电路产业进一步发展的重要研究方向,是国际半导体技术发展路线图(ITRS)中CMOS技术今后几年发展的方向.文章综述了SGOI薄膜的多种制备方法和最新研究进展.     

水平冷壁CVD生长4H-SiC同质外延膜

采用自行设计的水平冷壁低压化学气相沉积(LPCVD)方法在偏向〈1120〉晶向8°的n型4H-SiC(0001)衬底上进行了同质外延生长.在5.3×103Pa的低压下,外延膜生长速率超过3μm/h.电容-电压法测试表明在非有意掺杂外延膜中净施主浓度为8.4×10 15cm-3.Nomarski显微镜观察表明厚外延膜的表面光滑,生长缺陷密度很低.AFM测试显示表面均方根粗糙度为0.3nm,没有观察到宏观台阶结构.Raman谱线清晰锐利,表现出典型的4H-SiC特征.在低温PL谱中,近带边区域出现很强的自由激子峰,表明样品是高质量的.     

偏晶向(0001)Si-面衬底上4H-SiC的LPCVD外延生长

化学气相沉积（CVD）是微电子器件用SiC外延材料的主要生长技术. 为了获得高质量的4H-SiC外延材料，在偏向〈1120〉方向8. 的4H-SiC (0001) Si-面衬底上，利用台阶控制生长技术进行4H-SiC的同质外延生长. 表面形貌是SiC外延材料质量好坏的一个重要参数，为此研究了表面形貌与工艺参数的关系，探讨了4H-SiC外延膜的表面缺陷形成原因. 利用Raman散射技术研究了非均匀4H-SiC外延材料的多晶型现象.