Damage accumulation under repeated reverse stressing of Sn-Ag solder joints

To better understand the effect of repeated reverse stress in solder joints, a new testing method was developed. Tin-silver solder joints were fabricated, constrained between Cu blocks, and then subjected to repeated shear loading in a tensile tester. Constant strain amplitudes were applied to simulate service conditions. However, large loads were used to accelerate the damage accumulation. Microstructural features of the damage were very similar to those found with studies on thermomechanical fatigue (TMF) of small, single shear lap samples. Concentrated-shear banding or striations were observed to form along Sn dendrites. The load behavior of the solder with each cycle and during hold times at the extreme strain amplitude was consistent with damage accumulating with each successive cycle. Effects of strain amplitude, hold times at the stress extremes, number of cycles, and solder-joint thickness were found to play significant roles on the stress-strain behavior and surface damage.     

Effects of prestrain,rate of prestrain,and temperature on the stress-relaxation behavior of eutectic Sn-3.5Ag solder joints

Stress-relaxation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt.%) joints were carried out at various temperatures after imposing different amounts and rates of simple shear strain. Stress-relaxation parameters were evaluated by subjecting geometrically realistic solder joints with a nominal joint thickness of ∼100 μm and a 1 mm × 1 mm solder-joint area. The peak shear stress during preloading and residual shear stress resulting from stress relaxation were higher at the low-temperature extremes than those at high-temperature extremes. Also, those values increased with increasing simple shear strain and the rate of simple shear strain imposed prior to the stress-relaxation events. The relaxation stress is insensitive to simple shear strain at 150°C, but at lower temperatures, a faster rate of simple shear strain causes a higher relaxed-stress value. The resulting deformation structures observed from the solder-joint side surfaces were also strongly affected by these parameters. At high temperature, grain-boundary sliding effects were commonly observed. At low temperature, intense shear bands dominated, and no grain-boundary sliding effects were observed.     

Mobility of modulation doped AlGaAs/low-temperature MBE-grown GaAs heterostructures

A study of the mobility of a novel modulation doped heterostructure in which the channel region is made of low-temperature molecular beam epitaxially grown GaAs (LT-GaAs) and all other layers are grown at normal temperatures is presented for the first time. The resistivity of the as-grown samples(in- situ annealed) is very high, as is that of single layers of bulk LT-GaAs. However, in the presence of light, the resistivity of the LT-GaAs modulation-doped field effect transistor (MODFET) is significantly lower, facilitating reliable Hall measurements. We speculate that the observed decrease in resistivity of the LT-GaAs MODFET is due to the formation of a two-dimensional electron gas (2DEG) at the heterointerface under illumination. A number of samples grown under different growth conditions were investigated. Mobilities for these samples were found to be in the range of 250 to 750 cm²Vs at 300K and ∼3000 to 5500 cm²Vs at 77K. A first-order computer simulation was implemented to calculate the mobility of the 2DEG using the relaxation-time approximation to solve the Boltzmann equation, taking into account different scattering mechanisms. Scattering by the arsenic clusters and by ionized impurities in the LT-GaAs MODFET channel are found to be the two dominant mechanisms limiting the mobility of the LT-GaAs MODFET samples. Experimental values are in good agreement with theoretical results.     

Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology

Gold nanoparticle inks were investigated as a potential candidate for lead-free packaging applications. Inks consisted of surfactant-passivated nanoparticles dissolved in a solvent. Optimized gold inks are able to sinter at temperatures as low as 120°C and achieve conductivities of up to 70% of bulk. Once sintered, the metallic structure reverts to bulk-like properties and approaches bulk reliability and performance. Thus nanoparticle-based solders would operate at much lower homologous temperatures as compared with alloy-based solders. Nanoparticle inks under investigation were sintered at 180°C. The resulting material exhibited a resistivity of 5 μΩ cm, which is significantly lower than those of Pb-Sn and Sn-Ag-Cu. Electromigration studies were carried out and time to failure was investigated as a function of temperature. Electromigration activation energy was calculated through Black’s equation to be 0.52 eV, which is consistent with surface/grain boundary diffusion. These studies suggest that nanoparticle-ink-based films show excellent robustness, due to their irreversible conversion to bulk-like materials. Nanoparticle inks are thus promising candidates for next-generation lead-free solders.     

Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders

Solder joints used in electronic applications undergo reflow operations. Such operations can affect the solderability, interface intermetallic layer formation and the resultant solder joint microstructure. These in turn can affect the overall mechanical behavior of such joints. In this study the effects of reflow on solderability and mechanical properties were studied. Nanoindentation testing (NIT) was used to obtain mechanical properties from the non-reflow (as-melted) and multiple reflowed solder materials. These studies were carried out with eutectic Sn-3.5Ag solders, with or without mechanically added Cu or Ag reinforcements, using Cu substrates. Microstructural analysis was carried out on solder joints made with the same solders using copper substrate.     

A cross-layer design: energy efficient multilevel dynamic feedback scheduling in wireless sensor networks using deadline aware active time quantum for environmental monitoring

Recently, Packet scheduling plays a vital role in Wireless Sensor Networks (WSNs). The major key challenges include delay, packet dropping, energy consumption and lifetime due to constraints in energy and computing resources. All the research works on packet scheduling scheme in WSN uses only First Come First Served (FCFS) and Dynamic Multilevel Priority (DMP) schemes. FCFS works based on packet arrival time, it leads to starvation and high processing overhead for real-time packets. DMP works in multilevel with dynamic priority reduces the transmission overhead and bandwidth; it consumes more resources for real-time task leads to deadlock. To solve these problems, this work presents Multilevel Dynamic Feedback Scheduling (MDFS) algorithm. The sensor node classifies the emergency and normal data into three different ready queues named as high, medium and low priority, respectively. The queues are connected with a feedback mechanism; each packet from the sensor node has its own time quantum value based on the deadline. The updated time quantum value is compared with the boundary value of the queues, depends on the updated value the data packets are moved between queues with help of feedback mechanism. The simulation result proves that the projected MDFS outperforms in WSN environment.     

Cell‐Tethered Ligands Modulate Bone Remodeling by Osteoblasts and Osteoclasts

The goals of the present study are to establish an in vitro co‐culture model of osteoblast and osteoclast function and to quantify the resulting bone remodeling. The bone is tissue engineered using well‐defined silk protein biomaterials in 2D and 3D formats in combination with human cells. Parathyroid hormone (PTH) and glucose‐dependent insulinotropic peptide (GIP) are selected because of their roles in bone remodeling for expression in tethered format on human mesenchymal stem cells (hMSCs). The cell‐modified biomaterial surfaces are reconstructed from scanning electron microscopy images into 3D models for quantitative measurement of surface characteristics. Increased calcium deposition and surface roughness are found in 3D surface models of silk protein films remodeled by co‐cultures containing tethered PTH, and decreased surface roughness is found for the films remodeled by tethered GIP co‐cultures. Increased surface roughness is not found in monocultures of hMSCs expressing tethered PTH, suggesting that osteoclast‐osteoblast interactions in the presence of PTH signaling are responsible for the increased mineralization. These data point towards the design of in vitro bone models in which osteoblast‐osteoclast interactions are mimicked for a better understanding of bone remodeling.     

Thermomechanical fatigue behavior of Sn-Ag solder joints

Microstructural studies of thermomechanically fatigued actual electronic components consisting of metallized alumina substrate and tinned copper lead, soldered with Sn-Ag or 95.5Ag/4Ag/0.5Cu solder were carried out with an optical microscope and environmental scanning electron microscope (ESEM). Damage characterization was made on samples that underwent 250 and 1000 thermal shock cycles between −40°C and 125°C, with a 20 min hold time at each extreme. Surface roughening and grain boundary cracking were evident even in samples thermally cycled for 250 times. The cracks were found to originate on the free surface of the solder joint. With increased thermal cycles these cracks grew by grain boundary decohesion. The crack that will affect the integrity of the solder joint was found to originate from the free surface of the solder very near the alumina substrate and progress towards and continue along the solder region adjacent to the Ag₃Sn intermetallic layer formed with the metallized alumina substrate. Re-examination of these thermally fatigued samples that were stored at room temperature after ten months revealed the effects of significant residual stress due to such thermal cycles. Such observations include enhanced surface relief effects delineating the grain boundaries and crack growth in regions inside the joint.     

A simple finite-difference frequency-domain (FDFD) algorithm for analysis of switching noise in printed circuit boards and packages

Simultaneous switching noise (SSN) compromises the integrity of the power distribution structure on multilayer printed circuit boards (PCB). Several methods have been used to investigate SSN. These methods ranged from simple lumped circuit models to full-wave (dynamic) three-dimensional Maxwell equations simulators. In this work, we present an efficient and simple finite-difference frequency-domain (FDFD) based algorithm that can simulate, with high accuracy, the capacity of a PCB board to introduce SSN. The FDFD code developed here also allows for simulation of real-world decoupling capacitors that are typically used to mitigate SSN effects at sub 1 GHz frequencies. Furthermore, the algorithm is capable of including lumped circuit elements having user-specified complex impedance. Numerical results are presented for several test boards and packages, with and without decoupling capacitors. Validation of the FDFD code is demonstrated through comparison with other algorithms and laboratory measurements.     

Application of Proteomics in Pancreatic Ductal Adenocarcinoma Biomarker Investigations: A Review

Pancreatic ductal adenocarcinoma (PDAC), a highly aggressive malignancy with a poor prognosis is usually detected at the advanced stage of the disease. The only US Food and Drug Administration-approved biomarker that is available for PDAC, CA 19-9, is most useful in monitoring treatment response among PDAC patients rather than for early detection. Moreover, when CA 19-9 is solely used for diagnostic purposes, it has only a recorded sensitivity of 79% and specificity of 82% in symptomatic individuals. Therefore, there is an urgent need to identify reliable biomarkers for diagnosis (specifically for the early diagnosis), ascertain prognosis as well as to monitor treatment response and tumour recurrence of PDAC. In recent years, proteomic technologies are growing exponentially at an accelerated rate for a wide range of applications in cancer research. In this review, we discussed the current status of biomarker research for PDAC using various proteomic technologies. This review will explore the potential perspective for understanding and identifying the unique alterations in protein expressions that could prove beneficial in discovering new robust biomarkers to detect PDAC at an early stage, ascertain prognosis of patients with the disease in addition to monitoring treatment response and tumour recurrence of patients.