试谈计算机软件测试管理的应用

计算机的软件测试是软件工程构成部分之一,同时软件测试也是检验软件开发人员及软件产品是否合格的重要凭据。就软件测试管理系统活动及应用两个方面的内容进行研究,并对管理工具的存在进行简单的介绍。     

涂料剖析

简要分析了不同涂料体系分析程序,说明了每种涂料剖析体系中应该注意的事项。     

企业各软件的数据共享和整合分析浅谈

本文主要根据大多数企业存在各种软件各自独立运行,各软件之间数据不能相互共享,一些旧软件或不适用的软件与目前主流操作系统不兼容等问题,分析问题并用接口和整合方法解决,此平台利用云计算技术,解决大多数企业建设信息平台投资大的问题,同时方便企业使用和维护.     

Low-Temperature Dielectric Properties of Ceramic Potassium Tantalate (KTaO3)

Dielectric properties of KTaO₃ ceramic fabricated by both conventional sintering and sintering followed by isostatic hot pressing (HIP) were measured at T =4.2 to 300 K over a frequency range from 400 Hz to 4 MHz. The weak field response shows a faint peak near 10 K which has a clear relaxation character, as in high-purity single crystals. The general response is well reproduced by the Barrett function, but additional polarizability with relaxation character is also in evidence at higher temperatures. No dielectric hysteresis was observed at high fields for cycling frequencies down to 0.04 Hz anywhere in the temperature range.     

振动筛板槽中液滴分散动力学的研究(Ⅰ)实验研究及理论分析

本文通过实验观察发现,液滴的破碎只有在液滴与振动筛板孔口发生碰撞时才发生.基于这个实验现象,建立了振动筛板槽内液滴破碎的新模型.把筛板孔口附近的剪应力作为破碎力,破碎速率可表示为:G(d)=C_12Af/H(?)~n_4(d/d_h)~n_5[1-(d_(cr)/d)~(2n_1+1)]~0.5n(d)液滴的凝聚可以按气体分子碰撞过程来处理.凝聚速率可以用下式表示:ω(d_1,d_2)=C_Ⅱ(d_1+d_2)~(7/3)∈~（1/3)[β_d∈~(2/3)d_1+d_2/σ(d_1+d_2）~（1/3）]~n_6n(d_1)n(d_2)     

辣椒疫病菌对氟吗啉的抗药性研究

为了评估氟吗啉的未来抗性风险，以辣椒疫病菌为靶标，通过室内抗性菌株的驯化、筛选，以及紫外线诱变等方法，初步探索了辣椒疫病菌对氟吗啉的抗性情况。结果表明：抗性菌株对氟吗啉的抗性倍数较低，在3.45～11．33，生长速率明显低于野生敏感菌株。由此可见辣椒疫病菌对氟吗啉的抗性风险可能较低。     

纳米稀土复合固体超强酸催化合成乙酸苄酯

采用共沉淀法制备了纳米稀土复合固体超强酸SO4^2-／ZrO2-2％Nd2O3催化剂，电镜分析表明，催化剂颗粒直径在25nm左右，比表面积测定：71．03m^2／g。酸强度-12．70〈Ho〈-11．99。并对合成乙酸苄酯的最佳反应条件进行了研究。研究表明：当苯甲醇与乙酸的物质的量比为1：2，反应时间为5h，反应温度为120℃，催化剂用量为6％苯甲醇的质量时，酯化率可达92．04％。研究发现，该催化剂可重复使用并可活化再生。     

金纳米线拉伸行为的分子动力学模拟

采用分子动力学方法模拟了不同截面尺寸金纳米线的拉伸力学行为。计算结果表明:相同长度的金纳米线弹性模量随着截面尺寸的减小而减小,而其屈服强度随着截面尺寸的减小而增大,并且发生屈服推迟现象。应力—应变曲线与形变过程相对应。在弹性变形阶段,纳米线形变不显著;随着应变量的增加,发现纳米线出现大量堆垛层错。     

Analysis of junction temperatures in high-power GaN-based LEDs

We presented the analysis of the incomplete conduction in bonding medium in high power GaN-based light-emitting diode (LED) packages. A numerical study was carried out with parametric model to understand the junction temperature variation due to bonding medium defects. Transient thermal measurement was performed to evaluate LED’s junction temperature. Thermal resistance from chip to lead frame was 20 K/W in our sample LED. It was suggested that only 60% of the surface area of the bonding medium was involved...     

Influence of Zn ion implantation on structures and field emission properties of multi-walled carbon nanotube arrays

The structures and field emission properties of multi-walled carbon nanotube arrays implanted with Zn+ by MEVVA ion implanter have been investigated.The results revealed that Zn+implantation induced structural damage and that the top of carbon nanotubes with multi-layered graphite structure were transformed into carbon nanowires with amorphous structure.Meanwhile,C:Zn solid solution was synthesized after Zn+ implantation.The turn-on field and threshold field were 0.80 and 1.31 V/μm,respectively for original...