地震勘探测量数据处理的全面解决方案

本文针对近年来地震勘探技术的发展对测量工作提出的新要求，分析了SSOffiee软件解决问题的方案和技术特色，最后提出了SSOffice软件的发展方向。     

MPTA型原油脱金属剂的工业应用

在对高金属含量原油进行初步评价的基础上，利用SH—Ⅰ型电脱盐试验仪对自主开发的MPTA型原油脱金属剂进行了原油脱金属的实验室研究。结果表明，当MPTA型脱金属剂加入量为250μg／g时，钙的脱除率可达97．4％，并且对其它金属元素，如镍、铁、钠、锰、铝和钒也有明显的脱除效果。该剂在山东恒源石油化工股份有限公司重交沥青车间500kt／a的电脱盐装置上进行原油脱金属工业试验的结果表明，经过二级电脱盐处理后，钙的脱除率达到99．1％，钠的脱除率为94．6％，铁的脱除率为82．9％，并可在一定程度上降低原油中镍和铜的含量。使用MPTA型原油脱金属剂显著降低了一、二级电脱盐装置的电场电流，有利于炼油厂的节能降耗。     

Ad Hoc与无线网络的扩展性研究

Ad Hoc作为无线网络的具有高抗毁性和灵活性的扩展网络,日益引人关注。本文首先从环绕网的理念入手,介绍Ad Hoc作为现有无线网络扩展的意义和优势,然后重点分析并提出融合策略以及需要思考的问题。     

城域光网建设的若干技术分析

阐述目前国内常见的建设城域网的技术并深入分析比较几种技术的优势和劣势 ,并就CWDM技术的发展和应用方案实例作了简要描述     

全球3G市场管制政策分析

主要对各国3G许可证与使用技术标准的抽绑政策．各国对2G／3G网络漫游的管制规定。以及3G网络之间共享的种类及实施方式等方面做了详尽的讲解，并进行比较和分析。     

Studies on high density polyethylene (HDPE) functionalized by ultraviolet irradiation and its application

The structure and properties of high density polyethylene (HDPE) functionalized by ultraviolet irradiation at different light intensities in air were studied by electron analysis, FTIR spectroscopy, contact angle with water, differential scanning calorimetry and mechanical properties measurement. The results show that oxygen‐containing groups such as C?O, C—O and C(?O)O were introduced onto the molecular chain of HDPE following irradiation, and the rate and efficiency of HDPE functionalization increased with enhancement of irradiation intensity. After irradiation, the melting temperature, contact angle with water and notched impact strength of HDPE decreased, the degree of crystallinity increased, and their variation amplitude increased with irradiation intensity. Compared with HDPE, the yield strength of HDPE irradiated at lower light intensity (32 W m^?2 and 45 W m^?2) increases monotonically with irradiation time, and the yield strength of HDPE irradiated at higher light intensity (78 W m^?2) increases up to 48 h and then decreased with further increase in irradiation time. The irradiated HDPE behaved as a compatibilizer in HDPE/polycarbonate (PC) blends, and the interface bonding between HDPE and PC was ameliorated. After adding 20 wt% HDPE irradiated at 78 W m^?2 irradiation intensity for 24 h to HDPE/PC blends, the tensile yield strength and notched Izod impact strength of the blend were increased from 26.3 MPa and 51 J m^?1 to 30.2 MPa and 158 J m^?1, respectively. Copyright © 2003 Society of Chemical Industry     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

连续油管技术与装备发展综述

自世界上第一台连续油管作业机问世至今,连续油管作业技术与装备已经过了40多年的发展历程,以其占地面积小、作业成本低、搬迁安装方便、保护油层、增加油井产量和使用范围广等诸多不可比拟的优势,得到迅速发展,并广泛应用于钻井、完井、试油、采油、修井和集输等各个作业领域。实践表明,连续油管作业技术与装备是一项具有巨大潜力和生命力的实用性技术。目前,该项技术的应用日趋活跃,备受关注。在总结连续油管作业技术与装备的发展现状和展示其发展趋势的基础上,客观地分析了国内连续油管技术与装备的应用与研究现状,提出相应的发展对策。     

基于USB总线的虚拟频谱分析仪设计

文章详细介绍了基于USB总线的虚拟频谱分析仪的设计过程。该仪器使用嵌入式混合处理器MC56F8323来实现动态信号的实时采集、频谱分析和数字滤波等功能。处理结果由USB2．0接口芯片CY7C68013上传至PC机．以完成数据显示、存储、绘制图形等功能。其中，CY7C68013工作于Slave FIFO模式，以实现与MC56F8323间的数据传输。该系统可同时对两路动态信号进行实时谱分析，每路采样频率高选500kHz。