弹性杆与水下壳体接触冲击的冲击力计算研究

对弹性杆与水下壳体接触冲击问题进行了研究，用有限元法模拟壳体，边界无法模拟无限域流体，通过温面上的耦合条件进行联立求解，文中给出了典型算例，并进行了有关讨论。     

A generalized suboptimum unequally spaced channel allocationtechnique. I. In IM/DD WDM systems

Four-wave mixing (FWM) is the most serious fiber nonlinearity associated with low-input optical power levels in long-haul multichannel optical systems employing dispersion-shifted fiber. To reduce the crosstalk due to FWM, a generalized suboptimum unequally spaced channel allocation (S-USCA) technique is proposed and investigated. Even though the developed technique is useful in combating FWM crosstalk in wavelength division multiplexing (WDM) lightwave systems with up to 12 channels, its main virtue is in designing multichannel WDM lightwave systems with more than 12 channels. Comparisons of power penalty due to FWM between equal channel spacing (ECS) systems and the S-USCA systems are presented. It is shown that for an intensity modulation/direct detection (IM/DD) transmission system operating in an optical bandwidth of 16 nm with 0 dBm (1 mW) peak optical input power per channel, while a conventional ECS WDM system with 0.84-nm channel spacing cannot even achieve a bit-error rate (BER)=10^-9, the suboptimum technique developed in this paper, for the same minimum channel spacing, can achieve a BER=10^-9 with an FWM crosstalk power of less than 1 dB at the worst channel in a 20-channel WDM system     

β-Si3N4Whiskers Embedded in Oxynitride Glasses: Interfacial Microstructure

Interfacial microstructures in βP-Si₃N₄( w )-Si-Al-Y-O-N-glass systems were investigated by systematically varying the nitrogen content and the Al:Y ratio of the glass matrix. High-resolution and analytical transmission electron microscopy (HREM and AEM) studies revealed that the interfacial microstructure is a function of the glass composition. No interfacial phases were formed in glasses with low Al:Y ratios and in glasses with high Al:Y ratios and low nitrogen content, whereas epitaxial growth of an interfacial layer (100–200 μm thick) on the βP-Si₃N₄( w ) occurred in a glass matrix with high Al:Y ratio and high nitrogen content. The interfacial layer was identified to be a β'-SiAION phase. Interfaces containing the SiAION layer exhibited high debonding energy compared to Si₃N₄( w )–glass interfaces. HREM studies indicated that the lattice-mismatch strain in the SiAION layer was relieved by dislocation formation at the SiAION–Si₃N₄( w ) interface. The difference in interfacial debonding energy was, hence, attributed to the local atomic structure and bonding between the glass-β-Si₃N₄ and the glass–β'-SiAION phases. This observation was clear evidence of the strong influence of glass chemistry on the interfacial debonding behavior by altering the interfacial microstructure.     

An experimental study on the pumping performance of molecular drag pumps

The pumping performance of molecular drag pumps (MDP) has been investigated experimentally. The experimented MDPs are a disk-type drag pump (DTDP), helical-type drag pump (HTDP) and compound drag pump (CDP), respectively. In the case of the DTDP, spiral channels of a rotor are cut on both upper surface and lower surface of a rotating disk, and the corresponding stator is a planar disk. In the case of the HTDP, the rotor has six rectangular grooves. The CDP consists with the DTDP, at lower part, and with the HTDP, at upper part. The experiments are performed in the outlet pressure range of 0.2–533 Pa. The inlet pressure and compression ratio are measured under the various conditions of outlet pressure and throughputs, and nitrogen is used for the test gas. At the outlet pressure of 0.2 Pa, the ultimate pressure has been reached to 1.0 × 10⁻² Pa for the HTDP, 1.3 × 10⁻⁴ Pa for the DTDP, and 3.6 × 10⁻⁵ Pa for the CDP. The maximum compression ratio of the CDP is much higher than those of the DTDP or HTDP. Consequently, the ultimate pressure of the CDP is the lowest one.     

A precision on-line model for the prediction of roll force and roll power in hot-strip rolling

Investigated via a series of finite-element (FE) process simulations is the effect of diverse process variables on some selected nondimensional parameters characterizing the thermomechanical behavior of the strip in hot-strip rolling. Then, on the basis of these parameters an on-line model is derived for the precise prediction of roll force and roll power. The prediction accuracy of the proposed model is examined through comparison with predictions from a FE process model and also with measurements.     

Planar-shape prototype generation using a tree-based random greedy algorithm.

A prototype is representative of a set of similar objects. This paper proposes an approach that formulates the problem of prototype generation as finding the mean from a given set of objects, where the prototype solution must satisfy certain constraints. These constraints describe the important perceptual features of the sample shapes that the proposed prototype must retain. The contour prototype generated from a set of planar objects was used as an example of the approach, and the corners were used as the perceptual features to be preserved in the proposed prototype shape. However, finding a prototype solution for more than two contours is computationally intractable. A tree-based approach is therefore proposed in which an efficient greedy random algorithm is used to obtain a good approximation of the proposed prototype and analyze the expected complexity of the algorithm. The proposed prototype-generation process for hand-drawn patterns is described and discussed in this paper.     

Chemical vapor deposition of amorphous ruthenium-phosphorus alloy films

Chemical vapor deposition growth of amorphous ruthenium-phosphorus films on SiO₂ containing ∼ 15% phosphorus is reported. cis-Ruthenium(II)dihydridotetrakis-(trimethylphosphine), cis-RuH₂(PMe₃)₄ (Me = CH₃) was used at growth temperatures ranging from 525 to 575 K. Both Ru and P are zero-valent. The films are metastable, becoming increasingly more polycrystalline upon annealing to 775 and 975 K. Surface studies illustrate that demethylation is quite efficient near 560 K. Precursor adsorption at 135 K or 210 K and heating reveal the precursor undergoes a complex decomposition process in which the hydride and trimethylphosphine ligands are lost at temperatures as low at 280 K. Phosphorus and its manner of incorporation appear responsible for the amorphous-like character. Molecular dynamics simulations are presented to suggest the local structure in the films and the causes for phosphorus stabilizing the amorphous phase.     

VLSI architectural design tradeoffs for sliding-window log-MAP decoders

Turbo codes have received tremendous attention and have commenced their practical applications due to their excellent error-correcting capability. Investigation of efficient iterative decoder realizations is of particular interest because the underlying soft-input soft-output decoding algorithms usually lead to highly complicated implementation. This paper describes the architectural design and analysis of sliding-window (SW) Log-MAP decoders in terms of a set of predetermined parameters. The derived mathematical representations can be applied to construct a variety of VLSI architectures for different applications. Based on our development, a SW-Log-MAP decoder complying with the specification of third-generation mobile radio systems is realized to demonstrate the performance tradeoffs among latency, average decoding rate, area/computation complexity, and memory power consumption. This paper thus provides useful and general information on practical implementation of SW-Log-MAP decoders.     

Study of warpage due to P-V-T-C relation of EMC in IC packaging

There were many studies about the prediction of warpage due to thermal mismatch , . However, cure induced warpage is usually ignored and the results can be inaccurate. To minimize this problem, a thorough understanding of epoxy molding compound (EMC) with pressure-volume-temperature-cure (P-V-T-C) relation is necessary. This paper used the P-V-T-C relation of an encapsulation material to formulate the stress-strain relationship. With the help of finite element method (FEM) and mold flow analysis, warpage predictions combined with P-V-T-C relation were performed and the results show that this approach is practical. For a given P-V-T-C relation, the shrinkage direction is pointing toward the gate and maximum warpage usually occurs at the boundary of an integrated circuit (IC) package. Variation of specific volume difference along the flow direction is larger than that perpendicular to the flow direction. When temperature difference is small in thickness direction, specific volume difference in thickness direction varies only slightly.