Conception of Stretchable Resistive Memory Devices Based on Nanostructure‐Controlled Carbohydrate‐block‐Polyisoprene Block Copolymers

It is discovered that the memory‐type behaviors of novel carbohydrate‐block ‐polyisoprene (MH‐b ‐PI) block copolymers‐based devices, including write‐once‐read‐many‐times, Flash, and dynamic‐random‐access‐memory, can be easily controlled by the self‐assembly nanostructures (vertical cylinder, horizontal cylinder, and order‐packed sphere), in which the MH and PI blocks, respectively, provide the charge‐trapping and stretchable function. With increasing the flexible PI block length, the stretchability of the designed copolymers can be significantly improved up to 100% without forming cracks. Thus, intrinsically stretchable resistive memory devices (polydimethylsiloxane(PDMS)/carbon nanotubes(CNTs)/MH‐b ‐PI thin film/Al) using the MH‐b ‐PI thin film as an active layer is successfully fabricated and that using the MH‐b ‐PI_12.6k under 100% strain exhibits an excellent ON/OFF current ratio of over 10⁶ (reading at ?1 V) with stable V _set around ?2 V. Furthermore, the endurance characteristics can be maintained over 500 cycles upon 40% strain. This work establishes and represents a novel avenue for the design of green carbohydrate‐derived and stretchable memory materials.     

6‐Mercaptopurine‐Induced Fluorescence Quenching of Monolayer MoS2 Nanodots: Applications to Glutathione Sensing,Cellular Imaging,and Glutathione‐Stimulated Drug Delivery

Molybdenum disulfide (MoS₂) nanodots (NDs) with sulfur vacancies have been demonstrated to be suitable to conjugate thiolated molecules. However, thiol‐induced fluorescence quenching of MoS₂ NDs has been rarely explored. In this study, 6‐mercaptopurine (6‐MP) serves as an efficient quencher for the fluorescence of monolayer MoS₂ (M‐MoS₂) NDs. 6‐MP molecules are chemically adsorbed at the sulfur vacancy sites of the M‐MoS₂ NDs. The formed complexes trigger the efficient fluorescence quenching of the M‐MoS₂ NDs due to acceptor‐excited photoinduced electron transfer. The presence of glutathione (GSH) efficiently triggers the release of 6‐MP from the M‐MoS₂ NDs, thereby switching on the fluorescence of the M‐MoS₂ NDs. Thus, the 6‐MP‐M‐MoS₂ NDs are implemented as a platform for the sensitive and selective detection of GSH in erythrocytes and live cells. Additionally, thiolated doxorubicin (DOX‐SH)‐loaded M‐MoS₂ NDs (DOX‐SH/M‐MoS₂ NDs) serve as GSH‐responsive nanocarriers for DOX‐SH delivery. In vitro studies reveal that the DOX‐SH/M‐MoS₂ NDs exhibit efficient uptake by HeLa cells and greater cytotoxicity than free DOX‐SH and DOX. In vivo study shows that GSH is capable of triggering the release of DOX‐SH from M‐MoS₂ ND‐based nanomaterials in mice. It is revealed that the DOX‐SH/M‐MoS₂ NDs can be implemented for simultaneous drug delivery and fluorescence imaging.     

Nanostructure effect of V2O5 buffer layer on performance of polymer-fullerene devices

Nanostructure of solar cell materials is often essential for the device performance. V₂O₅ nanobelt structure is synthesized with a solution process and further used as an anode buffer layer in polymer solar cells, resulting insignificantly improved power conversion efficiency (PCE of 2.71%) much higher than that of devices without the buffer layer (PCE of 0.14%) or with V₂O₅ powder as the buffer layer (1.08%). X-ray diffraction (XRD) results indicate that the V₂O₅ nanobelt structure has better phase separation while providing higher surface area for the P3HT:PCBM active layer to enhance photocurrent. The measured impedance spectrums show that the V₂O₅ nanobelt structure has faster charge transport than the powder material. This work clearly demonstrates that V₂O₅ nanobelt has great potential as a substitute of the conventionally used PEDOT-PSS buffer layer for high performance devices.     

Fabrication of organic semiconductor crystalline thin films and crystals from solution by confined crystallization

Highly crystalline thin films of organic semiconductors processed from solution for electronic devices are difficult to achieve due to a slow and preferential three-dimensional growth of the crystals. Here we describe the development of a processing technique to induce a preferential two-dimensional crystalline growth of organic semiconductors by means of minimizing one dimension and confining the solution in two dimensions into a thin layer. The versatility of the process is demonstrated by processing small molecules (TIPS-pentacene and C₆₀) and a polymer (P3HT), all from solvents with a relatively low boiling point, to obtain crystalline thin films. The thin films show an improved in-plane packing of the molecules compared to films processed under similar conditions by spin coating, which is beneficial for the use in organic field-effect transistors.     

热蒸发紫外LaF3薄膜光学常数的表征

薄膜光学常数的精确测定对于设计和制备多层薄膜具有重要意义。在JGS1型熔融石英基底上,采用热蒸发沉积方法制备了不同厚度的LaF3单层薄膜样品,利用光度法来获取弱吸收薄膜和基底的光学常数,计算得到其在185～450nm范围内折射率n和消光系数k的色散曲线。实验结果表明,当膜层厚度较薄时,LaF3薄膜折射率表现出不均匀性现象。随着薄膜厚度的增加,薄膜折射率不均匀性减小。在求解过程中选用不均匀模型后,拟合结果与实际测试光谱曲线吻合得很好,提高了薄膜光学常数的计算精度。     

步进调频宽带雷达距离扩展目标频域检测算法

论文研究高斯杂波背景下步进调频宽带雷达的距离扩展目标检测问题。根据步进调频宽带雷达目标高分辨距离像的特点,提出一种基于回波功率谱的距离扩展目标频域检测算法。该算法无需对目标抽取形成1维距离像,直接利用目标高分辨距离像功率谱与杂波功率谱的差异,在频域实现了距离扩展目标回波能量的积累。推导了算法的检验统计量,给出了虚警概率的表达式。最后通过Monte-Carlo仿真验证了算法的检测性能。仿真结果表明该文的目标检测算法较目标抽取后的检测算法在检测性能上有明显提高,同时其检测性能也优于同条件下基于视频积累的距离扩展目标检测算法,并且具有良好的鲁棒性和工程可实现性。     

Fast handoff with reducing waste rate approach for wireless resources management in UMTS mobile networks

3G Wideband CDMA systems adopt the Orthogonal Variable Spreading Factor code tree as the channelization codes management for achieving high data rate transmission in personal multimedia communications. It assigns a single channelization code for each accepted connection. Nevertheless, it wastes the system capacity when the required rate is not powers of two of the basic rate. One good solution is to assign multiple codes for each accepted connection but it causes two inevitable drawbacks: long handoff delay and new call setup delay due to high complexity of processing with multiple channelization codes, and high cost of using more number of rake combiners. Especially, long handoff delay may result in more call dropping probability and higher Grade of Service, which will degrade significantly the utilization and revenue of the 3G cellular systems. Therefore, we propose herein an adaptive efficient codes determination algorithm based on the Markov Decision Process analysis approach to reduce the waste rate and reassignments significantly while providing fast handoff. Numerical results demonstrate that the proposed approach yields several advantages, including the lowest GOS, the least waste rate, and the least number of reassignments. Meanwhile, the optimal number of rake combiners is also analyzed in this paper. This research was supported in part by the National Science Council of Taiwan, ROC, under contract NSC-93-2213-E-324-018.     

The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder

The formation of Ag₃Sn plates in the Sn-Ag-Cu lead-free solder joints for two different Ag content solder balls was investigated in wafer level chip scale packages (WLCSPs). After an appropriate surface mount technology reflow process on a printed circuit board, samples were subjected to 150°C high-temperature storage (HTS), 1,000 h aging, or 1,000 cycles thermal cycling test (TCT). Sequentially, the cross-sectional analysis was scrutinized using a scanning electron microscope/energy dispersive spectrometer (SEM/EDX) to observe the metallurgical evolution of the amount of the Ag₃Sn plates at the interface and the solder bulk itself. Pull and shear tests were also performed on samples. It was found that the interfacial intermetallic compound (IMC) thickness, the overall IMC area, and the numbers of Ag₃Sn plates increase with increasing HTS and TCT cycles. The amount of large Ag₃Sn plates found in the Sn-4.0Ag-0.5 Cu solder balls is much greater than that found in the Sn-2.6Ag-0.5Cu solder balls; however, no significant difference was found in the joint strength between two different Ag content solder joints.