Quantization effects in digitally behaving circuit implementationsof Kohonen networks

Implementing a neural network on a digital or mixed analog and digital chip yields the quantization of the synaptic weights dynamics. This paper addresses this topic in the case of Kohonen's self-organizing maps. We first study qualitatively how the quantization affects the convergence and the properties, and deduce from this analysis the way to choose the parameters of the network (adaptation gain and neighborhood). We show that a spatially decreasing neighborhood function is far more preferable than the usually rectangular neighborhood function, because of the weight quantization. Based on these results, an analog nonlinear network, integrated in a standard CMOS technology, and implementing this spatially decreasing neighborhood function is then presented. It can be used in a mixed analog and digital circuit implementation.     

E-kernel: an embedding kernel on the IBM victor V256 multiprocessorfor program mapping and network reconfiguration

We present the design of E-kernel, an embedding kernel on the Victor V256 message-passing partitionable multiprocessor, developed for the support of program mapping and network reconfiguration. E-kernel supports the embedding of a new network topology onto Victor's 2D mesh and also the embedding of a task graph onto the 2D mesh network or the reconfigured network. In the current implementation, the reconfigured network can be a line or an even-size ring, and the task graphs meshes or tori of a variety of dimensions and shapes or graphs with similar topologies. For application programs having these task graph topologies and that are designed according to the communication model of E-kernel, they can be run without any change on partitions connected by the 2D mesh, line, or ring. Further, E-kernel attempts the communication optimization of these programs on the different networks automatically, thus making both the network topology and the communication optimization attempt completely transparent to the application programs. Many of the embeddings used in E-kernel are optimal or asymptotically optimal (with respect to minimum dilation cost). The implementation of E-kernel translated some of the many theoretical results in graph embeddings into practical tools for program mapping and network reconfiguration in a parallel system. E-kernel is functional on Victor V256. Measurements of E-kernel's performance on V256 are also included     

Insertional re-activation of a chloramphenicol acetyltransferase misfolding mutant protein

The deletion of nine residues from the C-terminus of the bacterialchloramphenicol acetyltransferase (CAT) results in depositionof the mutant protein in cytoplasmic inclusion bodies and lossof chloramphenicol resistance in Escherichia coli. This foldingdefect is relieved by C-terminal fusion of the polypeptide withas few as two residues. Based on these observations, efficientpositive selection for the cloning of DNA fragments has beendemonstrated. The cloning vector encodes a C-terminally truncatedCAT protein. Restriction sites in front of the stop codon allowthe insertion of target DNA, resulting in the production ofproperly folded CAT fusion proteins and regained chloramphenicolresistance. The positive selection of recombinants is accomplishedby growth of transformants on chloramphenicol-containing agarplates. The method appears particularly convenient for the cloningof DNA fragments amplified by the PCR because minimal informationto restore CAT folding can be included in the primers. The cloningof random sequences shows that the folding defect can be relievedby fusion to a wide variety of peptides, providing great flexibilityto the positive selection system. This vector may also contributeto the determination of the role of the C-terminus in CAT folding.     

Modeling of Diffusion in Capillary Porous Materials During the Drying Process

This paper presents a model of heterogenous diffusion in capillary porous materials during the process of drying. The governing heat and mass transfer equations have been established using the liquid as well as vapor flow. Two models have been presented. Model 1 does not consider the heat conduction while the model 2 has been established by considering the conduction. The developed models and the numerical solutions of the resulting differential equations can take into account the moisture and temperature dependent thermophysical properties of the product. All equations have been established in spherical coordinates but the programme written for the purpose of calculations can be used for other geometries also. Numerical calculations have been performed for gas concrete and tiles using model 1, while model 2 has been used for gas concrete only because of the lack of data for thermophysical properties of the tile. For gas concrete it was seen that conduction has only marginal effect on the drying process and the numerical predictions of the drying process were reasonably accurate.     

Study of photosensitive mixtures of TMAE and helium, hydrocarbon or CF4-based carrier gases

Among the photocathodes used for particle identification based on the Cherenkov Ring Imaging technique, the TMAE molecule is still the best in terms of quantum efficiency. Despite the fact that TMAE gaseous photocathodes have already been used in a number of large experiments, one still seeks answers to many detailed questions. We present a systematic study of gaseous photocathodes based on TMAE mixed with helium, hydrocarbon and CF₄-based gases at normal pressure. The study includes a measurement of the electron drift velocity, gas quenching properties, single electron pulse height spectra and anode wire aging. The paper makes recommendations for carrier gas mixtures to obtain the best quenching, and suggests how to manage TMAE wire aging. This study was motivated by a specific particle identification detector proposal, the Fast Drift CRID proposed for the B-factory at SLAC.     

Trends in low-cost, high-performance substrate technology

The trends in high density interconnection (HDI) multichip module (MCM) techniques that have the potential to reduce interconnection cost and production time are described. The implementation in laminated dielectric (MCM-L) technology of a workstation processor core illustrates current substrate technology capabilities. The design, routing, layout and thermal management of the processor core are described. Thin-film deposited dielectric (MCM-D) technology is discussed as a cost-effective method for future interconnection applications