Transmission capacity of optical path overhead transfer schemeusing pilot tone for optical path network

Photonic networks based on the optical path concept and wavelength division multiplexing (WDM) technology require unique operation, administration, and maintenance (OAM) functions. In order to realize the required OAM functions, the optical path network must support an effective management information transfer method. The method that superimposes a pilot tone on the optical signal appears very interesting for optical path overhead transfer. The pilot tone transmission capacity is determined by the carrier to noise ratio which depends on the power spectral density of the optical signal. The pilot tone transmission capacity of an optical path network employing WDM technology is elucidated; 4.5 kb/s transmission can be realized when the pilot tone modulation index is set at 3%     

E-kernel: an embedding kernel on the IBM victor V256 multiprocessorfor program mapping and network reconfiguration

We present the design of E-kernel, an embedding kernel on the Victor V256 message-passing partitionable multiprocessor, developed for the support of program mapping and network reconfiguration. E-kernel supports the embedding of a new network topology onto Victor's 2D mesh and also the embedding of a task graph onto the 2D mesh network or the reconfigured network. In the current implementation, the reconfigured network can be a line or an even-size ring, and the task graphs meshes or tori of a variety of dimensions and shapes or graphs with similar topologies. For application programs having these task graph topologies and that are designed according to the communication model of E-kernel, they can be run without any change on partitions connected by the 2D mesh, line, or ring. Further, E-kernel attempts the communication optimization of these programs on the different networks automatically, thus making both the network topology and the communication optimization attempt completely transparent to the application programs. Many of the embeddings used in E-kernel are optimal or asymptotically optimal (with respect to minimum dilation cost). The implementation of E-kernel translated some of the many theoretical results in graph embeddings into practical tools for program mapping and network reconfiguration in a parallel system. E-kernel is functional on Victor V256. Measurements of E-kernel's performance on V256 are also included     

Effect of Freezer Programs on Real-Time Storage Results of Dissolution Profiles

Carstensen and Rhodes¹ have suggested that when, in stability programs, assays cannot be performed immediately after the protocol-designated storage time, then freezing them until such a time when assays can be performed would be a reasonable manner to retain the protocol schedule. They caution, however, that such a procedure may not be valid for dissolution data. The article to follow deals with real-time data showing that such a process is feasible for Nalidixic Acid tablets (and presumably for other tablets as well), and that, furthermore, the dissolution pattern would seem to be “frozen” as well.     

A 3-D motion tracing system in High School Physics teaching

Abstract This article presents a study of a large scale incorporation of one data acquisitionsystem into physics teaching in Israel. By 1994 about 30% of the schools throughout the country used the V-scope, a 3-D multibody motion tracing system, in their lab programme. The views and reactions of post-training teachers, experienced teachers and students on various aspects of using the system are described, analysed and compared.     

Trends in low-cost, high-performance substrate technology

The trends in high density interconnection (HDI) multichip module (MCM) techniques that have the potential to reduce interconnection cost and production time are described. The implementation in laminated dielectric (MCM-L) technology of a workstation processor core illustrates current substrate technology capabilities. The design, routing, layout and thermal management of the processor core are described. Thin-film deposited dielectric (MCM-D) technology is discussed as a cost-effective method for future interconnection applications