A transconductance spectroscopy approach to device level surfacestate characterization

A device level transconductance spectroscopy approach is developed for characterizing surface states in metal-semiconductor field-effect transistors. A comparison of the theoretical results and the available experimental observations shows that the model can successfully explain both the surface leakage current dependence of transconductance dispersion magnitude reported by M. Ozeki et al. (1982) and the temperature dependence of transconductance dispersion observed by S.R. Blight et al. (1986)     

Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection

Chip-on-glass (COG) interconnection using anisotropic conductive film (ACF) is susceptible to open failures. Open failures can be induced by the absence of conductive particles or an insufficient contact. Experimental results as well as statistical approaches were used to understand the conditions for open failures in COG bonding. The binomial distribution was used to predict the probability of the open failure due to the deficiency of conductive particles. The probability of an open failure decreased with increasing bump area and decreasing particle size. The bump height variation was also an important factor that affected the probability of the open failure together with the bump-to-electrode gap and the particle size. The variation in bump height should be minimized to avoid open failures in fine-pitch applications where a smaller particle size is required.     

Device and circuit level suppression techniques for random-dopant-induced static noise margin fluctuation in 16-nm-gate SRAM cell

In this study, a three-dimensional “atomistic” coupled device-circuit simulation is performed to explore the impact of process-variation-effect (PVE) and random-dopant-fluctuation (RDF) on static noise margin (SNM) of 16-nm complementary metal-oxide-semiconductor (CMOS) static random access memory (SRAM) cells. Fluctuation suppression approaches, based on circuit and device viewpoints, are further implemented to examine the associated characteristics in 16-nm-gate SRAM cells. From the circuit viewpoint, the SNM of 8T planar SRAM is enlarged to 230 mV and the variation of SNM (σ_SNM) is reduced to 22 mV at a cost of 30% extra chip area. As for device level improvement, silicon-on-insulator (SOI) FinFETs replaced the planar MOSFETs in 6T SRAM is further examined. The SNM of 6T SOI FinFETs SRAM is 125 mV and the σ_SNM is suppressed significantly to 5.4 mV. However, development of fabrication process for SOI FinFET SRAM is crucial for sub-22 nm technology era.     

3D Localization for Launch Vehicle Using Virtual TOA and AOA of Ground Stations

Wireless Personal Communications - Generally, a ground telemetry station for a launch vehicle (LV) includes a tracking function only; therefore, position measurements for LV depend on received...     

A new MMIC broadside coupler using an array of air-bridges for directivity enhancement

A new quadrature broadside coupler is proposed, which employs an array of air-bridges to enhance directivity via its phase-equalization effect on the c-mode and /spl pi/-modes. The realization of air-bridges follows a standard MMIC fabrication process. An experimental chip fabricated on the 75-/spl mu/m GaAs substrate verifies the air-bridge effect and shows wideband characteristics of the coupling of 3.2/spl plusmn/0.4 dB, the insertion loss of 3.9/spl plusmn/0.4 dB, the output phase deviation from quadrature less than 6/spl deg/, and the isolation greater than 18 dB from 20 to 40 GHz.     

Bendable and Splitter-Integrated Optical Subassembly Based on a Flexible Optical Board

A bendable and splitter-integrated optical subassembly (OSA) is suggested as a short-distance board-to-board optical interconnection. This OSA was fabricated by simply packaging a vertical-cavity surface-emitting laser on a flexible optical board having an embedded 1 $times$ 8 optical splitter waveguide. Finally, we measured various optical characteristics of the OSA, including insertion, twist, and bending losses.      

Virus‐Tethered Magnetic Gold Microspheres with Biomimetic Architectures for Enhanced Immunoassays

In immunoassays, non‐specific bindings to biosensing surfaces can be effectively prevented by formation of biocompatible and hydrophilic self‐assembled monolayer (SAM) on the surfaces. A thin gold (Au) layer on magnetic microspheres, 15 μm in diameter, enables facile SAM formation and thereby accepts second layer of filamentous virus scaffolds for the immobilization of functional proteins. The merger of the virus and SAM‐Au protected microspheres not only provides exceptionlly dense antibody loading, but also resembles biological cellular structures that enhance ligand‐receptor interactions. Site‐specific biotinylation of filamenous viruses allows formation of free‐standing virus threads (>1.0 × 10¹⁰) on streptavidin‐modified SAM‐Au microspheres. The augmented yield of antibody loading, due to the increased surface to volume ratio, on virus‐modified Au microspheres is confirmed by measuring fluorescence intensities. The bead‐based immunoassays for the detection of cardiac marker proteins exhibit increased sensitivity of virus‐Au microspheres, as low as 20 pg mL^?1 of cardiac troponin I in serum, and extremely low non‐specific adsorption when compared with bare polymer beads. This increased sensitivity due to filamentous morphology and SAM‐Au layer demonstrates the feasibility of merging viruses with non‐biological materials to yield biomimetic tools for the enhanced bead‐based immunoassays.     

Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array

We propose an advanced structure of optical subassembly (OSA) for packaging of the vertical-cavity surface-emitting laser (VCSEL) array, using (111) facet mirror of the V-groove ends formed in a silicon optical bench (SiOB) and angled fiber apertures. The feature of our OSA can provide a low optical crosstalk between neighboring channels, a low feedback reflection, and a large misalignment tolerance along the V-groove. We describe the optimized design of fiber angle, VCSEL position, and fiber position. The fabricated OSA structure consists of 12 channels of angled fiber array, 54.7/spl deg/ V-grooves, Au-coated mirrors on (111) end facet of the V-grooves, and flip-chip-bonded VCSEL array on a SiOB. In this structure, the beam emitted from the VCSEL is deflected at the 54.7/spl deg/ mirror of (111) end facet and propagated into the angled fiber. The angled fiber array was polished by 57/spl deg/. Fabricated OSAs showed a coupling efficiency of 30%-50% that is 25 times larger than that obtained from an OSA with a vertically flat fiber array. Our OSA showed large misalignment tolerance of about 90 /spl mu/m along the longitudinal direction in the V-groove. We fabricated a parallel optical transmitter module using the OSA and demonstrated 12 channels /spl times/2.5 Gb/s data transmission with a clear eye diagram.     

Unified VLSI systolic array design for LZ data compression

Hardware implementation of data compression algorithms is receiving increasing attention due to exponentially expanding network traffic and digital data storage usage. In this paper, we propose several serial one-dimensional and parallel two-dimensional systolic-arrays for Lempel-Ziv data compression. A VLSI chip implementing our optimal linear array is fabricated and tested. The proposed array architecture is scalable. Also, multiple chips (linear arrays) can be connected in parallel to implement the parallel array structure and provide a proportional speedup