首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   61725篇
  免费   5715篇
  国内免费   2678篇
电工技术   3630篇
技术理论   4篇
综合类   3642篇
化学工业   10391篇
金属工艺   3547篇
机械仪表   4208篇
建筑科学   4308篇
矿业工程   1753篇
能源动力   2089篇
轻工业   4485篇
水利工程   1185篇
石油天然气   2835篇
武器工业   555篇
无线电   7333篇
一般工业技术   8209篇
冶金工业   3023篇
原子能技术   885篇
自动化技术   8036篇
  2024年   273篇
  2023年   1051篇
  2022年   1808篇
  2021年   2550篇
  2020年   1961篇
  2019年   1746篇
  2018年   1992篇
  2017年   2119篇
  2016年   2019篇
  2015年   2541篇
  2014年   3249篇
  2013年   3822篇
  2012年   4406篇
  2011年   4682篇
  2010年   4006篇
  2009年   3909篇
  2008年   3668篇
  2007年   3384篇
  2006年   3120篇
  2005年   2661篇
  2004年   2023篇
  2003年   1848篇
  2002年   1921篇
  2001年   1663篇
  2000年   1351篇
  1999年   1289篇
  1998年   957篇
  1997年   769篇
  1996年   697篇
  1995年   599篇
  1994年   427篇
  1993年   363篇
  1992年   278篇
  1991年   200篇
  1990年   167篇
  1989年   120篇
  1988年   124篇
  1987年   74篇
  1986年   73篇
  1985年   37篇
  1984年   32篇
  1983年   25篇
  1982年   21篇
  1981年   12篇
  1980年   7篇
  1979年   13篇
  1977年   13篇
  1976年   13篇
  1975年   8篇
  1970年   6篇
排序方式: 共有10000条查询结果,搜索用时 15 毫秒
101.
Lin  Songyue  Hao  Xuejiang  Liu  Yan  Yan  Dong  Liu  Jianwei  Zhong  Mingjun 《Neural computing & applications》2023,35(11):8295-8306
Neural Computing and Applications - Dental X-ray image segmentation is helpful for assisting clinicians to examine tooth conditions and identify dental diseases. Fast and lightweight segmentation...  相似文献   
102.
王栋  张晓俊 《电子器件》2022,45(1):235-238
电子转向助力技术能够有效驱动汽车转向,为提高其转向控制的稳定性和准确性,本文设计了一种基于嵌入式的电子助力转向系统。首先针对传统的电子助力转向系统,利用牛顿第二定律建立其动力学模型,为控制器设计及构建硬件环境奠定基础。其次,针对典型电子转向助力系统的动力学模型,为降低其运动副间的摩擦对控制性能的影响,设计了自适应摩擦前馈补偿控制器,并根据Lyapunov稳定性原则确定了自适应控制率解析表达式。再次,本文以STM32F407嵌入式控制器为核心,搭建系统硬件平台并设计软件流程。最后,基于此平台展开试验验证,系统通过跟踪阶跃指令和正弦指令对比分析了传统PID算法和自适应摩擦前馈补偿算法,试验结果表明自适应前馈补偿算法可提高系统稳态精度和动态响应能力,并验证所设计的基于嵌入式的电子助力转向系统的正确性和完整性。  相似文献   
103.
104.
All‐solution processed, high‐performance wearable strain sensors are demonstrated using heterostructure nanocrystal (NC) solids. By incorporating insulating artificial atoms of CdSe quantum dot NCs into metallic artificial atoms of Au NC thin film matrix, metal–insulator heterostructures are designed. This hybrid structure results in a shift close to the percolation threshold, modifying the charge transport mechanism and enhancing sensitivity in accordance with the site percolation theory. The number of electrical pathways is also manipulated by creating nanocracks to further increase its sensitivity, inspired from the bond percolation theory. The combination of the two strategies achieves gauge factor up to 5045, the highest sensitivity recorded among NC‐based strain gauges. These strain sensors show high reliability, durability, frequency stability, and negligible hysteresis. The fundamental charge transport behavior of these NC solids is investigated and the combined site and bond percolation theory is developed to illuminate the origin of their enhanced sensitivity. Finally, all NC‐based and solution‐processed strain gauge sensor arrays are fabricated, which effectively measure the motion of each finger joint, the pulse of heart rate, and the movement of vocal cords of human. This work provides a pathway for designing low‐cost and high‐performance electronic skin or wearable devices.  相似文献   
105.
Spina bifida aperta are complex congenital malformations resulting from failure of fusion in the spinal neural tube during embryogenesis. Despite surgical repair of the defect, most patients who survive with spina bifida aperta have a multiple system handicap due to neuron deficiency of the defective spinal cord. Tissue engineering has emerged as a novel treatment for replacement of lost tissue. This study evaluated the prenatal surgical approach of transplanting a chitosan–gelatin scaffold seeded with bone marrow mesenchymal stem cells (BMSCs) in the healing the defective spinal cord of rat fetuses with retinoic acid induced spina bifida aperta. Scaffold characterisation revealed the porous structure, organic and amorphous content. This biomaterial promoted the adhesion, spreading and in vitro viability of the BMSCs. After transplantation of the scaffold combined with BMSCs, the defective region of spinal cord in rat fetuses with spina bifida aperta at E20 decreased obviously under stereomicroscopy, and the skin defect almost closed in many fetuses. The transplanted BMSCs in chitosan–gelatin scaffold survived, grew and expressed markers of neural stem cells and neurons in the defective spinal cord. In addition, the biomaterial presented high biocompatibility and slow biodegradation in vivo. In conclusion, prenatal transplantation of the scaffold combined with BMSCs could treat spinal cord defect in fetuses with spina bifida aperta by the regeneration of neurons and repairmen of defective region.  相似文献   
106.
The electromigration behavior of low-melting temperature Sn-58Bi (in wt%) solder joints was investigated with a high current density between 3 and 4.5 × 103 A/cm2 between 80 and 110 °C. In order to analyze the impact of various substrate metallizations on the electromigration performance of the Sn-58Bi joint, we used representative substrate metallizations including electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), and organic solderability preservatives (OSP). As the applied current density increased, the time to failure (TTF) for electromigration decreased regardless of the temperature or substrate metallizations. In addition, the TTF slightly decreased with increasing temperature. The substrate metallization significantly affected the TTF for the electromigration behavior of the Sn-58Bi solder joints. The substrate metallizations for electromigration performance of the Sn-58Bi solder are ranked in the following order: OSP-Cu, ENEPIG, and ENIG. Due to the polarity effect, current stressing enhanced the fast growth of intermetallic compounds (IMCs) at the anode interface. Cracks occurred at the Ni3Sn4 + Ni3P IMC/Cu interfaces on the cathode sides in the Sn-58Bi/ENIG joint and the Sn-58Bi/ENEPIG joint; this was caused by the complete consumption of the Ni(P) layer. Alternatively, failure occurred via deformation of the bulk solder in the Sn-58Bi/OSP-Cu joint. The experimental results confirmed that the electromigration reliability of the Sn-58Bi/OSP-Cu joint was superior to those of the Sn-58Bi/ENIG or Sn-58Bi/ENEPIG joints.  相似文献   
107.
108.
本文主要从规程适用范围、计量器具控制、计量性能要求及检定方法等方面入手,全面的解读了气相色谱仪新旧检定规程的差异,为仪器检定及期间核查提供了参考。  相似文献   
109.
110.
With the great potential of the all-polymer solar cells for large-area wearable devices, both large-area device efficiency and mechanical flexibility are very critical but attract limited attention. In this work, from the perspective of the polymer configurations, two types of terpolymer acceptors PYTX-A and PYTX-B (X = Cl or H) are developed. The configuration difference caused by the replacement of non-conjugated units results in distinct photovoltaic performance and mechanical flexibility. Benefiting from a good match between the intrinsically slow film-forming of the active materials and the technically slow film-forming of the blade-coating process, the toluene-processed large-area (1.21 cm2) binary device achieves a record efficiency of 14.70%. More importantly, a new parameter of efficiency stretchability factor (ESF) is proposed for the first time to comprehensively evaluate the overall device performance. PM6:PYTCl-A and PM6:PYTCl-B yield significantly higher ESF than PM6:PY-IT. Further blending with non-conjugated polymer donor PM6-A, the best ESF of 3.12% is achieved for PM6-A:PYTCl-A, which is among the highest comprehensive performances.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号