Asymptotic Stability Conditions and Estimates of Solutions for Nonlinear Multiconnected Time-Delay Systems

This paper examines certain classes of multiconnected (complex) systems with time-varying delay. Delay-independent stability conditions and estimates of the convergence rate of solutions to the origin for those systems are derived. It is shown that the exponents in the obtained estimates depend on the parameters of Lyapunov functions constructed for the corresponding isolated subsystems. The problem of computing parameter values that provide the most precise estimates is investigated. Some examples are presented to demonstrate the effectiveness of the proposed approaches.     

Integration of InGaP/GaAs/Ge triple‐junction solar cells on deeply patterned silicon substrates

We report preliminary results on InGaP/InGaAs/Ge photovoltaic cells for concentrated terrestrial applications, monolithically integrated on engineered Si(001) substrates. Cells deposited on planar Ge/Si(001) epilayers, grown by plasma‐enhanced chemical vapor deposition, provide good efficiency and spectral response, despite the small thickness of the Ge epilayers and a threading dislocation density as large as 10⁷/cm². The presence of microcracks generated by the thermal misfit is compensated by a dense collection grid that avoids insulated areas. In order to avoid the excessive shadowing introduced by the use of a dense grid, the crack density needs to be lowered. Here, we show that deep patterning of the Si substrate in blocks can be an option, provided that a continuous Ge layer is formed at the top, and it is suitably planarized before the metalorganic chemical vapor deposition. The crack density is effectively decreased, despite that the efficiency is also lowered with respect to unpatterned devices. The reasons of this efficiency reduction are discussed, and a strategy for improvement is proposed and explored. Full morphological analysis of the coalesced Ge blocks is reported, and the final devices are tested under concentrated AM1.5D spectrum. Copyright © 2016 John Wiley & Sons, Ltd.     

Interprocedural Compiler Optimization for Partial Run-Time Reconfiguration

In this paper, we study the performance impact of dynamic hardware reconfigurations for current reconfigurable technology. As a testbed, we target the Xilinx Virtex II Pro, the Molen experimental platform and the MPEG2 encoder as the application. Our experiments show that slowdowns of up to a factor 1000 are observed when the configuration latency is not hidden by the compiler. In order to avoid the performance decrease, we propose an interprocedural optimization that minimizes the number of executed hardware configuration instructions taking into account constraints such as the “FPGA-area placement conflicts” between the available hardware configurations. The presented algorithm allows the anticipation of hardware configuration instructions up to the application’s main procedure. The presented results show that our optimization produces a reduction of 3 to 5 order of magnitude of the number of executed hardware configuration instructions. Moreover, the optimization allows to exploit up to 97% of the maximal theoretical speedup achieved by the reconfigurable hardware execution.     

Comparative analysis of the outdoor performance of a dye solar cell mini‐panel for building integrated photovoltaics applications

New generation photovoltaic (PV) devices such as polymer and dye sensitized solar cells (DSC) have now reached a more mature stage of development, and among their various applications, building integrated PVs seems to have the most promising future, especially for DSC devices. This new generation technology has attracted an increasing interest because of its low cost due to the use of cheap printable materials and simple manufacturing techniques, easy production, and relatively high efficiency. As for the more consolidated PV technologies, DSCs need to be tested in real operating conditions and their performance compared with other PV technologies to put into evidence the real potential. This work presents the results of a 3 months outdoor monitoring activity performed on a DSC mini‐panel made by the Dyepower Consortium, positioned on a south oriented vertical plane together with a double junction amorphous silicon (a‐Si) device and a multi‐crystalline silicon (m‐Si) device at the ESTER station of the University of Rome Tor Vergata. Good performance of the DSC mini‐panel has been observed for this particular configuration, where the DSC energy production compares favorably with that of a‐Si and m‐Si especially at high solar angles of incidence confirming the suitability of this technology for the integration into building facades. This assumption is confirmed by the energy produced per nominal watt‐peak for the duration of the measurement campaign by the DSC that is 12% higher than that by a‐Si and only 3% lower than that by m‐Si for these operating conditions. Copyright © 2013 John Wiley & Sons, Ltd.     

Solid-Phase Microextraction (SPME) of Pyrazines in Model Reaction Systems

Headspace solid-phase microextraction (HS-SPME) combined with gas chromatography (GC) was used for isolating and analysing pyrazines formed in a model system. This system consisted of an aqueous mixture of glucose, glycine and sodium hydroxide. Pyrazine formation was accelerated by heating in a microwave oven. Results were compared with our earlier ones using conventional techniques for isolation of pyrazines. HS-SPME-GC showed several advantages over traditional methods. The method is rapid, sensitive, easy to use and reproducible. Headspace and liquid of the model reaction were extracted and the results obtained using headspace sampling showed good agreement with the methylene chloride extraction method. In all cases, coefficients of variation of 5% or lower were obtained when the SPME extraction time was consistent.     

Role of Electromagnetic Fluctuations in Organic Electronics

Thin organic films find expanding applications in electronic and optoelectronic devices, biotechnology, food packing, and for many other purposes. Among other factors, the stability of films with a thickness below a micrometer is determined by the zero-point and thermal fluctuations of the electromagnetic field. These fluctuations result in the van der Waals and Casimir free energy and forces between a film and a substrate. The fluctuation-induced force may be both attractive and repulsive making the film either more or less stable, respectively. Here, we review recently obtained results for the Casimir free energy of both freestanding and deposited on the metallic and dielectric substrates peptide films. We also perform computations for the free energy of the peptide films deposited on a silica glass substrate in the region of parameters where this free energy vanishes. Possible applications of the obtained results are discussed.     

Insights on the Side Panels of the <Emphasis Type="Italic">Franciscan Triptych</Emphasis> by Fra Angelico Using Terahertz Time-Domain Imaging (THz-TDI)

The side panels of the Franciscan Triptych (St. Jerome, St. John the Baptist, and the Archangel Gabriel and St. Francis, St. Onofrio, and the Virgin Annunciate, by Fra Angelico, before 1429) were scanned by means of terahertz time-domain imaging (THz-TDI). THz analysis supplied information on the stratigraphy of the panel paintings and the associated construction, “gessoing” and gilding techniques. Furthermore, THz-TDI provided information regarding the location of restoration materials within the painting stratigraphy on St. Jerome, St. John the Baptist, and the Archangel Gabriel, as well as on the extension and nature of subsurface cracks in the panel painting of St. Francis, St. Onofrio, and the Virgin Annunciate.     

Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and Internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.