Microstructure and fatigue characteristics of direct chill cast and electromagnetic cast 2024 Al alloy ingots

The distinct advantages of the electromagnetic casting (EMC) process consist in the presence of stirring motions in the melt, which lead to significant grain size reduction in solidified ingot. Furthermore, surface and subsurface qualities are improved due to the absence of ingot mold. However, it is impossible to achieve the aforementioned advantages in conventional direct chill casting (DCC). In order to contrast the before and after heat treatments of the microstructural and mechanical characteristics of EMC and DCC 2024 aluminium alloys, optical microscopy, scanning electron microscopy, transmission electron microscopy (TEM), X-ray diffractions (XRD), differential scanning calorimetry (DSC), etc. were carried out. Compared with the DCC ingot, the EMC ingot has better mechanical properties not only in the ascast condition but also in the as-aged condition. The DSC curves show that the EMC specimens have high enthalpy, i.e., the thermal kinetic energy to form precipitates during the aging treatment process. Despite heat treatments applied to the DCC ingot, it fails to attain the same mechanical properties as the EMC ingot. Moreover, considering the expernsive scalping operation for DCC ingots, the EMC technique, which offers a lower manufacturing cost, is one of the best manufacturing methods used in obtaining the ingots of wrought aluminum alloys.     

光学薄膜在光通信中的应用

主要介绍了光学薄膜在光通信的无源型器件中的原理及应用,并与光纤光栅和平面光波导型的无源器件作简单比较。     

EPON媒体接入控制的关键技术研究

文章简要介绍了基于以及太网的无源光网络（EPON）这种新型的接入网技术，将其与基于ATM技术的无源光网络（APON）的优缺点进行了比较，并对其媒体接入控制（MAC）的关键技术测距及上行接入进行了讨论，初步提出了光网络单元（ONU）的软、硬件实现方案。     

一种嵌入式TCP／IP的实现

针对许多小型嵌入式系统要求结构紧凑、开销小的TCP／IP协议栈的需求，提出一种可移植的非路由器TCP／IP原型的实现。该TCP／IP原型基于某种小型嵌入式系统，依据RFC1122兼容性规定，提供IP、ARP、TCP、UDP服务和Berkeley Socket编程接口。该实现代码短小，开销低，性能能够满足多数应用需求，具有较强的可移植性。     

On teletraffic applications to OBS

We provide teletraffic models for loss probability evaluation of optical burst switching (OBS). We show that the popular Engset formula is not exact for OBS modeling and demonstrate that in certain cases it is not appropriate. A new exact model is provided. The various models are compared using numerical results for various OBS alternatives with and without burst segmentation.     

建设工程质量保证体系存在的问题及对策

结合建筑业市场管理体制的改革及其发展态势，就建筑工程质量保证体系存在的问题作了阐述，从加强勘察设计资格的管理，完善监理法规等方面，提出了健全和完善质保体系的措施。     

质子和中子的单粒子效应等效性实验研究

通过实验方法确定了高能质子和中子引起的单粒子效应等效关系，实验中采用金箔散射法降低了质子束流强度，并利用热释光剂量计（TLD）进行质子注量的监测，采用新研制的存储器长线实时监测系统，进行了64K位至4M位的SRAM器件单粒子效应实验，确定了两种粒子引起单粒子效应等效关系。     

In situ SEM studies on the effects of particulate reinforcement on fatigue crack growth mechanism of aluminium-based metal-matrix composite

The effects of particulate reinforcement on the fatigue behaviour and fatigue mechanisms of two 6061 aluminium-based metal-matrix composites (MMCs) in three different heattreatment conditions were studied in situ with a scanning electron microscope and compared to the unreinforced alloy in the as-received condition. It was observed that the fatigue properties of the MMCs were influenced by the ceramic particles in two ways: firstly the particles increased the fatigue stress intensity threshold mainly by crack-deflection and crack-closure mechanisms, and secondly, the particles raised the fatigue crack growth rates in the Paris region by providing an easy crack path. The effect of ageing was small on the fatigue stress intensity threshold of MMCs, but for the peak-aged MMCs the fatigue crack growth rates in the Paris region were faster. The mechanism of fatigue crack growth was largely associated with the matrix/particle interface and the linkage with subcracks initiated ahead of the main crack at high applied stress intensity factors.     

弹药内弹道性能检验新方法数学模型的建立

本文对弹药内弹道性能检验的传统方法存在的问题进行了分析,提出了一种新的检验方法,重点对新的检验方法的数学模型的建立过程进行了论述。并对数学模型的精度进行了分析、检验和验证。     

Transient hot-electron effect and its impact on circuit reliability

Transient hot-electron effect and its impact on circuit reliability are investigated. The rate of device decay is monitored as a function of the gate pulse transient period. Simulation results reveal that excess charges during a fast turn off time may cause an increase in the maximum substrate current. This, along with our experimental data, identifies that transient excess carrier may cause the enhancement of device degradation under certain stress conditions. The enhancement factor of the degradation is a function of the gate pulse transient time. Correlation between the analysis based upon AC/DC measurement and calculations based upon transient simulation are shown in the paper. Better agreement with experimental data is obtained by using the transient analysis and on chip test/stress structures. The correlation between AC and DC stress data is also shown based on the impact ionization model. A hot-electron design guideline is proposed based on the circuit reliability analysis. This guideline can help improve the circuit reliability without adversely effecting the circuit performance.