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31.
Ye Wan Jun Tan Guangling Song Chuanwei Yan 《Metallurgical and Materials Transactions A》2006,37(7):2313-2316
The focused ion beam technique was employed to investigate the atmospheric corrosion morphology of AZ91D. It was found that
the α matrix of the alloy was preferentially corroded in the areas adjacent to intermetallic phases. The most interesting
finding was that the corrosion products in corrosion cavities were pelletlike, which has never been reported before. 相似文献
32.
Gert Schubring 《NTM》2003,11(2):90-99
Enno Heeren Dirksen (1788–1850) was one of several mathematicians originating from Eastern Frisia at the end of the eighteenth
century to acquire prominence in neohumanist reformed Prussia. While striving—like so many of his contemporaries—for more
rigour in the foundations of calculus, his work is significant due to his unusual emphasis on the semiotic aspects of the
basic concepts. As a clear-sighted propagator of Cauchy's conceptual innovations in Germany, his achievements in improving
sign expressions of such concepts enabled him to clarify hitherto not differentiated multiple limit processes—although less
successfully in constructive concept formation itself.
The contribution is based on the analysis of Dirksen's published texts and on the numerous texts which remained drafts for
his projected voluminousOrganon der gesamten Analysis.
Menso Folkerts zum 60. Geburtstag gewidmet 相似文献
Menso Folkerts zum 60. Geburtstag gewidmet 相似文献
33.
Yang Aiying Wang Ziyu Zhang Zhaoyi Chen Zhangyuan Wu Deming 《电子科学学刊(英文版)》2003,20(6):461-466
A 10Gbit/s recirculating system is configured with Chirped Fiber Bragg Grating (CFBG) for the dispersion compensation. For the first time, the transmission distance in the loop reaches 1000km with bit error rate of 10-9. The effect of the group delay ripple of the fiber grating is also investigated in the recirculating systems, and it is shown that the transmission distance is limited to 4 cycles (4×167.1km ) in the loop with the power penalty fluctuation below 1.0dB. Thus the group delay ripple should be reduced to allow for the wavelength drift of±5GHz. At the end of this letter, the principles are given for designing long haul recirculating systems with dispersion compensation CFBG. 相似文献
34.
Ferrite particles coated with biocompatible phases can be used for hyperthermia treatment of cancer. We have synthesized substituted
calcium hexaferrite, which is not stable on its own but is stabilized with small substitution of La. Hexaferrite of chemical
composition (CaO)0.75(La203)0.20(Fe2O3)6 was prepared using citrate gel method. Hydroxyapatite was prepared by precipitating it from aqueous solution of Ca(NO3)2 and (NH4)2HPO4 maintaining pH above 11. Four different methods were used for coating of hydroxyapatite on ferrite particles. SEM with EDX
and X-ray diffraction analysis shows clear evidence of coating of hydroxyapatite on ferrite particles. These coated ferrite
particles exhibited coercive field up to 2 kOe, which could be made useful for hysteresis heating in hyperthermia. Studies
by culturing BHK-21 cells and WBC over the samples show evidence of biocompatibility. SEM micrographs and cell counts give
clear indication of cell growth on the surface of the sample. Finally coated ferrite particle was implanted in Kasaulli mouse
to test its biocompatibility. The magnetic properties and biocompatibility studies show that these hydroxyapatite coated ferrites
could be useful for hyperthermia. 相似文献
35.
Chloride doped polyaniline conducting polymer films have been prepared in a protic acid medium (HCl) by potentiodynamic method
in an electrochemical cell and studied by cyclic voltammetry and FTIR techniques. The FTIR spectra confirmed Cl- ion doping in the polymers. The polymerization rate was found to increase with increasing concentration of aniline monomer.
But the films obtained at high monomer concentration were rough having a nonuniform flaky polyaniline distribution. Results
showed that the polymerization rate did not increase beyond a critical HCl concentration. Cyclic voltammetry suggested that,
the oxidation-reduction current increased with an increase in scan rate and that the undoped polyaniline films were not hygroscopic
whereas chloride doped polyaniline films were found to be highly hygroscopic. 相似文献
36.
P(DBF-VA)型柴油低温流动性改进剂的研制 总被引:1,自引:1,他引:0
针对新疆地产柴油蜡含量较高的特点,以游离基聚合法合成了富马酸双链混合酯和醋酸乙烯酯共聚物型[P(DBF-VA)]柴油低温流动改进剂,利用正交实验研究了单体配比,引发剂用量,溶剂用量,聚合温度对聚合物降冷滤效果的影响。共聚物用IR进行表征,利用XRD初步探讨了该降凝剂的降凝机理。结果表明:该剂能使吐哈—10~#、0~#柴油冷滤点降低10℃和7℃;使独山子0~#柴油冷滤点下降12℃;使石化0~#柴油冷滤点下降8℃;使克拉玛依0~#柴油的冷滤点下降8℃。 相似文献
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40.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献