Practical considerations of Si-based anodes for lithium-ion battery applications

Using Si-based anodes in Li-ion batteries is one of the most feasible approaches to achieve high energy densities despite their disadvantages, such as low conductivity and massive volume expansion, which cause unstable solid electrolyte interphase layers with mechanical failure. The forefront in research and development to address the above challenges suggests the possibility of fully commercially viable cells using various structural and interfacial modifications. In particular, we present a discussion of each dimension of Si-based anodes in multiple controlled systems, including plain, hollow, porous, and uniquely engineered structures, which are further evaluated based on their anode performances, such as initial reversibility, capacity retention for extended cycles with its efficiency, degree of volume expansion tolerance, and rate capabilities, by several practical standards in half cells. With these practical considerations, multi-dimensional structures with uniform size distributions (micrometers, on average) are strongly desired to satisfy the rigorous requirements for widespread applications. Furthermore, we closely examined several full cells composed of Si-based multicomponent anodes coupled with suitable cathodes based on practical standards to propose future research directions for Si-based anodes to keep pace with the rapidly changing market demands for diverse energy storage systems.

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Revisiting Statistical Design and Analysis in Scientific Research

Statistics is essential to design experiments and interpret experimental results. Inappropriate use of the statistical analysis, however, often leads to a wrong conclusion. This concept article revisits basic concepts of statistics and provides a brief guideline of applying the statistical analysis for scientific research from designing experiments to analyzing and presenting the data.     

Characterization of centrifugally atomized Al-12Si-5Fe-3Cu-1Mg(wt%) alloy powder and extruded rod

The Al-12Si-5Fe-3Cu-1Mg(wt%) alloy was rapidly solidified by centrifugal atomization. The microstructural characteristics of rapidly solidified powder and the microstructure changes with heat treatment were investigated in terms and related to powder size. The microstructures of the powder consisted of dendritic -Al, eutectic phase, Cu-rich phase, and needle-like intermetallic compounds. These phases were much finer than that of ingot cast structure and the size decreased with increasing cooling rate. The X-ray diffraction of the atomized powders revealed the presence of non-equilibrium 3-(AlFeSi) intermetallic phase. This phase appeared to transform to an equilibrium -(AlFeSi) phase by heating at temperatures above 470°C. The extruded rod which was hot extruded at 360°C with an extrusion ratio of 40:1 also revealed the presence of the -(AIFeSi) intermetallic phase. Using DSC, the exothermic peak due to precipitation from the supersaturated -Al matrix was observed in the range of 200–250°C during continuous heating of atomized powder, and the size of the peaks increased with decreasing powder size.     

Transformation of a thin-walled solid model into a surface model via solid deflation

A simplified geometric model with lower dimensionality, such as a mid-surface model, is often preferred over a detailed solid model for the analysis process, if the analysis results are not seriously impacted. In order to derive a mid-surface model from a thin-walled solid model, in this paper, we propose a novel approach called the solid deflation method. In this method, a solid model is assumed to be created by using air to inflate a shell that comprises the surface of the solid model. First, the model is simplified by the removal of any detailed features whose absence would not alter its overall shape. Next, the solid model itself can be converted into a degenerate solid model with zero thickness. Finally, a surface model is generated by splitting large faces paired in the thinned solid model, selecting one face per pair for creating a sheet model, and sewing the selected faces. Using this method, a more practical and usable mid-surface model can be very efficiently generated from a solid model because it can circumvent not only the tedious trimming and extension processes of the medial axis transformation method but also the time-consuming patch joining process of the mid-surface abstraction approach.     

Theoretical and experimental characterization of wettability of various nanolens arrayed polymer surfaces replicated with nanodimpled aluminum mold insert

Various types of polymer surfaces with a nanolens array, which has an entrant shape with a low aspect ratio, were fabricated and the wettability of the fabricated surfaces was evaluated in both theoretical and experimental ways. The nanolens array was replicated on three different polymer surfaces of polydimethylsiloxane (PDMS), cyclic olefin copolymer (COC), and polymethylmethacrylate (PMMA) by means of replica molding and hot embossing with a nanodimpled aluminum mold that was manufactured by a chemical oxidation process. From the theoretical and experimental evaluations of the wettability it was found that the measured contact angles were very similar with the theoretically estimated ones and also the hydrophilicity and hydrophobicity of the hydrophilic PMMA and hydrophobic PDMS, respectively, surfaces were reinforced by the nanolens array within the Wenzel wetting state.     

Device reliability under electrical stress and photo response of oxide TFTs

Abstract— The stability of oxide TFTs has been the main focus of this research and is probably the most crucial requirement for the successful application to flat‐panel displays. Although the high Fermi level of oxide semiconductors makes TFTs basically stable under electrical stress, the device reliability under diverse variations of electrical stress is affected by materials such as active semiconductors and gate insulators, processes for the formation of back/front channels and passivation layers, and device configurations among other things. How these factors affect the device reliability have been investigated and a review of the stability is presented. In addition, several categories of the light instability of oxide TFTs is presented and the origin is discussed.     

Performance comparison of tracking filters in terms of predicted hitting point

This article describes the performance comparison of several tracking filters from the viewpoint of gun fire control. It is common that filter performance can be represented by the RMSE of the current state. However, for the design of a gun fire control system, the performance of the tracking filter in terms of prediction is more important since the current state proceeds with a designed dynamic model to a certain future which is used for the final gun order. It is shown that the predicted results amplify the current state RMSE and can be a good measure.     

Modeling and simulation of powered hip orthosis by pneumatic actuators

In this study, a simulation model for a powered hip orthosis (PHO) with air muscles to predict the gait of paraplegics is presented which can be used as a design tool for hip orthoses. Before simulation, mathematical models for a human dummy with an orthosis and a pneumatic muscle actuator were generated. For the air muscle, coefficients required were obtained by static and dynamic experiments of the air muscle and experiments for the valve controlling the air pressure. The computation was conducted on the ADAMS package together with MATLAB. Computer simulation of the flexion of hip joints by the pneumatic muscle results in similar values to those from gait analysis. With the development of a simulation model for a PHO, the gait simulation model using pneumatic muscles can be used to analyze and evaluate the characteristics and efficiency of a PHO by setting the input and boundary conditions.     

A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

This paper describes the design and fabrication of a MEMS guide plate, which was used for a vertical probe card to test a wafer level packaged die wafer. The size of the fabricated MEMS guide plate was 10.6 × 10.6 cm. The MEMS guide plate consisted of 8,192 holes to insert pogo pins, and four holes for bolting between the guide plate and the housing. To insert pogo pins easily, an inclined plane was defined at the back of each hole. Pitch and diameter of the hole were 650 and 260 μm, respectively. In order to define inserting holes and inclined planes at an exact position, silicon MEMS technology was used such as anisotropic etching, deep reactive etching and more. Silicon was used as the material of the guide plate to reduce alignment mismatch between the pogo pins and solder bumps during a high temperature testing. A combined probe card with the fabricated MEMS guide plate showed good x–y alignment and planarity errors within ±9 and ±10 μm at room temperature, respectively. In addition, x–y alignment and planarity are ±20 and ±16 μm at 125°C, respectively. The proposed MEMS guide plate can be applied to a vertical probe card for burn-in testing of a wafer level packaged die wafer because the thermal expansion coefficient of the MEMS guide plate and die wafer is same.