Study on esterification of acrylic phenolic resin by maleic anhydride and photocrosslinking properties of the alkali‐soluble product

An alkali‐soluble, photocrosslinkable polymer was synthesized by esterification of OH groups of acrylic phenolic resin with maleic anhydride. The OH groups were formed by the ring‐opening reaction of epoxy groups of epoxy phenolic resin with acrylic acid. The esterification conditions were studied. The results showed that it is better to use tetramethyl ammonium bromide as catalyst than N,N‐dimethylbenzylamine. The conversion of maleic anhydride in acetone can reach about 80% at 56°C for 4 h. The purified product was characterized by IR, DSC, and TGA. The product containing acrylate and maleic acid monoester groups, above a certain content, can be dissolved in 1% Na₂CO₃ solution. The photocrosslinkable properties of the product were investigated through selection of photoinitiator, accelarator, crosslinkable diluent monomer, etc. The acrylate and maleic acid monoester group‐containing phenolic resin exhibited very good photocrosslinking behavior, since it contains double bonds from both acrylate groups and maleic acid monoester groups. The activity of photoinitiator decreases in the order: isopropylthioanthraquinone > benzoin ethyl ether (BE) > anthraquinone (AQ) > benzophenone > Michel ketone (MK) > 2,2‐diethoxyacetophenone. The combination of some photoinitiators showed synergistic effects. The order of increasing activity for the accelerator is as follows: MK > ethyl p‐(dimethylamino)benzoate > N,N‐dimethylaniline > triethanolamine. The optimum diluent monomer is trimethylolpropane trimethacrylate. The gel content of the mixture of the resin and trimethylolpropane trimethacrylate could reach 85% using the combined photoinitiators of BE and AQ under UV exposure for 120 s. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1607–1614, 2005     

Micromechanical properties on the surface of PVC/SBR blends spatially resolved by a nanoindentation technique

The microhardness and micromodulus on the surface of poly(vinyl chloride) (PVC)/styrene‐butadiene rubber (SBR) blends were determined using a nanoindenter. A flat surface was obtained by microtoming the sample at ?100°C in liquid nitrogen. Dozens of indents along a line with a spatial interval of 0.5 μm were performed. From the loading and unloading curves of each indentation, the stiffnesses of the unloading curve and the contact area between the sample and the indenter were evaluated, and the local modulus and hardness were calculated. Profiles of the local hardness and modulus were obtained from the lines of indents. Pure PVC and a miscible PVC/acrylonitrile‐butadiene rubber (NBR) (40/10) blend showed constant modulus and hardness values. In the case of an immiscible PVC/SBR (50/50) blend, which has a morphology of elongated PVC droplets in the SBR matrix, the hardness and modulus profiles showed regions of the different phases. At the interface between the SBR and PVC phases, a step change in the modulus and hardness profiles was observed. The force required to deform the material at the same displacement increased systematically across the interface from the SBR to the PVC phase because of the increasing contribution of the PVC phase. Polym. Eng. Sci. 44:609–614, 2004. © 2004 Society of Plastics Engineers.     

Polyimide foams with ultralow dielectric constants

To explore ultralow dielectric constant polyimide, the crosslinked polyimide foams (PIFs) were prepared from 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), 4,4′‐oxydianiline (ODA), and 2,4,6‐triaminopyrimidine (TAP) via a poly(ester–amine salt) (PEAS) process. FTIR measurements indicated that TAP did not yield a negative effect on imidization of PEAS precursors. SEM measurement revealed the homogeneous cell structure. Through using TAP as a crosslinking monomer, the mechanical properties of PIFs could be improved in comparison with uncrosslinked BTDA/ODA based PIF. The crosslinked PIFs still exhibited excellent thermal stability with 5% weight loss temperatures higher than 520°C. In the field with frequency higher than 100 Hz, the dielectric constants of the obtained PIFs ranged from 1.77 to 2.4, and the dielectric losses were smaller than 3 × 10^?2 at 25–150°C. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1734–1740, 2006     

Effects of cobalt and potassium doping on thermal stability and electrical properties of radiation grafted acrylic acid onto poly(tetrafluoroethylene ethylene) copolymer films

Grafted copolymer of poly(tetrafluoroethylene ethylene) (ET) with acrylic acid (AAc) was prepared by direct radiation method. The obtained films were modified by treating with small amounts of Co²⁺ and K⁺ ions (1.0 wt %). The effects of such treatment on the thermal stability and electrical conductivity of these films were studied. Cobalt treatment did not much affect the thermal degradation of the films. The results obtained revealed that k⁺ treatment enhanced the thermal degradation of ET‐g‐PAAc, which started 273 K lower than that observed in the case of the untreated and Co²⁺‐treated films. Potassium and cobalt treatment of the investigated films increased their electrical conductivity (σ) and decreased the activation energy ΔE_σ. The increase in σ values was, however, more pronounced in the case of K⁺‐treated film. These results were discussed in terms of the effective increase in the hydrophilicity of the films, especially those treated with potassium. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 867–871, 2005     

Advanced underfill for high thermal reliability

The key to the success of flip‐chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip‐chip technology using current underfill materials is generally found to be lower than that of conventional wire‐bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80°C), was used in the underfill materials as a cohardener. As a result, DBMI‐added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI‐added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one‐half at the solder reflow temperature (about 200°C), the elastic modulus was reduced to less than one‐half in the temperature region below the glass‐transition temperature, and the water resistance was improved twofold. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2617–2624, 2002     

再结晶法制备高纯超细Al2O3粉的研究

本文介绍了用一种再结晶技术制造高炖、超细Al_2O_3粉体的新方法。 将硫酸铝铵溶液(AA)滴入碳酸氢铵溶液(AHC),经过反应合成一种新的含铝化合物,碳酸氢铝铵(AACH),然后在高温下煅烧,生成超细Al_2O_3粉体。另外还采用了X射线,红外光谱,DTA,以及TEM等手段,研究了反应温度、浓度、PH值和老化条件等对生成物AACH和Al_2O_3的影响。     

Fischer–Tropsch synthesis. Compositional changes in an iron catalyst during activation and use

The equilibrium phase compositions of iron have been calculated for gas compositions that could be encountered during the Fischer–Tropsch synthesis. The gas compositions measured experimentally for CO conversion levels in the 30–90% range show that iron should be present as the carbide phase. However, experimental characterization of iron catalysts show that a significant fraction of the iron is present as Fe₃O₄ following synthesis for several days. A model that can account for the experimental catalyst phase composition and the gases present in the reactor would have a core of Fe₃O₄ and an outer layer of iron carbides.     

基于资源三号卫星数据的数字正射影像图制作研究

资源三号卫星的成功发射填补了我国立体卫星测绘的空白,可以提供优于5m地面分辨率的遥感影像.论文提出基于资源三号卫星遥感数据的数字正射影像图（DOM）制作流程,重点对影像纠正、影像配准、影像融合、影像镶嵌等关键步骤进行研究,并通过实验验证方法的可行性.实验证明该方法具有较强的实用价值和广泛的应用前景.     

UASB-接触氧化处理高浓度有机废水试验研究

本文主要通过UASB 接触氧化生化处理模型对某化工厂废水的试验研究，探索运用UASB法处理高浓度有机废水的可行性。同时还探讨了废水的CODcr及含盐量对UASB处理效率的影响，以及关键参数的选用。     

球磨效率探讨

主要讨论了球石的装载量、球石空隙率、球石级配、泥浆密度等因素对球磨效率的影响。运用正交试验优选了各因素。