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91.
System-on-package (SOP) is a viable alternative to system-on-chip (SOC) for meeting the rigorous requirements of today's mixed-signal system integration. Thermal integrity is arguably the most crucial issue in three-dimensional (3-D) SOP due to the compact nature of the 3-D integration. In addition, the power supply noise issue becomes more serious as the supply voltage continues to decrease while the number of active devices consuming power increases. We propose a 3-D module and decap (decoupling capacitance) placement algorithm that evenly distributes the thermal profile and reduces the power supply noise. In addition, we allocate white spaces around the modules that require decaps to suppress the power supply noise while minimizing the area overhead. In our experimentation, we achieve improvements in both maximum temperature and decap amount with only small increase in area, wirelength, and runtime.  相似文献   
92.
The power consumption and operating frequency of the extended true single-phase clock (E-TSPC)-based frequency divider is investigated. The short-circuit power and the switching power in the E-TSPC-based divider are calculated and simulated. A low-power divide-by-2/3 unit of a prescaler is proposed and implemented using a CMOS technology. Compared with the existing design, a 25% reduction of power consumption is achieved. A divide-by-8/9 dual-modulus prescaler implemented with this divide-by-2/3 unit using a 0.18-mum CMOS process is capable of operating up to 4 GHz with a low-power consumption. The prescaler is implemented in low-power high-resolution frequency dividers for wireless local area network applications  相似文献   
93.
In this paper, we present novel high‐speed transmission schemes for high‐speed ultra‐high frequency (UHF) radio‐frequency identification communication. For high‐speed communication, tags communicate with a reader using a high‐speed Miller (HS‐Miller) encoding and multiple antennas, and a reader communicates with tags using extended pulse‐interval encoding (E‐PIE). E‐PIE can provide up to a two‐fold faster data rate than conventional pulse‐interval encoding. Using HS‐Miller encoding and orthogonal multiplexing techniques, tags can achieve a two‐ to three‐fold faster data rate than Miller encoding without degrading the demodulation performance at a reader. To verify the proposed transmission scheme, the MATLAB/Simulink model for high‐speed backscatter based on an HS‐Miller modulated subcarrier has been designed and simulated. The simulation results show that the proposed transmission scheme can achieve more than a 3 dB higher BER performance in comparison to a Miller modulated subcarrier.  相似文献   
94.
An iodine‐free solid‐state dye‐sensitized solar cell (ssDSSC) is reported here, with 6.8% energy conversion efficiency—one of the highest yet reported for N719 dye—as a result of enhanced light harvesting from the increased transmittance of an organized mesoporous TiO2 interfacial layer and the good hole conductivity of the solid‐state‐polymerized material. The organized mesoporous TiO2 (OM‐TiO2) interfacial layer is prepared on large‐area substrates by a sol‐gel process, and is confirmed by scanning electron microscopy (SEM) and grazing incidence small‐angle X‐ray scattering (GISAXS). A 550‐nm‐thick OM‐TiO2 film coated on fluorine‐doped tin oxide (FTO) glass is highly transparent, resulting in transmittance increases of 8 and 4% compared to those of the bare FTO and conventional compact TiO2 film on FTO, respectively. The high cell performance is achieved through careful control of the electrode/hole transport material (HTM) and nanocrystalline TiO2/conductive glass interfaces, which affect the interfacial resistance of the cell. Furthermore, the transparent OM‐TiO2 film, with its high porosity and good connectivity, exhibits improved cell performance due to increased transmittance in the visible light region, decreased interfacial resistance ( Ω ), and enhanced electron lifetime ( τ ). The cell performance also depends on the conductivity of HTMs, which indicates that both highly conductive HTM and the transparent OM‐TiO2 film interface are crucial for obtaining high‐energy conversion efficiencies in I2‐free ssDSSCs.  相似文献   
95.
A 9‐bit 80‐MS/s CMOS pipelined folding analog‐to‐digital converter employing offset‐canceled preamplifiers and a subranging scheme is proposed to extend the resolution of a folding architecture. A fully differential dc‐decoupled structure achieves high linearity in circuit design. The measured differential nonlinearity and integral nonlinearity of the prototype are ×0.6 LSB and ×1.6 LSB, respectively.  相似文献   
96.
This study proposes a new self-driven active clamp forward converter eliminating the extra drive circuit for the active clamp switch. The converter used the auxiliary winding of the power transformer to drive the active clamp switch and a simple RC circuit to get the dead time between the two switches. The operation principle was presented and experimental results were used to verify theoretical predictions. A 100-W (5 V/20 A) prototype converter that only exhibited 1.5-turn winding number in the auxiliary winding was sufficient to drive the active clamp switch on the input of 50 V. Finally, the measured efficiency of the converter was presented and the maximum efficiency of 91% was obtained.  相似文献   
97.
The industrial scale application of graphene and other functional materials in the field of electronics has been limited by inherent defects, and the lack of simple deposition methods. A simple spray deposition method is developed that uses a supersonic air jet for a commercially available reduced graphene oxide (r‐GO) suspension. The r‐GO flakes are used as received, which are pre‐annealed and pre‐hydrazine‐treated, and do not undergo any post‐treatment. A part of the considerable kinetic energy of the r‐GO flakes entrained by the supersonic jet is used in stretching the flakes upon impact with the substrate. The resulting “frozen elastic strains” heal the defects (topological defects, namely Stone‐Wales defect and C2 vacancies) in the r‐GO flakes, which is reflected in the reduced ratio of the intensities of the D and G bands in the deposited film. The defects can also be regenerated by annealing.  相似文献   
98.
In this paper, we present a method for reconstructing a surface mesh animation sequence from point cloud animation data. We mainly focus on the articulated body of a subject — the motion of which can be roughly described by its internal skeletal structure. The point cloud data is assumed to be captured independently without any inter‐frame correspondence information. Using a template model that resembles the given subject, our basic idea for reconstructing the mesh animation is to deform the template model to fit to the point cloud (on a frame‐by‐frame basis) while maintaining inter‐frame coherence. We first estimate the skeletal motion from the point cloud data. After applying the skeletal motion to the template surface, we refine it to fit to the point cloud data. We demonstrate the viability of the method by applying it to reconstruct a fast dancing motion  相似文献   
99.
For real‐time interactive multimedia operations, such as video uploading, video play, fast‐forward, and fast‐rewind, solid state disk (SSD)‐based storage systems for video streaming servers are becoming more important. Random access rates in storage systems increase significantly with the number of users; it is thus difficult to simultaneously serve many users with HDD‐based storage systems, which have low random access performance. Because there is no mechanical operation in NAND flash‐based SSDs, they outperform HDDs in terms of flexible random access operation. In addition, due to the multichannel architecture of SSDs, they perform similarly to HDDs in terms of sequential access. In this paper, we propose a new SSD‐based storage system for interactive media servers. Based on the proposed method, it is possible to maximize the channel utilization of the SSD's multichannel architecture. Accordingly, we can improve the performance of SSD‐based storage systems for interactive media operations.  相似文献   
100.
In this paper, we present a 600‐V reverse conducting insulated gate bipolar transistor (RC‐IGBT) for soft and hard switching applications, such as general purpose inverters. The newly developed RC‐IGBT uses the deep reactive‐ion etching trench technology without the thin wafer process technology. Therefore, a freewheeling diode (FWD) is monolithically integrated in an IGBT chip. The proposed RC‐IGBT operates as an IGBT in forward conducting mode and as an FWD in reverse conducting mode. Also, to avoid the destructive failure of the gate oxide under the surge current and abnormal conditions, a protective Zener diode is successfully integrated in the gate electrode without compromising the operation performance of the IGBT.  相似文献   
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