Powder preparation for a shell mold using a new coating process

A new coating process in the powder preparation for a shell mold has been developed to increase the fracture strength of the shell mold. It is due to the homogeneous formation of a glass phase on the starting particles and the increase in the glassification efficiency by the reduction in the loss of inorganic precursors. The inorganic binder system used for the new coating process is composed of tetraethyl orthosilicate (TEOS) and sodium methoxide (NaOMe) as the silica (SiO₂) and sodium oxide (Na₂O) precursors, respectively. Three different coating processes are employed for the powder preparation with a high glassification efficiency. In process I, the starting particles are coated with NaOMe, and then TEOS are coated on the particles treated with NaOMe. Process II is the reverse sequence of process I. Process III involves coating of the particles with a mixture of TEOS and NaOMe. The particles coated with an individual or mixture precursor were fixed with an organic binder and then heated at 1000 °C for 1 h. Molds prepared through the new coating processes, especially process III, show a higher fracture strength value compared with that of the conventional convert mold process, which may be caused by the increase in the glassification efficiency of the precursors. Powder prepared by process III shows a more uniform coating of the glass phase than those by other processes, resulting from an enhancement in the phase mixing between SiO₂ and NaOH molecules.     

Contraction stress build‐up of anisotropic conductive films (ACFs) for flip‐chip interconnection: Effect of thermal and mechanical properties of ACFs

The important mechanical mechanism for the electrical conduction of anisotropic conductive films (ACFs) is the joint clamping force after the curing and cooling processes of ACFs. In this study, the mechanism of shrinkage and contraction stress and the relationship between these mechanisms and the thermomechanical properties of ACFs were investigated in detail. Both thickness shrinkages and modulus changes of four kinds of ACFs with different thermomechanical properties were experimentally investigated with thermomechanical and dynamic mechanical analysis. Based on the incremental approach to linear elasticity, contraction stresses of ACFs developed along the thickness direction were estimated. Contraction stresses in ACFs were found to be significantly developed by the cooling process from the glass‐transition temperature to room temperature. Moreover, electrical characteristics of ACF contact during the cooling process indicate that the electrical conduction of ACF joint is robustly maintained by substantial contraction stress below T_g. The increasing rate of contraction stresses below T_g was strongly dependent on both thermal expansion coefficient (CTE) and elastic modulus (E) of ACFs. A linear relationship between the experimental increasing rate and E × CTE reveals that the build‐up behavior of contraction stress is closely correlated with the ACF material properties: thermal expansion coefficient, glassy modulus, and T_g. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2634–2641, 2004     

Fabrication and Characterization of Nanoscale Ferroelectric Honeycombs

Nanoscale ferroelectric honeycombs, comprised of vertically aligned PbTiO₃ nanotubes, are fabricated by vapor phase reaction between lead acetate‐infiltrated TiO₂ nanotubes and PbO vapor. PbTiO₃ nanohoneycombs converted by vapor phase reaction at 550°C showed well‐aligned nanoscale structure with alignment angle less than 1° and well‐defined ferroelectric properties with the effective piezoelectric coefficient of 44 pm/V. This novel nanoscale structure is expected to facilitate high efficiency sensing of electromechanical and electrochemical stimuli.     

Effect of Bi2O3 Addition on the Sintering Temperature and Microwave Dielectric Properties of Zn2SiO4 Ceramics

Bi₂O₃ was added to a nominal composition of Zn_1.8SiO_3.8 (ZS) ceramics to decrease their sintering temperature. When the Bi₂O₃ content was <8.0 mol%, a porous microstructure with Bi₄(SiO₄)₃ and SiO₂ second phases was developed in the specimen sintered at 885°C. However, when the Bi₂O₃ content exceeded 8.0 mol%, a liquid phase, which formed during sintering at temperatures below 900°C, assisted the densification of the ZS ceramics. Good microwave dielectric properties of Q × f =12,600 GHz, ɛ_r=7.6, and τ_f=−22 ppm/°C were obtained from the specimen with 8.0 mol% Bi₂O₃ sintered at 885°C for 2 h.     

Formation and Microwave Dielectric Properties of the Mg2V2O7 Ceramics

The formation process and microwave dielectric properties of the Mg₂V₂O₇ ceramics were investigated. The MgV₂O₆ phase that was formed at around 450°C interacted with remnant MgO above 590°C to form a homogeneous monoclinic Mg₂V₂O₇ phase. Finally, this monoclinic Mg₂V₂O₇ phase was changed to a triclinic Mg₂V₂O₇ phase for the specimen fired at 800°C. Sintering at 950°C for more than 5 h produced high-density triclinic Mg₂V₂O₇ ceramics. In particular, the Mg₂V₂O₇ ceramics sintered at 950°C for 10 h exhibited the good microwave dielectric properties of ɛ_r=10.5, Q × f =58 275 GHz, and τ_f=−26.9 ppm/°C.     

Rational Biosynthetic Engineering for Optimization of Geldanamycin Analogues

Tailor made : We report the rational biosynthesis of C15 hydroxylated non‐quinone geldanamycin analogues by site‐directed mutagenesis of the geldanamycin polyketide synthase (PKS), together with a combination of post‐PKS tailoring genes. Rational biosynthetic engineering allowed the generation of geldanamycin derivatives, such as DHQ3 illustrated in the figure, which had superior pharmacological properties in comparison to the parent compound.

     

Shrinkage behavior and interfacial diffusion in Ni-based internal electrodes with BaTiO3 additive

The effects of particle size of starting materials and amount of a BaTiO₃ additive on the shrinkage behavior and elemental diffusion in Ni-based internal electrodes have been investigated in order to control the shrinkage of the internal electrode in multilayer ceramic capacitors (MLCCs). Two kinds of Ni and BaTiO₃ powders were used with different particle sizes. Volume shrinkage over the range of 700–1300 °C at 150 °C intervals and linear shrinkage during sintering were measured for starting materials and composites in a reducing atmosphere. The interfaces of Ni/BaTiO₃ composites with 90:10 and 70:30 volume ratios, respectively, were investigated using TEM. Composites with bimodal Ni powder show less shrinkage than those with monomodal Ni powder, showing less shrinkage in monolith Ni of bimodal particle size. The shrinkage behavior is changed during sintering with increasing amounts of BaTiO₃ additives in both Ni-based composites. The particle size of the BaTiO₃ additive affects the shrinkage behavior of composites, without the additional amount affecting the final shrinkage. A reaction layer of about 300 nm wide is observed at the interface between the Ni and BaTiO₃ powders in composites, in which elemental Ni diffuses into the BaTiO₃ without counterdiffusion.     

Nonlinear finite element method models for ultimate strength analysis of steel stiffened-plate structures under combined biaxial compression and lateral pressure actions—Part II: Stiffened panels

The present paper (Part II) is a sequel to the previous paper (Part I) [Paik JK, Seo JK. Nonlinear finite element method models for ultimate strength analysis of steel stiffened-plate structures under combined biaxial compression and lateral pressure actions—Part I: Plate elements. Thin-Walled Struct 2008, this issue, doi:10.1016/j.tws.2008.08.005.] on the application of nonlinear finite element methods for ultimate strength analysis of steel stiffened-plate structures under combined biaxial compression and lateral pressure actions. In contrast to Part I dealing with plate elements, the present paper (Part II) treats stiffened panels surrounded by strong support members such as longitudinal girders and transverse frames. In similar to Part I, some important factors of influence such as structural dimensions, initial imperfections, loading types and computational techniques in association with ultimate limit states are studied. Some useful insights in terms of nonlinear finite element method modeling are developed using ANSYS code together with the ALPS/ULSAP semi-analytical method, the latter being for the purpose of a comparison.     

Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging

The interfacial reaction between 42Sn-58Bi solder (in wt.% unless specified otherwise) and electroless Ni-P/immersion Au was investigated before and after thermal aging, with a focus on the formation and growth of an intermetallic compound layer, consumption of under bump metallurgy (UBM), and bump shear strength. The immersion Au layer with thicknesses of 0 μm (bare Ni), 0.1 μm, and 1 μm was plated on a 5-μm-thick layer of electroless Ni-P (with 14–15 at.% P). The 42Sn-58Bi solder balls were then fabricated on three different UBM structures by using screen printing and pre-reflow. A Ni₃Sn₄ layer formed at the joint interface after the pre-reflow for all three UBM structures. On aging at 125°C, a quaternary phase, identified as Sn₇₇Ni₁₅Bi₆Au₂, was observed above the Ni₃Sn₄ layer in the UBM structures that contain Au. The thick Sn₇₇Ni₁₅Bi₆Au₂ layer degraded the integrity of the solder joint, and the shear strength of the solder bump was about 40% less than the nonaged joints.