Effect of Additives on the Electromechanical Properties of Pb(Zr,Ti)O3–Pb(Y2/3W1/3)O3 Ceramics

Dielectric and piezoelectric properties of 0.02Pb(Y_2/3W_1/3)O₃ 0.98Pb(Zr0.52Ti0.48)O3 ceramics doped with additives (Nb₂O₅, La₂O₃, MnO₂, and Fe₂O₃) were investigated. The grain sizes of these ceramics decreased with increasing amounts of additives. For additions of MnO₂ and Fe₂O₃, dielectric losses decreased, while for Nb₂O₅ and La₂O₃, these values increased. The maximum values of the mechanical quality factor Q_m were found to be 956 and 975 for additions of 0.9 wt% Fe₂O₃ and 0.7 wt% MnO₂, respectively, but donor dopants (Nb₂O₅ and La₂O₃) did not change the values of Q_m . On the other hand, the piezoelectric constant d₃₃ and the electromechanical coupling factor k_p decreased with additions of MnO₂ and Fe₂O₃, but improved with additions of Nb₂O₅ and La₂O₃.     

Microstructure development of steel during severe plastic deformation

The microstructure development during plastic deformation was reviewed for iron and steel which were subjected to cold rolling or mechanical milling (MM) treatment, and the change in strengthening mechanism caused by the severe plastic deformation (SPD) was also discussed in terms of ultra grain refinement behavior. The microstructure of cold-rolled iron is characterized by a typical dislocation cell structure, where the strength can be explained by dislocation strengthening. It was confirmed that the increase in dislocation density by cold working is limited at 10¹⁶m⁻², which means the maximum hardness obtained by dislocation strengthening is HV3.7 GPa. However, the iron is abnormally work-hardened over the maximum dislocation strengthening by SPD of MM because of the ultra grain refinement caused by the SPD. In addition, impurity of carbon plays an important role in such grain refinement: the carbon addition leads to the formation of nano-crystallized structure in iron.     

Difference between mechanical alloying and mechanical disordering in the amorphization reaction of Al50Ta50 in a rod mill

Amorphous Al₅₀Ta₆₀ alloy powders have been synthesized by mechanical alloying (MA) from elemental powders of aluminium and tantalum, and mechanical disordering (MD) from crystalline intermetallic compound powders of AlTa respectively using the rod milling technique. The mechanically alloyed and the mechanically disordered alloy powders were characterized by X-ray diffraction, scanning electron microscopy, electron probe microanalysis, transmission electron microscopy, differential thermal analysis, differential scanning calorimetry and chemical analysis. The results have shown that the crystal-to amorphous transformation in the MD process occurs through one stage, while the crystallineto-amorphous formation in the MA process occurs through three stages. At the early and intermediate stages of the MA time, heating the alloy powders to 700 K leads to the formation of an amorphous phase by a solid-state amorphizing reaction. At the final stage of the MA time, the amorphous phase is crystallized through a single sharp exothermic peak. Contrary to this, amorphous alloy powders produced by MD are crystallized through two broad exothermic peaks.     

A new optical elasticity resin for mobile LCD modules

Abstract— The display used in current cell phones has an air gap between the cover glass and the liquid‐crystal‐display (LCD) module to prevent the LCD glass from being damaged. Reflections at the boundaries of the air gap cause a reduction in the LCD luminance and contrast. To address this problem, a newly proposed LCD structure has been investigated. The “Super View Resin (SVR),” a transparent elastic resin which improves the shock resistance and visibility of the LCD, has been developed. Filling the air gap between the cover glass and LCD module with a refractive‐index‐matching resin solves the light‐reflection problem inherent in the use of a reinforced cover‐glass lens. Moreover, the elastic filler works as a damper, reducing any external shock, which prevents not only the cover glass and LCD module from being damaged, but also the glass from being shattered when it is broken.     

Magnetic order and evolution of the electronic state aroundx=0.12 in La2?xBaxCuO4 and La2?xSrxCuO4

Muon spin rotation ( ⁺SR) measurement provides clear evidence of the antiferromagnetic order of Cu moments below 35 K for La_2–x Ba _x CuO₄ and below 15 K for La_2–x Sr _x CuO₄ in the narrow range ofx where the high-T _c superconductivity (SC) is suppressed remarkably. The results suggest that the change of the electronic state coupled with the lattice instability is relevant to the local suppression of SC and freezing of spin fluctuations of the Cu moment.     

Gap symmetry and intrinsic intraplane pinning of untwinned YBa2Cu3O7 single crystals

The interplane (cb) and intraplane (ab) anisotropy of untwinned YBa₂ Cu₃0₇ single crystals has been investigated by means of the torque magnetometry. To extract the reversible and irreversible components, the torque was measured as a function of increasing angle as well as decreasing angle. The interplane irreversible torque _irr shows two-fold peaks at _c =90 ° and270 ° (of half width11 ° at77 K) due to the well-known intrinsic interplane pinning. A novel intrinsic pinning has been discovered in the intraplane irreversible torque, i.e., _irr shows four-fold peaks of half width20° at77 K when _a =0 °, 90 °, 180 ° and270 °. We argue that the intrinsic intraplane pinning comes from the four-fold nature of the gap parameter.     

Fabrication of high hardness Ni mold with electroless nickel–boron thin layer

The nickel electroforming method using a high-concentration nickel sulfamate bath is commonly used to fabricate micro metal molds in the LIGA process; however, this method does not produce micro metal molds of sufficient hardness. One means of improving the hardness of micro metal molds made using the nickel electroforming method is to include additives in the nickel plating solution. Another method is nickel alloy plating or a similar technique. In this research, we used a nickel–boron (Ni–B) electroless alloy plating method to obtain a hard nickel plated film having hardness of 832 Hv. It was also ascertained that Ni–B electroless alloy plated film retains its high hardness even during heat treatment in conditions of 250°C for 1 h. To deal with the high stresses developed in high-hardness plated films, we proposed double-layer nickel electroforming. This method is covered and used on conventional nickel electroforming layer by high hardness micro mold. High hardness micro metal mold using double-layer was fabricated by nickel electroforming and Ni–B electroless alloy plating method.     

Trends in highly scalable crossbar-based packet switch architecture

A combined input and crosspoint queued (CICQ) switch is receiving significant attention to be the next generation high speed packet switch for its scalability; however, a multi-cabinet implementation of a combined input and crosspoint queued (CICQ) switch unavoidably introduces a large round-trip time (RTT) latency between the line cards and switch fabric, resulting a large crosspoint (CP) buffer requirement. In this paper, virtual crosspoint queues (VCQs) that significantly reduces the CP buffer requirement of the CICQ switch is investigated. The VCQs unit resides inside the switch fabric, is dynamically shared among virtual output queues (VOQ) from the same source port, and is operated at the line rate, making the implementation practical. A threshold-based exhaustive round-robin (T-ERR) arbitration is employed to reduce buffer hogging at VCQ. The T-ERR at VCQ and CP arbiters serves packets residing in a longer queue more frequently than packet residing in a shorter queue. Consequently, the T-ERR, drastically increases the throughput of the CICQ switch with small CP buffers. A multi-cabinet implementation of CICQ switch do not support multicasting traffic well since a combination of small CP buffer in the switch fabric and a large RTT latency between the line cards and switch fabric results in non-work conservation of the intra-switch link. Deployment of multicast FIFO buffer between the input buffer and CP buffer shows a promise. With its ability to achieve high throughput independent of RTT and switch port size, the integration of the VCQ architecture and T-ERR scheduler to the CICQ switch is ideal for supporting ever-increasing Internet traffic that requires higher data rate, larger switch size, and efficient multicasting.     

Multi-contact vertical ladder climbing with an HRP-2 humanoid

We describe the research and the integration methods we developed to make the HRP-2 humanoid robot climb vertical industrial-norm ladders. We use our multi-contact planner and multi-objective closed-loop control formulated as a QP (quadratic program). First, a set of contacts to climb the ladder is planned off-line (automatically or by the user). These contacts are provided as an input for a finite state machine. The latter builds supplementary tasks that account for geometric uncertainties and specific grasps procedures to be added to the QP controller. The latter provides instant desired states in terms of joint accelerations and contact forces to be tracked by the embedded low-level motor controllers. Our trials revealed that hardware changes are necessary, and parts of software must be made more robust. Yet, we confirmed that HRP-2 has the kinematic and power capabilities to climb real industrial ladders, such as those found in nuclear power plants and large scale manufacturing factories (e.g. aircraft, shipyard) and construction sites.