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131.
Sindo Kou 《JOM Journal of the Minerals, Metals and Materials Society》2003,55(6):37-42
Solidification cracking can occur in the fusion zone during the solidification of the weld metal. Liquation cracking, on the
other hand, can occur in the partially melted zone during the solidification of the liquated material. These two types of
cracking are reviewed in this article, including the factors that affect cracking and the remedies.
For more information, contact Sindo Kou, University of Wisconsin, Department of Materials Science and Engineering, 1509 University
Avenue, Madison, Wisconsin 53706; (608) 262-0576; fax (608) 262-8648; e-mail kou@engr.wisc.edu. 相似文献
132.
利用模糊控制器和神经元的优点,基于漏钢预报较成熟的热电偶方法,设计出一种基于漏钢预报的连铸拉速模糊控制系统,在保证不产生漏钢的前提下尽可能提高铸坯的拉速,从而提高钢产量。离线模拟结果了该方法的有效性。 相似文献
133.
Osamu Nakagawa Haruo Shimamoto Tetsuya Ueda Kou Shimomura Tsutomu Hata Toru Tachikawa Jiro Fukushima Toshinobu Banjo Isamu Yamamoto 《Journal of Electronic Materials》1989,18(5):633-643
As electronic devices become more highly integrated, the demand for small, high pin count packages has been increasing. We
have developed two new types of IC packages in response to this demand. One is an ultra thin small outline package (TSOP)
which has been reduced in size from the standard SOP and the other, which uses Tape Automated Bonding (TAB) technology, is
a super thin, high pin count TAB in cap (T.I.C.) package. In this paper, we present these packages and their features along
with the technologies used to improve package reliability and TAB. Thin packages are vulnerable to high humidity exposure,
especially after heat shock.1 The following items were therefore investigated in order to improve humidity resistance: (1)
The molding compound thermal stress, (2) Water absorption into the molding compound and its effect on package cracking during
solder dipping, (3) Chip attach pad area and its affect on package cracking, (4) Adhesion between molding resin and chip attach
pad and its affect on humidity resistance. With the improvements made as a result of these investigations, the reliability
of the new thin packages is similar to that of the standard thicker plastic packages. 相似文献
134.
Shin’ichi Konno Shigeo Kazama Maki Hiraoka Hirokazu Sakamoto Kenji Mizoguchi Hiromi Taniguchi Toshikazu Nakamura Kou Furukawa 《Journal of Low Temperature Physics》2006,142(3-4):621-624
β′-(BEDT-TTF)(TCNQ) is a compound of BEDT-TTF (=ET) and TCNQ molecules aligned orthogonally with each other, forming two-dimensional
sheets and one-dimensional columns of 1/4-filled π band, respectively. It is known that the metal-insulator transition occurs
at 330 K at ambient pressure. We have measured the electronic spin susceptibility by means of the EPR-NMR method at 50 MHz,
and the angular dependence of g-factor and line width of EPR both at Q (34 GHz) and W (94 GHz) band. We successfully confirmed
that the antiferromagnetic transition occurs in ET sheets and TCNQ columns, independently. 相似文献
135.
136.
Jou Y.-D. Hsieh C.-H. Kou C.-M. 《Vision, Image and Signal Processing, IEE Proceedings -》1997,144(4):244-248
The weighted least-squares (WLS) technique has been widely used for the design of digital FIR filters. In the conventional WLS, the filter coefficients are obtained by performing a matrix inverse operation, which needs computation of O(N3). The authors present a new WLS algorithm that introduces an extra frequency response including implicitly the weight function. In the new algorithm, the filter coefficients can be solved just by a matrix vector multiplication. It reduces the computational complexity from O(N3 ) to O(N2) 相似文献
137.
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139.
Polyaniline (PANI)-coated multi-walled carbon nanotubes (PANI-CNTs) were firstly synthesized by in situ polymerization and then incorporated into the PANI matrix by hot pressing to fabricate bulk PANI-CNT/PANI composites. The composites showed homogeneously dispersed CNTs into the PANI matrix with a strong interface interaction. Thermoelectric measurements at room temperature showed a significant enhancement in both the electrical conductivity and Seebeck coefficient with the addition of PANI-CNTs. At the same time, relatively low thermal conductivity was also obtained. The maximum electrical conductivity and Seebeck coefficient of the composites were up to 2.8 × 103 S/m and 21.6 μ/K, respectively, and the maximum figure of merit reached 1.0 × 10?3 more than three orders of magnitude higher than that of neat PANI. This study proposed a novel and effective way to fabricate bulk PANI/CNT composites with enhanced thermoelectric properties. 相似文献
140.