Fermentation alters antioxidant capacity and polyphenol distribution in selected edible legumes

This study was designed to investigate the influences of fermentation by naturally occurring bacteria on legumes and lactic acid bacteria on antioxidant capacity and polyphenols in both soluble and bound extracts of eight common edible legumes, including black cow gram, mottled cowpea, speckled kidney bean, lentil, small rice bean, small runner bean and two soya beans. Fermentation had varying effects on the antioxidant capacity of soluble and bound extracts in different edible legumes, with fermented mottled cowpea, speckled kidney bean and small rice bean showing increased total antioxidant capacity. In addition, fermentation in general enhanced total phenolic content in all the selected legumes, which could be associated with the biotransformation between soluble phenolics and the release of bound phenolics induced by micro‐organisms involved in the fermentation process. Phenolic compounds, such as catechin, were increased in fermented mottled cowpea. Overall, fermentation could increase the bioavailability of legume polyphenols and fermented legume powders rich in antioxidant polyphenols can be used to develop novel functional foods.     

Dynamic changes in phytochemical composition and antioxidant capacity in green and black mung bean (Vigna radiata) sprouts

The mung bean (Vigna radiata) sprout is a popular fresh vegetable in many parts of the world. In this study, the dynamic change of ascorbic acid, phenolic composition and antioxidant capacity were evaluated in green and black mung bean sprouts. Germination increased ascorbic acid, total phenolic content and antioxidant capacity in both mung beans. The green mung bean sprout generally had higher ascorbic acid, total phenolic content and antioxidant capacity than the black mung bean sprout. Most phenolic compounds, such as caffeic acid, catechin, ferulic acid, gallic acid and rutin, were found to gradually increase after germination. Therefore, mung bean sprouts, especially green mung bean sprout possessing high level of antioxidant phytochemicals, can be valuable functional vegetables and good sources of natural antioxidants.     

针织服装面料的品种及发展趋势

从使用范围分析了针织面料的品种及不同纤维在针织面料中的应用.阐述了针织服装面料朝着新型高科技服装面料的发展趋势.     

射频识别:实现动物及其产品可追溯的有效手段——《动物射频识别——代码结构》国家标准开始实施

把一只电子芯片植入动物体内，管理人员只要利用专用设备，就可从中方便快捷地读取到其养殖场户的相关情况以及该动物养殖生产过程应用饲料、兽药和免疫防病等全部信息；而动物一经植入这种电子芯片，也就拥有了合法的身份证明，且不会被重复，具有全球惟一陛、特定性。从2006年12月1日开始实施的国家标准——《动物射频识别——代码结构》（GB／T20563—2006）将会使这一“梦想”尽快变为现实。     

石墨炉原子吸收法测定埃本膦酸钠中溶出铝

探讨了埃本磷酸钠注射液中微量溶出铝的测定方法 ,检出限为 2 0 μg/ml;检测范围为 2 0 μg/ml～ 10 0 0 μg/ml;回收率达到 95 %± 3%以上 ,通过实验值与推荐值的对照 ,验证了方法的可靠性 ,本方法灵敏度高、重复性好、干扰少     

Science Communication: What Every Scientist Can Do and a Physicist's Experience

本文从一名物理学家的视角出发,讲述了作者将物理教学实践和科学传播活动相结合的经历。作者认为,二者的良好结合不仅对自身的物理学研究有所帮助,还使他摸索到了以物理学方法研究历史的新手段,并对了解科学史有所启迪。结合自身的实践,作者向活跃在实践领域的科学家们提出以下建议:(1)将科普书的阅读融合于教学实践中;(2)在学科研讨会中加入科普内容,或举行专门的科普研讨会;(3)举办全校规模的科普系列讲座;(4)科学家可在中学、社区,以及其他场所宣传科普;(5)促进科普作为新兴学科的出现;(6)将科学与人文学科相结合。     

地下溶浸采矿技术与我国铀矿山的可持续发展

指出了我国铀矿山可持续发展中存在的问题，并提出一种新的开采技术——地下溶浸，描述了地下溶浸现状及技术工艺特点，论述了地下溶浸采矿技术对铀矿山可持续发展的影响。     

PZ系列组合牙轮钻头及其嵌岩技术的研究

介绍了ＰＺ系列组合牙轮钻头的技术参数、结构特点及使用性能,通过对单牙轮的受力分析,提出了ＰＺ系列组合牙轮钻头最低钻压理论值和最高转速值,从而为钻头合理使用提供了理论依据。     

山东及皖北上侏罗统及与邻区对比的大地构造意义

通过对研究区中生代地层典型剖面或代表性剖面系统考察和综合研究,对上侏罗统及其上覆、下伏岩石地层进行进一步系统清理和修订:(1)将济阳坳陷原上侏罗统蒙阴组划归下白垩统,与之相对应的是鲁西南地区为杨家庄组;将山东地区中—上侏罗统三台组界定为中侏罗统;(2)将皖北地区合肥盆地圆筒山组划入中—上侏罗统;原上侏罗统周公山组认为是跨时代地层单元(J3K1)。(3)大别山北麓北淮阳六安、金寨地区的凤凰台组、三尖铺组定为晚侏罗世早期。在此基础上建立了中国东部地区准确可行的地层对比关系,提出了与国际接轨的地层划分与对比表。对比结果表明中国东部晚侏罗世除了在南北缘存在沉积外,整个地区缺失上侏罗统。该现象表明中国东部在晚侏罗世仍为挤压应力环境甚至比早中侏罗世更为强烈,甚至一直维持到早白垩世初。     

Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Electronic portable devices are aimed towards higher response speed with a better viewing resolution display. Nonconductive paste (NCP) and nonconductive film (NCF) are the adhesive materials used in fine-pitch display applications. This study compares two commercially available adhesives for fine-pitch chip-on-flex (COF) applications. The electrical performance of the NCP-bonded COF was better compared to the NCF. The rheological properties of these materials in the initial stages and the mechanical properties of the adhesives after bonding are claimed to be the main factors. The semisolid form of the NCF which melts and flows slowly from the interconnection joints finally reduced the effective contact area in the joint as compared to the NCP. A low-pressure bonding caused entrapment of adhesive in the joints, induced stress accumulation in the Z-direction during high thermal loading, and a high coefficient of thermal expansion (CTE) mismatch in between bumps, adhesive, and electrode traces on the flexible substrate were the key factors for the degradation of electrical conductivity. A high load of 100 N and above was recommended since the effective contact area built into the interconnection was good and reliable after 400 cycles of a thermal shock test of -55degC-125degC. The NCP with a higher elastic modulus which ensures higher stiffness and stability towards elongation gave a better reliability in this environmental test. Cross sectioning and SEM analysis provide evidence of the effective contact area of the joint before and after the thermal cycle environmental test