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91.
A detailed review of SiGe epitaxial base technology is presented, which chronicles the progression of research from materials deposition through device and integration demonstrations, culminating in the first SiGe integrated circuit application. In part I of this paper, the requirements and processes for high-quality SiGe film preparation are discussed, with emphasis on fundamental principles. A detailed overview of SiGe HBT device design and implications for circuit applications is then presented  相似文献   
92.
Based on vectorial formulations which combine the surface integral equation method and the finite-element method, a novel numerical approach is proposed for calculating the dispersion coefficients of dual-mode elliptical-core fibers with arbitrary refractive index profiles. By differentiating the original formulations involving the propagation constant β and the guided mode fields Hx and Hy once and twice with respect to the normalized frequency V, the new formulations for {dβ/dV, dHx/dV, dHy/dV} and for {d2β/dV2, d2 Hx/dV2, d2Hy/dV2 } are obtained respectively. Once {β, Hx, Hy } is solved through the eigenvalue procedure which dominates the computing time, only a few matrix manipulations are required to obtain {dβ/dV, dHx/dV, dHy/dV} and {d2β/dV2, d2Hx/dV2 , d2Hy/dV2}. Some numerical examples are examined to see the influence of different refractive index distributions with dips on the dispersions of the four nondegenerate LP 11 modes for elliptical-core fibers  相似文献   
93.
High performance enhancement mode InP MISFET's have been successfully fabricated by using the sulfide passivation for lower interface states and with photo-CVD grown P3N5 film used as gate insulator. The MISFET's thus fabricated exhibited exhibited pinch-off behavior with essentially no hysteresis. Furthermore the device showed a superior stability of drain current. Specifically under the gate bias of 2 V for 104 seconds the room temperature drain current was shown to reduce from the initial value merely by 2.9% at the drain voltage of 4 V. The effective electron mobility and extrinsic transconductance are found to be about 2300 cm 2/V·s and 2.7 mS/mm, respectively. The capacitance-voltage characteristics of the sulfide passivated InP MIS diodes show little hysteresis and the minimum density of interface trap states as low as 2.6×1014/cm2 eV has been attained  相似文献   
94.
Several distributed power control algorithms that can achieve carrier-to-interference ratio (CIR) balancing with probability one have been proposed previously for cellular mobile systems. In these algorithms, only local information is used to adjust transmitting power. However, a normalization procedure is required in each iteration to determine transmitting power and, thus, these algorithms are not fully distributed. In this paper, we present a distributed power control algorithm which does not need the normalization procedure. We show that the proposed algorithm can achieve CIR balancing with probability one. Moreover, numerical results reveal our proposed scheme performs better than the algorithm presented in Grandhi et al. [1994]. The excellent performance and the fully distributed property make our proposed algorithm a good choice for cellular mobile systems  相似文献   
95.
Lin  H. Chang  K.-H. 《Electronics letters》2002,38(13):625-626
Novel high voltage pumping circuits for low supply voltages are proposed. Utilising a small pumping circuit and the new substrate-connected techniques can enhance charge transfer efficiency and eliminate the body effect at low supply voltages. Furthermore, a diode-connected transistor technique can improve the reverse charge sharing phenomenon when the output has a load current. With this technique high boosted voltages can be obtained at low supply voltages  相似文献   
96.
The matrix pencil (MP) method, based on the singular value decomposition (SVD), is applied to quantitative NMR spectroscopy. Its relationship to other SVD-based methods is also presented. Simulations and applications are given to demonstrate the capability of superior performance.©1993 John Wiley & Sons Inc  相似文献   
97.
98.
The effect of DC flux on the core loss is examined for the practical range of power and frequency. Relevant core loss equations are derived and applied to an optimization algorithm to determine the minimum core loss at a given ratio of s (DC flux density to AC peak flux density). It has been found that the curves of hysteresis loss density versus the ratio of s exhibit a peak at a critical ratio. Below or above this critical ratio, the loss density decreases drastically. On the other hand, the curves of eddy-current loss density versus the ratio of s exhibits a minimum point at a critical ratio. Below or above this critical ratio, the loss density increases gradually  相似文献   
99.
This paper reports a new, highly integrated modular design approach for pulsewidth-modulation AC-AC converters based on a modular phase-bank structure. Novel high-power 3-in-1 integrated bi-directional power modules (IBPM) rated at 1200-V AC and 150 A and the 3-to-1 phase bank circuits have been successfully developed, fabricated and tested. This enables the modularity design of the multiphase converter systems and reduces the critical parasitic inductance. A theoretical analysis of the IBPM's silicon utilization for this new breed of direct power converters has been outlined. A lab prototype at medium power level has been successfully designed, implemented, and tested with good results. A nearly 460-VRMS out voltage at a 1:0.955 voltage transfer ratio, which, perhaps, is the highest performance reported so far in the literature, has been achieved by the novel two-side modulation control system. The converter-fed AC motor system is able to operate over the 0-240 Hz range with inherent regenerative capability and four-quadrant operation. Potential industrial applications are also briefly highlighted in this paper  相似文献   
100.
In addition to providing electrical connections, solder is useful in the formation of passive, precision alignments for optoelectronic packaging. Different designs have demonstrated micrometer-level alignment accuracies, and the aligned structures are becoming more and more complex. Solder engineering has been successfully introduced into the field of optoelectronics, and it is expected to be applied to many other areas demanding low-cost, precision alignments.  相似文献   
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