Analysis on the effectiveness of the 20-H rule for printed-circuit-board layout to reduce edge-radiated coupling

This paper presents the quantified study of the electromagnetic radiation mechanism of the 20-H rule using a numerical approach that has not yet been systematically addressed. The 20-H rule is a rule-of-thumb layout technique recommended to minimize radiated fields propagating from the edges of a printed circuit board (PCB) coupling onto nearby structures. Propagating electromagnetic fields may corrupt adjacent cable assemblies, sheet metal enclosures, and aperture openings. The magnitude of this design rule is investigated using the full-wave finite-difference time-domain (FDTD) method. An analysis on whether benefits exist from use of this rule is examined and under what conditions the rule is valid when correctly implemented. The purpose of this paper is to provide insight into the validity of the 20-H rule, recognizing that every PCB will have different simulation results. FDTD is used to capture a snapshot view of field propagation. This view allows one to determine the validity of the 20-H rule at a single point of time within a dynamic structure and what may be expected when digital components are finally added to a PCB assembly, which generally negates simulated results.     

在不断创新中开创新的百年——水口山有色金属集团有限公司110年创新发展历程和展望

回顾了水口山有色金属集团有限公司的发展历程，概述了取得的技术进步和主要成就．提出了企业今后的发展方向。     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.     

电视导引头模型参考控制器设计

借鉴模型参考控制器的设计思想,采用经过线性二次型输出反馈控制后的系统作为参考模型,以它的输出作为期望输出,让实际输出跟随这个期望输出;二者的误差信号反馈到原系统的输入端,设计出一种模型参考控制器.经该控制器优化后,电视导引头系统的快速性可得到较大提高.参考模型可由RC网络或计算机软件来实现.     

氨氮监测中样品蒸馏预处理对结果的影响分析

氨氮监测采用预蒸馏处理后，比色测定结果明显偏低。在样品预蒸馏处理过程中，硼酸作为吸收液，使显色时溶液pH值偏低，导致显色不充分是其主要影响因素。通过采取增加显色剂加入量的方法，解决了显色pH值偏低的问题，得到满意的测定结果。     

The new structure of fibre glass reinforced plastics bolt

The develop actuality and direction of FRP (fibre glass reinforced plastics) bolt in the world are analyzed. The new type structure of FRP bolt was designed. Trial data indicate that, all kinds of capability target of this FRP bolt all achieve and exceed the country stand-ard, substitute present metal bolt, wood bolt and bamboo bolt and other side bolt, it can gain magnitude technology and economy benefit. FRP bolt mechanization product line produce ef-ficiency is high, its throughput a day are 750 base, this can meet demand of hit-small mining company.     

企业不但应该做大更应该做强

从入世的角度 ,分析了我国企业在重组过程中存在的问题 ,并指出了我国企业做强做大的紧迫性