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21.
Jan van Eijck 《Formal Aspects of Computing》1994,6(1):766-787
Presuppositions of utterances are the pieces of information you convey with an utterance no matter whether your utterance is true or not. We first study presupposition in a very simple framework of updating propositional information, with examples of how presuppositions of complex propositional updates can be calculated. Next we move on to presuppositions and quantification, in the context of a dynamic version of predicate logic, suitably modified to allow for presupposition failure. In both the propositional and the quantificational case, presupposition failure can be viewed as error abortion of procedures. Thus, a dynamic assertion logic which describes the preconditions for error abortion is the suitable tool for analysing presupposition. 相似文献
22.
23.
本文提出新型布线算法,集李氏迷宫法与线搜索法的长处为一体,以饱和带法进行动态排序,以线搜索法确定借孔位置,然后用李氏法进行单层布线,获得最佳路径,从而达到线型好,布通率高的效果。 相似文献
24.
心电地图仪中工频干扰的一种滤除方法 总被引:1,自引:0,他引:1
在心电地图仪中记录到的体表心电信号往往由于电磁的影响而引进工频干扰.基于体表心电信号中工频干扰的特点,作者提出了一种滤除工频干扰的方法,即就单独—胸导联信号通过提高频谱的分辨率来估计工频干扰的频率;基于最小均方误差准则来估计各导联信号中工频干扰的幅度和相位。文中还给出了该算法的流程图和滤波性能分析。模拟结果表明了该算法的有效性。应用该算法对心电地图仪中的工频干扰进行对消,取得了满意的结果。 相似文献
25.
The purpose of this study is to examine the interface between financial strain, informal received economic support, informal anticipated financial support, and psychological distress in later life. Data provided by a large probability sample of older adults in the People's Republic of China reveal that the relationship between financial difficulty and psychological distress is stronger for older adults who receive more economic assistance. However, the results involving anticipated support are in the opposite direction. More specifically, the association between financial problems and psychological distress is lower for older adults who believe that others stand ready to help in the future should the need arise. A detailed theoretical rationale is developed to explain these results. (PsycINFO Database Record (c) 2010 APA, all rights reserved) 相似文献
27.
Liang Y.C. Wenjiang Zeng Pick Hong Ong Zhaoxia Gao Jun Cai Balasubramanian N. 《Electron Device Letters, IEEE》2002,23(12):700-703
In this letter, a concise process technology is proposed for the first time to enable the fabrication of good quality three-dimensional (3-D) suspended radio frequency (RF) micro-inductors on bulk silicon, without utilizing the lithography process on sidewall and trench-bottom patterning. Samples were fabricated to demonstrate the applicability of the proposed process technology. 相似文献
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30.
Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy 总被引:1,自引:0,他引:1
Wen-Chung Li Shun-Tian Lin Cheng Liang 《Metallurgical and Materials Transactions A》2002,33(7):2163-2172
Diamond grits were brazed onto a steel substrate using a prealloyed Cu-10Sn-15Ti (wt pct) brazing alloy at 925 °C and 1050
°C. Due to the relatively high concentration of Ti in the brazing alloy, the braze matrix exhibited a composite structure,
composed of β-(Cu,Sn), a Cu-based solid solution, and various intermetallic compounds with different morphologies. The reaction of Ti with
diamond yielded a continuous TiC layer on the surfaces of the diamond grits. On top of the TiC growth front, an intermetallic
compound, composed of Sn and Ti, nucleated and grew into a randomly interwoven fine lacey structure. An interfacial structure
developed as the interwoven fine lacey phase was semicoherently bonded to the TiC layer, with the Cu-based braze matrix filling
its interstices. The thickness of such a composite layer was increased linearly with the square root of isothermal holding
time at 925 °C, complying with the law of a diffusion-controlled process. However, at 1050 °C, the segregation behavior of
Ti and Sn to the interfaces between the TiC layer and the braze matrix diminished, due to the increased solubility of Ti in
the Cu-based liquid phase. The enhanced dissolution of Ti in the Cu-based liquid phase at 1050 °C also caused the precipitation
of rod-like CuTi with an average diameter of about 0.2 μm during cooling. SnTi3 was the predominant intermetallic compound and existed in three different forms in the braze matrix. It existed as interconnected
grains of large size which either floated to the surface of the braze matrix or grew into faceted grains. It also exhibited
a nail-like structure with a mean diameter of about 1 μm for the rod section and a lamellar structure arising from a eutectic reaction during cooling. 相似文献