回火过程应力场计算机模拟

回火过程应力场计算机模拟林家骝，杨振枢，于震宗，段贵明（清华大学）郭剑仁，史全兴，谢克仁（内蒙古第一机器厂）ＡＳｔｕｄｙｏｆＮｕｍｅｒｉｃａｌＳｉｍｕｌａｔｉｏｎｏｆＳｔｒｅｓｓＦｉｅｌｄｄｕｒｉｎｇＴｅｍｐｅｒｉｎｇ￥ＬｉｎＪｉａｌｉｕ；ＹａｎｇＺ...     

新型可见光固化口腔正畸粘合剂研制

介绍了一种新型可见光固化正畸粘合剂的组成、性能及正畸粘接的工艺。此粘合剂由一种单组分液体底胶和单组分糊剂组成。与化学固化粘合剂相比,其操作使用方便,固化时间短。这种新型粘合剂的粘接强度完全满足了正畸粘合剂的要求。     

填充母料及其他常用塑料母料

塑料母料对推动塑料工业的迅猛发展起了很大作用，其主要特点是：可以简化生产工艺过程：原料混合方便，混炼质量均匀，提高生产效率及制品性能指标；减少粉尘飞扬及对设备的磨损；降低制品在换色时清洗螺杆的用料量；延长原料储存的保质期等。     

两步法合成大粒径丁苯胶乳

研究了聚甲基丙烯酸甲酯（MMA）对丁苯（BS）胶乳的附聚作用以增大丁苯胶乳粒径；探讨了无机盐、体系pH值及体系中MMA胶乳与BS胶乳的固含量比（R值）对附聚后丁苯胶乳的粒径及稳定性的影响。结果表明：适当添加无机盐可以稳定胶乳体系，最佳用量（质量分数）为0．1％～0．2％；适当增大体系pH值，可增大胶乳粒径；在附聚过程中，当R值在两个附聚峰附近时，可增大丁苯胶乳的粒径。     

汽车灯用热熔胶的研究及性能表征

介绍了生产汽车灯用热熔胶的各种原料及其在胶粘剂中所起的主要作用，为汽车灯用热熔胶原料的选择提供了参考。还介绍了汽车灯用热熔胶的制备过程和厂家所需的各种性能及其表征方法。通过选择适当的原料及配比，生产出性能优良并具有良好市场前景的产品。     

Fabrication and characterization of nano silver powder prepared by spray pyrolysis

Silver powder was fabricated by spray pyrolysis, using 2%–20% AgNO₃ solution, 336–500 mL/h flux of AgNO₃ solution, 0.28–0.32 MPa flux of carrier gas and in the 620–820 °C temperature range. The effects of furnace set temperature, concentration of AgNO₃ aqueous solution, flux of AgNO₃ aqueous solution as well as carrier gas on the morphology and particle size distribution of silver powder, were investigated. The experimental results showed that with the high concentration of AgNO₃ aqueous solution, the average grain size of silver decreased with the increasing of furnace set temperature. But the gain size distribution was not homogenous, the discontinuous grain growth occurred. With the low concentration of AgNO₃ aqueous solution, the higher furnace set temperature made the nano sliver grains sintered together to grow. Nano silver powder about 100 nm was fabricated by spray pyrolysis, using 2wt% AgNO₃ solutions, 336 mL/h flux of AgNO₃ aqueous solution, 0.32 MPa flux of carrier gas at 720 °C furnace set temperature.     

Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly

The serious warpage issues of ultrathin chip-on-flex (UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.     

安钢SAP预留系统的开发与应用

本文简述了安钢信息化建设概况,介绍了安钢信息化建设中开发SAP预留系统的设计流程,阐述了预留系统实现的功能.