Decreasing-size distributed ESD protection scheme for broad-band RF circuits

The capacitive load, from the large electrostatic discharge (ESD) protection device for high ESD robustness, has an adverse effect on the performance of broad-band RF circuits due to impedance mismatch and bandwidth degradation. The conventional distributed ESD protection scheme using equal four-stage ESD protection can achieve a better impedance match, but degrade the ESD performance. A new distributed ESD protection structure is proposed to achieve both good ESD robustness and RF performance. The proposed ESD protection circuit is constructed by arranging ESD protection stages with decreasing device size, called as decreasing-size distributed electrostatic discharge (DS-DESD) protection scheme, which is beneficial to the ESD level. The new proposed DS-DESD protection scheme with a total capacitance of 200 fF from the ESD diodes has been successfully verified in a 0.25-mum CMOS process to sustain a human-body-model ESD level of greater than 8 kV     

A new Schmitt trigger circuit in a 0.13-/spl mu/m 1/2.5-V CMOS process to receive 3.3-V input signals

A new Schmitt trigger circuit, which is implemented by low-voltage devices to receive the high-voltage input signals without gate-oxide reliability problem, is proposed. The new proposed circuit, which can be operated in a 3.3-V signal environment without suffering high-voltage gate-oxide overstress, has been fabricated in a 0.13-/spl mu/m 1/2.5-V 1P8M CMOS process. The experimental results have confirmed that the measured transition threshold voltages of the new proposed Schmitt trigger circuit are about 1 and 2.5 V, respectively. The new proposed Schmitt trigger circuit is suitable for mixed-voltage input-output interfaces to receive input signals and reject input noise.     

The impact of low-holding-voltage issue in high-voltage CMOS technology and the design of latchup-free power-rail ESD clamp circuit for LCD driver ICs

The holding voltage of the high-voltage devices in snapback breakdown condition has been found to be much smaller than the power supply voltage. Such characteristics will cause the LCD driver ICs to be susceptible to the latchup-like danger in the practical system applications, especially while these devices are used in the power-rail ESD clamp circuit. A new latchup-free design on the power-rail ESD clamp circuit with stacked-field-oxide structure is proposed and successfully verified in a 0.25-/spl mu/m 40-V CMOS process to achieve the desired ESD level. The total holding voltage of the stacked-field-oxide structure in snapback breakdown condition can be larger than the power supply voltage. Therefore, latchup or latchup-like issues can be avoided by stacked-field-oxide structures for the IC applications with power supply of 40 V.     

New Gate-Bias Voltage-Generating Technique With Threshold-Voltage Compensation for On-Glass Analog Circuits in LTPS Process

A new proposed gate-bias voltage-generating technique with threshold-voltage compensation for analog circuits in the low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs) is proposed. The new proposed gate-bias voltage-generating circuit with threshold-voltage compensation has been successfully verified in an 8-mum LTPS process. The experimental results have shown that the impact of TFT threshold-voltage variation on the biasing circuit can be reduced from 30% to 5% under a biasing voltage of 3 V. The new proposed gate-bias voltage-generating technique with threshold-voltage compensation enables the analog circuits to be integrated and implemented by the LTPS process on glass substrate for an active matrix LCD panel.     

Ultra-High-Voltage Charge Pump Circuit in Low-Voltage Bulk CMOS Processes With Polysilicon Diodes

An on-chip ultra-high-voltage charge pump circuit realized with the polysilicon diodes in the low-voltage bulk CMOS process is proposed in this work. Because the polysilicon diodes are fully isolated from the silicon substrate, the output voltage of the charge pump circuit is not limited by the junction breakdown voltage of MOSFETs. The polysilicon diodes can be implemented in the standard CMOS processes without extra process steps. The proposed ultra-high-voltage charge pump circuit has been fabricated in a 0.25-mum 2.5-V standard CMOS process. The output voltage of the four-stage charge pump circuit with 2.5-V power-supply voltage (VDD=2.5 V) can be pumped up to 28.08 V, which is much higher than the n-well/p-substrate breakdown voltage (~18.9 V) in a 0.25-mum 2.5-V bulk CMOS process     

Analysis on the dependence of layout parameters on ESD robustness of CMOS devices for manufacturing in deep-submicron CMOS process

The layout dependence on ESD robustness of NMOS and PMOS devices has been experimentally investigated in details. A lot of CMOS devices with different device dimensions, layout spacings, and clearances have been drawn and fabricated to find the optimized layout rules for electrostatic discharge (ESD) protection. The main layout parameters to affect ESD robustness of CMOS devices are the channel width, the channel length, the clearance from contact to poly-gate edge at drain and source regions, the spacing from the drain diffusion to the guard-ring diffusion, and the finger width of each unit finger. Non-uniform turn-on effects have been clearly investigated in the gate-grounded large-dimension NMOS devices by using EMMI (EMission MIcroscope) observation. The optimized layout parameters have been verified to effectively improve ESD robustness of CMOS devices. The relations between ESD robustness and the layout parameters have been explained by both transmission line pulsing (TLP) measured data and the energy band diagrams.     

High performance concrete containing lower slag amount: A complex view of mechanical and durability properties

A wide set of parameters of concrete containing 10% of ground granulated blast furnace slag as Portland cement replacement involving basic material characteristics, mechanical and fracture-mechanical properties, durability characteristics, hydric and thermal properties and chloride binding characteristics is determined and compared with the parameters of reference Portland cement concrete with otherwise the same composition. The experimental results show that the replacement of Portland cement by even such a low amount of ground granulated blast furnace slag as environmental more friendly and still valuable alternative binder either affects positively or at least does not worsen in a significant way the substantial properties of hardened concrete mix. The mechanical and fracture-mechanical properties are found to be very similar as compared to the reference mix, the liquid water transport parameters of the mix containing slag are significantly better, the basic durability characteristics such as the frost resistance and corrosion resistance similar and very good, the resistance against de-icing salts slightly worse. These findings may be significant for the future use of slag in the countries where its available amount is decreasing and its more efficient use as a binder than it was common to date can appear necessary.     

Derivation of Error Distribution in Least Squares Steganalysis

This paper considers the least squares method (LSM) for estimation of the length of payload embedded by least-significant bit replacement in digital images. Errors in this estimate have already been investigated empirically, showing a slight negative bias and substantially heavy tails (extreme outliers). In this paper, (approximations for) the estimator distribution over cover images are derived: this requires analysis of the cover image assumption of the LSM algorithm and a new model for cover images which quantifies deviations from this assumption. The theory explains both the heavy tails and the negative bias in terms of cover-specific observable properties, and suggests improved detectors. It also allows the steganalyst to compute precisely, for the first time, a p-value for testing the hypothesis that a hidden payload is present. This is the first derivation of steganalysis estimator performance     

ESD failure mechanisms of analog I/O cells in 0.18-/spl mu/m CMOS technology

Different electrostatic discharge (ESD) protection schemes have been investigated to find the optimal ESD protection design for an analog input/output (I/O) buffer in 0.18-/spl mu/m 1.8- and 3.3-V CMOS technology. Three power-rail ESD clamp devices were used in power-rail ESD clamp circuits to compare the protection efficiency in analog I/O applications, namely: 1) gate-driven NMOS; 2) substrate-triggered field-oxide device, and 3) substrate-triggered NMOS with dummy gate. From the experimental results, the pure-diode ESD protection devices and the power-rail ESD clamp circuit with gate-driven NMOS are the suitable designs for the analog I/O buffer in the 0.18-/spl mu/m CMOS process. Each ESD failure mechanism was inspected by scanning electron microscopy photograph in all the analog I/O pins. An unexpected failure mechanism was found in the analog I/O pins with pure-diode ESD protection design under ND-mode ESD stress. The parasitic n-p-n bipolar transistor between the ESD clamp device and the guard ring structure was triggered to discharge the ESD current and cause damage under ND-mode ESD stress.