Noise generation and coupling mechanisms in deep-submicron ICs

On-chip noise generation and coupling is an important issue in deep-submicron technologies. Advanced IC technology faces new challenges to ensure function and performance integrity. Selecting adequate test techniques depends on the circuit, its implementation, and the possible physical failures and parasitic coupling models. This new demand for test technology practices precipitated the investigation of dl/dt and dV/dt noise generation and propagation mechanisms     

OPTIMAL BLENDING OF MALTS

A method is discussed for the prediction of the analytical results of blends of malt. The method takes account of the possibility of non-linear interactions between malts when they are mashed by analysing a defined and limited number of blends of the malts as well as the pure malts themselves. A simple mathematical analysis of the experimental points allows the analytical result for any blend to be predicted. Seven analyses are necessary to a blend of three malts: fifteen would be required for a blend of four malts.     

Random bounce algorithm: real-time image processing for the detection of bats and birds

Wind energy plants generate an impact on wildlife with significant fatality rates for various bat and bird species, e.g. due to a collision with the rotor blades. Monitoring approaches, such as vision-based systems, are needed to reduce their mortality by means of an optimized turbine control strategy as soon as flying animals are detected. Since manual analysis of the video data is ineffective, automatic video processing with real-time capabilities is required. In this paper, we propose the random bounce algorithm (RBA) as a novel real-time image processing method for vision-based detection of bats and birds. The RBA is combined with object tracking in order to extract flight trajectories. Its performance is compared with connected components object detection. Results from a laboratory flight tunnel as well as from a field study at a 2 MW wind energy plant in Southern Germany will be presented and discussed. We have successfully detected and tracked objects both in laboratory experiments with many animals and in field experiments with individual animals at a frame rate of 10 fps.     

灵活的背板设计:在密集系统中集成更多功能

如今,元器件安装密度很高的嵌入式系统机柜已经变得十分常见,而人们对以更低成本实现可扩展性产品的追求,给系统平台设计者带来了各种挑战.因为需要在不断缩小的机柜空间内实现气流、电缆走线、系统管理集成、高带宽和系统管理集成等方面的平衡,灵活和富有创造性的设计就变得极为重要.     

SintClad: A New Approach for the Production of Wear-Resistant Tools

Tools used in the mineral processing industry are required to feature high wear resistance to facilitate an adequate cost efficiency. These kinds of tools are made of composite materials based on a low-alloyed substrate material and a high-alloyed coating. The coatings can be applied in different ways using production processes like HIP cladding, deposit welding, and composite casting. The article is concerned with the problem of a novel and cost-effective coating alternative: sinter cladding, using the principle of super-solidus liquid-phase sintering (SLPS). Usually SLPS represents a sintering technique, which is used for the compaction of high-alloyed metal powders. However, no recognizable efforts were made to use the SLPS-process for applying a PM-coating on a bulk substrate material. Sinter cladding for the first time uses SLPS to combine the process of powder compaction with the application of a coating to a solid steel substrate into one single step. Another advantage of the process is the possibility to produce massive bulk coatings with thicknesses exceeding 20 mm. This article is original in the scope of question and investigation methods in terms of microstructure, hardness profiles, EDX measurements, diffusion calculations, and computational thermodynamics.     

Integrating Through-Wafer Interconnects With Active Devices and Circuits

Through wafer interconnects (TWIs) enable vertical stacking of integrated circuit chips in a single package. A complete process to fabricate TWIs has been developed and demonstrated using blank test wafers. The next step in integrating this technology into 3D microelectronic packaging is the demonstration of TWIs on wafers with preexisting microcircuitry. The circuitry must be electrically accessible from the backside of the wafer utilizing the TWIs; the electrical performance of the circuitry must be unchanged as a result of the TWI processing; and the processing must be as cost effective as possible. With these three goals in mind, several options for creating TWIs were considered. This paper explores the various processing options and describes in detail, the final process flow that was selected for testing, the accompanying masks that were designed, the actual processing of the wafers, and the electrical test results.     

Size-dependent electron transfer from PbSe quantum dots to SnO2 monitored by picosecond Terahertz spectroscopy

We report the direct and unambiguous determination of electron transfer rates and efficiencies from PbSe quantum dots (QDs) to mesoporous SnO2 films. We monitor the time-dependent electron density within the oxide with picosecond time resolution using Terahertz spectroscopy, following optical excitation of the QDs using a femtosecond laser pulse. QD-oxide electron transfer occurs with efficiencies of ～2% in our samples under 800 nm pumping with a marked dependence on QD size, ranging from ～100 ps injection times for the smallest, ～2 nm diameter QDs, to ～1 ns time scale for ～7 nm QDs. The size-dependent electron transfer rates are modeled within the framework of Marcus theory and the implications of the results for device design are discussed.