Two versions of architectures for dynamic implied addressing mode

The complexity of today’s embedded applications increases with various requirements such as execution time, code size or power consumption. To satisfy these requirements for performance, efficient instruction set design is one of the important issues because an instruction customized for specific applications can make better performance than multiple instructions in aspect of fast execution time, decrease of code size, and low power consumption. Limited encoding space, however, does not allow adding application specific and complex instructions freely to the instruction set architecture. To resolve this problem, conventional architectures increases free space for encoding by trimming excessive bits required beyond the fixed word length. This approach however shows severe weakness in terms of the complexity of compiler, code size and execution time. In this paper, we propose a new instruction encoding scheme based on the dynamic implied addressing mode (DIAM) to resolve limited encoding space and side-effect by trimming. We report our two versions of architectures to support our DIAM-based approach. In the first version, we use a special on-chip memory to store extra encoding information. In the second version, we replace the memory by a small on-chip buffer along with a special instruction. We also suggest a code generation algorithm to fully utilize DIAM. In our experiment, the architecture augmented with DIAM shows about 8% code size reduction and 18% speed up on average, as compared to the basic architecture without DIAM.     

Tracking of moving interfaces in sedimentation processes using electrical impedance tomography

Sedimentation monitoring is widely used to control and optimize industrial processes. In this paper we propose a novel computational method for sedimentation monitoring using electrical impedance tomography (EIT). EIT measurements consist of electric current and voltage measurements that are made on the surface of the sedimentation tank and therefore they do not interfere with the sedimentation process. The proposed computational method is based on shape estimation and state estimation formulation of the EIT problem. The sedimentation is parameterized by the locations of the phase interfaces and conductivities of the phase layers. Three different evolution models for the state parameters are considered and the state estimates are computed using the extended Kalman filter algorithm. The performance of the method and the models are evaluated using simulated data from a six electrode EIT measurement configuration. From the results a promising performance of the method can be seen.     

High performance series-resonance energy-recovery circuit for plasma display panel

A new high performance series-resonance energy-recovery circuit (ERC) for a plasma display panel (PDP) is proposed. Two different ERCs are used for both sides of the PDP, and the slow falling and fast rising times are employed. Therefore, it features the zero voltage switching, low electromagnetic interference, low current stress, no severe voltage notch, and high energy-recovery capability.     

Dynamic anti-windup based control method for state constrained systems

Based on the dynamic anti-windup strategy, an alternative control methodology for state constrained systems is presented. The proposed method is an a posteriori approach for state constrained systems, which is differentiated from the usual a priori approach. That is, first a linear controller is designed to show a desirable nominal performance by ignoring state constraints. Then, an additional compensator is introduced to account for state constraints. By minimizing a reasonable performance index, a dynamic compensator is derived explicitly, which is expressed in plant and controller parameters. The proposed method not only provides a graceful performance degradation, but it also guarantees the total stability of the resulting systems. An illustrative example is given to show the effectiveness of the proposed method.     

Experiments on thermal stratification in inlet nozzle of steam generator

Nuclear power plant components suffer pipe shedding, cracking, thermal fatigue, bending and supporting bracket breakage during their life span. Notably, the horizontal inlet nozzle of steam generator is prone to thermal stratification frequently due to its operational characteristics. As a result, PWRs in many countries including the U.S.A. suffered a lot of pipe cracks and leakages around the late 1970s, as the thermal stress inflicted by thermal stratification formed in the horizontal inlet nozzle of steam generator during transition (auxiliary feedwater injection) was not reflected on power plant design. Therefore, we classified the nuclear power plants in Korea into KSNP and Westinghouse-type(W) power plants (Kori # 1,2,3,4, Yeonggwang # 1,2 and Uljin # 1,2) and conducted an experiment on thermal stratification and thermal cycling in relation to the volume of auxiliary feedwater injected into the horizontal inlet nozzle of steam generator and hot water flowing back from steam generator. As a result, it was found out that KSNP was hardly prone to thermal stratification while thermal stratification occurred in the horizontal inlet nozzle of steam generator in Westinghouse-tvpe(W) power plants, necessitating a solution to address such a phenomenon.••     

The effects of process conditions and substrate on copper MOCVD using liquid injection of (hfac)Cu(vtmos)

Copper MOCVD (metalorganic chemical vapor deposition) using liquid injection for effective delivery of the (hfac)Cu(vtmos) [1,1,1,5,5,5-hexafluoro-2,4-pentadionato(vinyltrimethoxysilane) copper(I)] precursor has been performed to clarify growth behavior of copper films onto TiN, <100> Si, and Si₃N₄ substrates. Especially, we have studied the influences of process conditions and the substrate on growth rates, impurities, microstructures, and electrical characteristics of copper films. As the reactor pressure was increased, the growth rate was governed by a pick-up rate of (hfac)Cu(vtmos) in the vaporizer. The apparent activation energy for copper growth over the surface-reaction controlled regime from 155°C to 225°C was in the range 12.7–32.5 kcal/mol depending upon the substrate type. It revealed that H₂ addition at 225°C substrate temperature brought about a maximum increase of about 25% in the growth rate compared to pure Ar as the carrier gas. At moderate deposition temperatures, the degree of a <111> preferred orientation for the deposit was higher on the sequence of <Cu/Si<Cu/TiN<Cu/Si₃N₄. The relative impurity content within the deposit was in the range 1.1 to 1.8 at.%. The electrical resistivity for the Cu films on TiN illustrated three regions of the variation according to the substrate temperature, so the deposit at 165°C had the optimum resistivity value. However, the coarsened microstructures of Cu on TiN prepared above 275°C gave rise to higher electrical resistivities compared to those on Si and Si₃N₄ substrates.     

Energy Efficiency Analysis of MISO-OFDM Communication Systems Considering Power and Capacity Constraints

In this paper, the energy efficiency of multi-input single-output and orthogonal frequency division multiplexing (MISO-OFDM) communication systems with power and capacity constraints is investigated. By formulating the power allocation problem of MISO-OFDM communication systems, the minimum subchannel transmission power is analyzed with power and capacity constraints. Simulation results indicate that there exists a specific minimum subchannel capacity threshold. Moreover, the energy efficiency of MISO-OFDM communication systems starts to increase only when the minimum subchannel capacity exceeds the specific threshold.     

Grafting maleic anhydride onto EVA and effect on the physical and rheological properties of PETG/EVA-g-MAH blends

Maleic anhydride (MAH) was grafted onto ethylene vinyl acetate copolymer (EVA) in the internal mixer in the presence of dicumyl peroxide (DCP), and a prepared reactive compatibilizer, MAH-g-EVA, was blended with Poly (ethylene glycol-co-cyclohexane-1,4-dimethanol terephthalate) (PETG). The gel content determination and element analysis (EA) was performed to confirm the grafting reaction. It was found that grafting reaction of MAH on to EVA could compete with crosslinking reaction of DCP during the modification process. In addition, the introduction of small amount of MAH showed a great effect on reducing gel content by decreasing crosslink reaction. As MAH content increased, grafted MAH concentration increased, whereas the grafting yield decreased. It was also confirmed that MAH-g-EVA acted as a reactive compatibilizer in the blend with PETG, and enhanced compatibility by reacting with the hydroxyl end groups, OH, of PETG. Addition of EVA in the blend leads a plastic deformation of PETG, and MAH had a great effect on enhancing interfacial adhesion resulting in significant increasing of % strain; however, improved compatibility could not be changed much in low strain tensile strength and Young's modulus. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Biodegradable polycaprolactone/cuttlebone scaffold composite using salt leaching process

We prepared biodegradable polycaprolactone/cuttlebone scaffold composite by salt leaching process. In the first step, a co-continuous blend of biodegradable materials, polycaprolactone (PCL) and cuttlebone (CB), and an amount of sodium chloride salt particles were mixed using a stirrer. Next, the extraction of mineral salts using de-ionized distilled water was performed using a biodegradable PCL/CB scaffold with fully interconnected pores. Finally, the durable morphology of the scaffolds was fabricated by freeze-drying process at ?53 °C for 24 hrs in a vacuum. In addition, the quadrilateral pres ranged from about 250 to 300 ??m in diameter. Scanning electron microscopy (SEM) and mercury intrusion porosimeter techniques were carried out to characterize the pore morphology. By increasing the CB and sodium chloride salt particle content, the number of interconnected pores, material properties, and pore morphology were dramatically changed. The average compressive strengths (load at 50% strain) of the different porous PCL/CB scaffolds were found to decrease from 133 to about 79 (load at 50% strain, gf) with an increase in porosity. The values of the porosity increased as the sodium chloride salt volume fraction increased