Comparative Assessment of Adaptive Body-Bias SOI Pass-Transistor Logic

A very low voltage transconductor for video frequency range applications and compatible with standard CMOS technology is described. In the proposed transconductor, except the DC level shifter circuit (DCLS), the whole transconductor uses the main supply voltage [which can be as low as 1.5 V in a standard 0.6 μm CMOS technology] while the DCLS uses a simple charge-pump circuit as its supply voltage and has a very low current consumption. In addition, proper common-mode sense and charge-pump circuits are developed for this low-voltage application. Meanwhile, some techniques to improve the frequency response, linearity, and noise performance of the proposed transconductor are described. In a standard 0.6 μm CMOS technology and single 1.5 V supply, simulations show that the proposed transconductor futures a THD of −50 dB for 1.4 V_pp and 10 MHz input signal and −60 dB for 1.4 V_pp and 1 MHz signal where the threshold voltage of MOS transistors could be as high as 1 V. Based on the proposed transconductor, a lowpass filter with 700 kHz to 8 MHz programmable cutoff frequency and a bandpass 10.7 MHz second order filter were implemented. Armin Tajalli received the B.Sc. from Sharif University of Technology (SUT), Tehran, Iran, in 1997, and M.Sc. from Tehran Polytechnic University, Tehran, Iran, in 1999. From 1998 he has joint Emad Co. as a senior design engineer were he has worked on several industrial and R&D projects on analog and mixed-mode ICs. He received the award of the Best Design Engineer from Emad Co., 2001, the Kharazmi Award of Industrial Research and Development, Iran, 2002, and Presidential Award of the Best Iranian Researchers, in 2003. He is now working toward his PhD degree at SUT. His current interests are design of high speed circuits for telecommunication systems. Mojtaba Atarodi received the B.S.E.E. from Amir Kabir University of Technology (Tehran Polytechnic) in 1985, and M.Sc. degree in electrical engineering from the University of California, Irvine, in 1987. He received the Ph.D. degree from the University of Southern California (USC) on the subject of analog IC design in 1993. From 1993 to 1996 he worked with Linear Technology Corporation as a senior analog design engineer. Since then, he has been consulting with different IC companies. He is currently a visiting professor at Sharif University of Technology. He has published more than 30 technical papers in the area of analog and mixed-signal integrated circuit design as well as analog CAD tools.     

Voltage‐Mode 1.5 Gbps Interface Circuits for Chip‐to‐Chip Communication

In this paper, interface circuits that are suitable for point‐to‐point interconnection with an over 1 Gbps data rate per pin are proposed. To achieve a successful data transfer rate of multi‐gigabits per‐second between two chips with a point‐to‐point interconnection, the input receiver uses an on‐chip parallel terminator of the pass gate style, while the output driver uses the pullup and pulldown transistors of the diode‐connected style. In addition, the novel dynamic voltage level converter (DVLC) has solved such problems as the access time increase and valid data window reduction. These schemes were adopted on a 64 Mb DDR SRAM with a 1.5 Gbps data rate per pin and fabricated using a 0.10 µm dual gate oxide CMOS technology.     

Floating-patch MEMS antennas on HRS substrate for millimetre-wave applications

Novel floating-patch micro-electro-mechanical system (MEMS) antennas are proposed for millimetre-wave applications. The floating-patch MEMS antennas are fabricated on a high resistivity silicon (HRS) substrate using surface micromachining technology. Simulation and experimental results for reflection coefficients and radiation patterns are presented.     

A time-domain method with isotropic dispersion and increased stability on an overlapped lattice

A time-domain method on an overlapped lattice is presented for the accurate and efficient simulation of electromagnetic wave propagation through inhomogeneous media. The method comprises a superposition of complementary approximations to electromagnetic theory on a lattice. The discrete space-time (DST) method, is set on a pair of dual lattices whose field components are collocated on their respective lattice sites. The other, the time-domain element (TDE) method, is set on overlapping dual lattices whose field components are noncollocated. The TDE method is shown to be a generalization and reinterpretation of the Yee algorithm. The benefits of the combined algorithm over comparable methods include: (1) increased accuracy over larger bandwidths; (2) increased stability allowing larger time steps; (3) local stencil-satisfying boundary conditions on interfaces; (4) self-contained mathematical framework; (5) it is physically intuitive.     

Controller for digital audio power amplifier with bit stream input

A new controller for a digital audio amplifier with bit stream input is proposed. The proposed controller has excellent features such as wide error correction range and no limitation on the modulation index. The controller is implemented in the half-bridge class-D amplifier and performance is verified through experiments.     

Kinetics of the Pd/In thin-film bilayer reaction: Implications for transient-liquid-phase wafer bonding

The kinetic behavior of the Pd/In bilayer reaction is analyzed, with emphasis on the effect of nanometer-scale diffusion barriers at the Pd/In interface. It is shown that the Pd/In reaction proceeds rapidly and without a discernable incubation period at temperatures below 200 C if the Pd/In interface is nominally free of either contamination or intentionally-deposited intervening layers. Air exposure of the Pd surface prior to In deposition is sufficient to delay the onset of the reaction to produce the intermetallic phase by PdIn₃ for several minutes at 200 C. This incubation period can be further controlled by deposition of a nanometer-scale Ti layer onto the Pd prior to air exposure and In deposition. The implications of these results for the design of transient-liquid-phase waferbonding processes based on Pd−In are discussed.     

Analysis of low frequency scattering from penetrable scatterers

A method is presented for solving the surface integral equation using the method of moments (MoM) at very low frequencies, which finds applications in geoscience. The nature of the Helmholtz decomposition leads the authors to choose loop-tree basis functions to represent the surface current. Careful analysis of the frequency scaling property of each operator allows them to introduce a frequency normalization scheme to reduce the condition number of the MoM matrix. After frequency normalization, the MoM matrix can be solved using LU decomposition. The poor spectral properties of the matrix, however, makes it ill-suited for an iterative solver. A basis rearrangement is used to improve this property of the MoM matrix. The basis function rearrangement (BFR), which involves inverting the connection matrix, can be viewed as a pre-conditioner. The complexity of BFR is reduced to O(N), allowing this method to be combined with iterative solvers. Both rectilinear and curvilinear patches have been used in the simulations. The use of curvilinear patches reduces the number of unknowns significantly, thereby making the algorithm more efficient. This method is capable of solving Maxwell's equations from quasistatic to electrodynamic frequency range. This capability is of great importance in geophysical applications because the sizes of the simulated objects can range from a small fraction of a wavelength to several wavelengths     

Thermally Controlled,Patterned Graphene Transfer Printing for Transparent and Wearable Electronic/Optoelectronic System

Graphene has been highlighted as a platform material in transparent electronics and optoelectronics, including flexible and stretchable ones, due to its unique properties such as optical transparency, mechanical softness, ultrathin thickness, and high carrier mobility. Despite huge research efforts for graphene‐based electronic/optoelectronic devices, there are remaining challenges in terms of their seamless integration, such as the high‐quality contact formation, precise alignment of micrometer‐scale patterns, and control of interfacial‐adhesion/local‐resistance. Here, a thermally controlled transfer printing technique that allows multiple patterned‐graphene transfers at desired locations is presented. Using the thermal‐expansion mismatch between the viscoelastic sacrificial layer and the elastic stamp, a “heating and cooling” process precisely positions patterned graphene layers on various substrates, including graphene prepatterns, hydrophilic surfaces, and superhydrophobic surfaces, with high transfer yields. A detailed theoretical analysis of underlying physics/mechanics of this approach is also described. The proposed transfer printing successfully integrates graphene‐based stretchable sensors, actuators, light‐emitting diodes, and other electronics in one platform, paving the way toward transparent and wearable multifunctional electronic systems.     

ZnSe heteroepitaxy on GaAs (110) substrate

ZnSe heteroepitaxial layers have been grown on GaAs (100), (110) on axis, and (110) 6° miscut substrates by molecular beam epitaxy. ZnSe on GaAs (110) shows smooth and featureless spectra from Rutherford backscattering channeling measurements taken along major crystalline directions, whereas ZnSe on GaAs (100) without pre-growth treatments exhibit large interface disorder in channeling spectra. ZnSe films grown on GaAs (110) on axis show facet formation over a wide range of growth conditions. The use of (110) 6° miscut substrates is shown to suppress facet formation; and under the correct growth conditions, facet-free surfaces are achieved. Etch pit density measurements give dislocation densities for ZnSe epitaxial layers grown on GaAs (100), (110) on axis, and (110) 6° miscut substrates of 10⁷/cm², 3 × 10⁵/cm² and 5 × 10⁴/cm², respectively. These results suggest that with further improvements to ZnSe growth on GaAs (110)-off substrates it may be possible to fabricate defect free ZnSe based laser devices.