Laterally coupled buried heterostructure high-Q ring resonators

All-buried InP-InGaAsP ring resonators laterally coupled to bus waveguides are demonstrated. The buried configurations offer a lower built-in refractive index step along the resonator periphery, which affords enhanced optical coupling coefficients between the waveguides and reduced scattering losses caused by the resonator sidewall imperfections. Very low optical intensity attenuations of 0.4 cm/sup -1/ and coupling-limited quality factors of greater than 10/sup 5/ are observed from 200-/spl mu/m-radii ring resonators. The measured spectral linewidth is as narrow as 0.0145 nm.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Wavelength and Waveband Assignment for Ring Networks Based on Parallel Multi‐granularity Hierarchical OADMs

In this paper we study the optimization issues of ring networks employing novel parallel multi‐granularity hierarchical optical add‐drop multiplexers (OADMs). In particular, we attempt to minimize the number of control elements for the off‐line case. We present an integer linear programming formulation to obtain the lower bound in optimization, and propose an efficient heuristic algorithm called global bandwidth resource assignment that is suitable for the design of large‐scale OADM networks.     

Fatigue crack growth in SiC particulates reinforced Al matrix graded composite

The SiC/Al graded composite was fabricated by powder metallurgy processing and its fatigue crack growth behavior was studied. The volume percentage of SiC particulates was distributed from 5 to 30% layer by layer on the cross section. Since the aluminium was dissolved together, there was no evident interface between the two layers with different volume fraction of SiC particulates. Fatigue crack growth was in direction of from 5 to 30% SiC layers under sinusoidal wave-form. The retardation of fatigue crack growth was found when crack propagated from low volume fraction of SiC to high volume fraction of SiC. The crack deflection and branching between two layers were observed, which decreased crack growth rates. In view of crack tip driving force, the plasticity mismatch between the layers shielded crack tip driving force, i.e. decreased the effective J-integral at the tip of the crack as the plastic zone of the crack tip spread from the weaker material into the stronger material.     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

火炮身管内表面激光硬化处理的实验研究

提高身管寿命是火炮行业亟待解决的关键技术问题，激光表面改性技术是解决这一问题的有效方法之一。本文在分析激光表面相变硬化性能的基础上，对身管内表面进行了激光硬化处理实验研究，检测了其内表面阳线和阴线的硬化层硬度和深度，对比分析了离焦量和焦深对其内表面硬化层硬度的影响，并对激光相变硬化层金相组织进行了分析。经激光硬化处理后，身管的内表面硬度有明显提高，硬化层较深，且为很细的条状马氏体组织。     

无油分子泵机组的组装

介绍了将ALCATEL公司生产的一台ATPl00涡轮分子泵、一台MDP50ll牵引分子泵及一台VRC公司生产的lBy6型干泵组装成无油分子泵机组的过程。文中给出了泵间配合的计算、机组方案的设计、连接管路、仪器支架的设计及选择。本机组所采取的设计方案使三个泵都最大限度地发挥了优点避免了缺陷，较好地满足了使用要求，为今后选购单泵和组装无油分子泵机组提供了可靠的理论和实验依据。     

深井长裸眼跨隔测试新工艺的应用

为减少勘探费用，缩短施工周期，取全取准各项地质资料，采取中途测试工艺。随着深井中途测试不断增多，特别是跨隔支撑测试具有一定施工风险和难度，要求测试质量不断提高。结合油田生产实际，合理选配了地层测试工具仪表，不断改进测试管串和优化施工设计，经盐22井中途跨隔测试应用，获得成功。     

Mobility management architectures based on joint mobile IP and SIP protocols

In the all-IP wireless networks beyond the third generation, mobility management can be effectively achieved by applying mobile IP (MIP) and the session initiation protocol (SIP) jointly. Nevertheless, an efficient combination of both protocols remains an open research issue. Conventional hybrid MIP-SIP mobility architectures operate MIP and SIP almost independently, resulting in significant redundant costs. This article investigates the representative hybrid MIP-SIP architectures and explores the joint optimizations between MIP and SIP for a more cost-efficient mobility support whilst utilizing their complementary power. Two novel design approaches are presented. The first approach culminates in a tightly integrated architecture, which merges the redundant mobility entities in MIP and SIP to yield maximum system efficiency. The other approach leads to a loosely integrated architecture, where necessary interactions are introduced between MIP and SIP mobility servers while their physical entities are kept intact. Major mobility procedures, including location update, session setup and handoff, are discussed in these architectures. The analytical results demonstrate that both proposed architectures outperform typical hybrid MIP-SIP architectures in terms of clear-cut reduced signaling costs     

脉冲式半导体激光器准直光学系统的设计

根据具体的探测环境和探测精度,通过理论分析,提出了脉冲式半导体激光器准直光束的单透镜设计方法和柱面透镜的设计方法,并且给出了具体的设计参数。可以获得高斯光束的准直发散角为1.48mrad;高斯光束的腰粗为0.325mm。