Low temperature wafer direct bonding

A pronounced increase of interface energy of room temperature bonded hydrophilic Si/Si, Si/SiO₂, and SiO₂/SiO ₂ wafers after storage in air at room temperature, 150°C for 10-400 h has been observed. The increased number of OH groups due to a reaction between water and the strained oxide and/or silicon at the interface at temperatures below 110°C and the formation of stronger siloxane bonds above 110°C appear to be the main mechanisms responsible for the increase in the interface energy. After prolonged storage, interface bubbles are detectable by an infrared camera at the Si/Si bonding seam. Desorbed hydrocarbons as well as hydrogen generated by a reaction of water with silicon appear to be the major contents in the bubbles. Design guidelines for low temperature wafer direct bonding technology are proposed     

The design, fabrication, and testing of corrugated silicon nitridediaphragms

Silicon nitride corrugated diaphragms of 2 mm×2 mm×1 μm have been fabricated with 8 circular corrugations, having depths of 4, 10, or 14 μm. The diaphragms with 4-μm-deep corrugations show a measured mechanical sensitivity (increase in the deflection over the increase in the applied pressure) which is 25 times larger than the mechanical sensitivity of flat diaphragms of equal size and thickness. Since this gain in sensitivity is due to reduction of the initial stress, the sensitivity can only increase in the case of diaphragms with initial stress. A simple analytical model has been proposed that takes the influence of initial tensile stress into account. The model predicts that the presence of corrugations increases the sensitivity of the diaphragms, because the initial diaphragm stress is reduced. The model also predicts that for corrugations with a larger depth the sensitivity decreases, because the bending stiffness of the corrugations then becomes dominant. These predictions have been confirmed by experiments. The application of corrugated diaphragms offers the possibility to control the sensitivity of thin diaphragms by geometrical parameters, thus eliminating the effect of variations in the initial stress, due to variations in the diaphragm deposition process and/or the influence of temperature changes and packaging stress     

UTEC and Ferut: the University of Toronto's computation centre

Although not well known, the University of Toronto had a very early computer-development program and in 1952 was one of the first few institutions with an operable computer in North America. This article describes the university's initial attempt to build the UTEC computer and how it acquired the pioneering Ferut machine     

Base-type languages: Program design by upper semantic approximation

Translated from Kibernetika i Sistemnyi Analiz, No. 4, pp. 140–155, July–August 1994.     

Multicriterion differential games

Translated from Kibernetika i Sistemnyi Analiz, No. 1, pp. 24–33, January–February, 1994.     

Fault trees—Problems and the modern state of investigations

Published in Kibernetika i Sistemnyi Analiz, No. 3, pp. 128–150, May–June, 1994.     

Comments on “Editorial: fuzzy models-what are they andwhy?”

In the editorial by J.C. Bezdek (ibid., p.1), an example is presented to demonstrate differences between fuzzy membership and probability. The authors argue that probability can be used in a way much more closely analogous to this use of fuzzy membership, weakening the argument for the latter