What Is Common in Accounts of Common Ground?

Tenenberg, Roth, and Socha’s paper “From I-awareness to we-awareness in CSCW” is, or should be, of special significance to those in the CSCW and HCI communities with more than a passing interest in the theoretical issues that underpin our work. It can be argued, and I would be a proponent of this view, that fundamental intellectual disagreements too seldom get an airing in our community, perhaps because it is in large part conference driven. Because of this, underlying perspectival disagreements can appear rather arcane. One of the great merits of the contributions to this special issue, I hope and believe, is that they will appear less so after careful reading.     

Domain Wall Motion Across Various Grain Boundaries in Ferroelectric Thin Films

Domain wall movement at and near engineered 10°, 15°, and 24° tilt and 10° and 30° twist grain boundaries was measured by band excitation piezoresponse force microscopy for Pb(Zr,Ti)O₃ films with Zr/Ti ratio of 45/55 and 52/48. A minimum in nonlinear response was observed at the grain boundary for the highest angle twist and tilt grain boundaries, while a maximum in nonlinear response was observed at the 10° tilt grain boundaries. The observed nonlinear response was correlated with the domain configurations imaged in cross section by transmission electron microscopy.     

Advanced Monte Carlo simulations of the adsorption of chiral alcohols in a homochiral metal‐organic framework

Grand canonical Monte Carlo (GCMC) simulations with configurational biasing were used to study the enantioselective adsorption of four alkanols in a homochiral metal‐organic framework, known as hybrid organic‐inorganic zeolite analogue HOIZA‐1. Conventional GCMC simulations are not able to converge satisfactorily for this system due to the tight fit of the chiral alcohols in the narrow pores. However, parallel tempering and parallel mole‐fraction GCMC simulations overcome this problem. The simulations show that the enantioselective adsorption of the different (R,S)‐alkanols is due to the specific geometry of the chiral molecules relative to the pore size and shape. © 2014 American Institute of Chemical Engineers AIChE J, 60: 2324–2334, 2014     

Static fatigue of Hi-Nicalon™-S fiber at elevated temperature in air,steam, and silicic acid-saturated steam

A facility for testing SiC fiber tows in static fatigue and creep at elevated temperatures in air and steam was developed. Static fatigue of Hi-Nicalon™-S fibers was investigated at 800°C-1100°C at applied stresses between 115 and 1250 MPa in air, in Si(OH)₄(g)-saturated steam, and in unsaturated steam. Fibers tested in Si(OH)₄(g)-saturated steam and in air had silica scales throughout the test sections, but those tested in unsaturated steam did not develop scales near the steam injection point. Fiber lifetimes in static fatigue were shortest in unsaturated steam, intermediate in Si(OH)₄(g)-saturated steam, and longest in air. Failure strains did not exceed 0.3%. Steady-state strain rates and static fatigue lifetimes are modelled empirically by the Monkman-Grant relationship. Failure mechanisms are discussed.     

Grain size measurement methods and models for nanograined WC–Co

Development of nanograined WC–Co presents challenges for grain size measurement. In this study, standard and nanocrystalline WC–Co powders are processed by conventional and spark sintering. The resulting microstructures are characterized by image analysis of scanning electron microscopy micrographs, X-ray line broadening, and magnetic coercivity. The results are analyzed and a property map relating coercivity to WC grain size is developed. Equations for interface-controlled grain growth are transformed into the master sintering curve form and are used to analyze the grain size data from the three measurement techniques.     

Grain Growth Kinetics in Liquid-Phase-Sintered Zinc Oxide–Barium Oxide Ceramics

Grain growth of ZnO in the presence of a liquid phase of the ZnO–BaO system has been studied for temperatures from 1300° to 1400°C. The specimens were treated in boiling water and the grains were separated by dissolving the matrix phase in an ultrasonic bath. As a consequence three-dimensional grain size measurements were possible. Microstructural examination shows some grain coalescence with a wide range of neck size ratios and corresponding dihedral angles, however, most grains are isolated. Lognormal grain size distributions show similar shapes, indicating that the growth mechanism is invariant over this time and temperature. All regressions between G ⁿ and time for n = 2 and 3 proved statistically significant. The rate constants calculated with the growth exponent set to n = 3 are on the same order of magnitude as in metallic systems. The apparent activation energy for growth is estimated between 355 and 458 kJ/mol.     

Cold sintering process: A new era for ceramic packaging and microwave device development

Cold sintering process (CSP) is an extremely low‐temperature sintering process (room temperature to ~200°C) that uses aqueous‐based solutions as transient solvents to aid densification by a nonequilibrium dissolution‐precipitation process. In this work, CSP is introduced to fabricate microwave and packaging dielectric substrates, including ceramics (bulk monolithic substrates and multilayers) and ceramic‐polymer composites. Some dielectric materials, namely Li₂MoO₄, Na₂Mo₂O₇, K₂Mo₂O₇, and (LiBi)_0.5MoO₄ ceramics, and also (1?x)Li₂MoO₄?xPTFE and (1?x)(LiBi)_0.5MoO₄?xPTFE composites, are selected to demonstrate the feasibility of CSP in microwave and packaging substrate applications. Selected dielectric ceramics and composites with high densities (88%‐95%) and good microwave dielectric properties (permittivity, 5.6‐37.1; Q × f, 1700‐30 500 GHz) were obtained by CSP at 120°C. CSP can be also used to potentially develop a new co‐fired ceramic technology, namely CSCC. Li₂MoO₄?Ag multilayer co‐fired ceramic structures were successfully fabricated without obvious delamination, warping, or interdiffusion. Numerous materials with different dielectric properties can be densified by CSP, indicating that CSP provides a simple, effective, and energy‐saving strategy for the ceramic packaging and microwave device development.