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排序方式: 共有10000条查询结果,搜索用时 93 毫秒
991.
Chang Fon-Chieh Hull John R. Beitelman Len 《Metallurgical and Materials Transactions B》2004,35(6):1129-1137
A numerical simulation was performed for a novel electromagnetic stirring system that employs two rotating magnetic fields.
The system controls stirring flow in the meniscus region of a continuous casting mold independently from the stirring induced
within the remaining volume of the mold by a main electromagnetic stirring (M-EMS) system. This control is achieved by applying
to the meniscus region an alternating current-stirring modifier (AC-SM) whose direction of rotation is opposite to that of
the main magnetic field produced by the M-EMS. The model computes values and spatial distributions of electromagnetic parameters
and fluid flow in stirred pools of mercury in cylindrical and square pools. Also predicted are the relationships between electromagnetics
and fluid flows pertinent to a dynamic equilibrium of the opposing stirring swirls in the meniscus region. Results of the
numerical simulation compared well with the measurements obtained from experiments with mercury pools. 相似文献
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995.
诚信:中国企业亟待解决的问题 总被引:1,自引:0,他引:1
分析论述了诚信的重要性,指出了在维系市场秩序中诚信处于十分重要的地位。分析了中国企业诚信的现状,提出了企业重塑诚信的措施。 相似文献
996.
The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was investigated at temperatures
of −5 °C and 125 °C up to 600 h. The samples were stressed with 3 A current (6.0 × 102 A/cm2 in the solder joint with diameter of 800 μm and 1.7 × 104 A/cm2 in the Cu trace with cross section area of 35 × 500 μm). The temperatures of the samples and interfacial reaction within
the solder joints were examined. The microstructural change of the solder joints aged at 125 °C without current flow was also
evaluated for comparison. It was confirmed that the current flow could cause the temperature of solder joints to rise rapidly
and remarkably due to accumulation of massive Joule heat generated by the Cu trace. The solder joints stressed at 125 °C with
3 A current had an extensive growth of Cu6Sn5 and Cu3Sn intermetallic compounds (IMC) at both top and bottom solder-to-pad interfaces. It was a direct result of accelerated aging
rather than an electromigration or thermomigration effect in this experiment. The kinetic is believed to be bulk diffusion
controlled solid-state reaction, irrespective of the electron flow direction. When stressed at −5 °C with 3 A current, no
significant change in microstructure and composition of the solder joints had occurred due to a very low diffusivity of the
atoms as most Joule heat was eliminated at low temperature. The IMC evolution of the solder joints aged at 125 °C exhibited
a subparabolic growth behavior, which is presumed to be a combined mechanism of grain boundary diffusion and bulk diffusion.
This is mainly ascribed to the retardant effect against the diffusion course by the sufficiently thick IMC layer that was
initially formed during the reflow soldering. 相似文献
997.
Sutomo W. Xuefeng Wang Bullen D. Braden S.K. Chang Liu 《Journal of microelectromechanical systems》2003,12(1):64-69
Parylene is an emerging material for MEMS. It is an organic material that is grown by using the chemical vapor deposition method at room temperature. The deposition thickness is commonly controlled by the amount of solid-phase dimer loaded in a sublimation chamber. In a conventional deposition machine, the end point of the process is designated by the moment the dimer is exhausted. However, this end-of-process criterion does not offer precise, repeatable control of film thickness. We present the results of the development of an in situ end-point detector for a Parylene chemical vapor deposition process. The detector is based on the thermal transfer principle and can be implemented on commercial parylene deposition systems with minimal system modification. Such a sensor enables a user to stop the deposition when a targeted thickness is reached. The end point detector is very simple to implement on existing parylene deposition systems. A series of such sensors with different target deposition thickness would allow extraction of the actual deposition rate within a deposition run. 相似文献
998.
钛硅分子筛催化环己酮氨肟化反应过程--本征动力学 总被引:2,自引:0,他引:2
对钛硅分子筛(HTS)催化环己酮氨肟化反应本征动力学进行了研究。利用经验方程拟合了试验数据,并采用Marquardt算法对经验方程的参数进行确定,获得了不同试验条件下的反应初速率,然后再用高斯-牛顿法对本征动力学模型进行了参数估计,得出了氨肟化反应以及该反应体系中H2O2分解的本征动力学。并对该模型进行了残差分析和F检验,对氨肟化反应和H2O2分解的动力学模型的计算值与试验值进行了比较,获得相对误差绝对值的平均值分别为5.21%和6.25%。表明该模型能真实反映HTS催化环己酮氨肟化的反应特性,是合理可靠的,能为进一步的过程开发与工程设计提供一些理论上的指导和设计上的依据;而H2O2分解副反应动力学模型仅适用于该反应体系。 相似文献
999.
超临界流体中的酶催化 总被引:3,自引:0,他引:3
与其他非水相酶催化介质相比 ,超临界流体有其独特的优越性。阐述了超临界流体的概念、对超临界流体的选择原则以及在超临界流体中酶催化的各种影响因素 ,还讨论了在此类流体中酶催化的应用和发展前景 相似文献
1000.
DGPS在可控震源施工中的应用 总被引:1,自引:1,他引:0
在可控震源施工中,采用DGPS(差分全球卫星定位系统)实施实时点位监控,对保证施工质量、提高生产效率起着积极的作用。本文主要介绍PELTON ADVANCE Ⅲ GPS系统的安装和使用情况。 相似文献