10 Gbit/s transmission over 50 km nonzero dispersion-shifted fibreusing 1.3 μm directly modulated uncooled transmitters

A 1.3 μm uncooled transmitter with wide-open eye diagrams at laser temperatures of 20, 50, and 85°C is presented. Using this transmitter, it is demonstrated that 10 Gbit/s transmission is possible over a 50 km nonzero dispersion-shifted Lucent TrueWave-RS fibre. This result is compared with transmission over a 55 km standard singlemode fibre     

Optical packet switching in core networks: between vision andreality

The research on optical packet switching (OPS) has witnessed considerable progress in the 1990s. We examine the future potential of OPS in the core network by discussing this switching approach and the current status of a number of its enabling technologies. Many of these technologies are still in the stage of research and experimentation. We see that optical packet switching may be deployed in the long-term future subject to satisfaction of three main conditions/developments. First, additional technological developments have to take place to overcome remaining implementation challenges while making OPS cost-effective to deploy. Second, a rational migration scenario of the network toward gradual deployment of packet-based optical switching approaches should exist. Finally, carriers have to become more interested in packet-based optical switching solutions     

Hybrid ring coupler for W-band MMIC applications using MEMS technology

The hybrid ring coupler was designed and fabricated on a GaAs substrate using surface micromachining techniques, which adopted dielectric-supported air-gapped microstrip line (DAML) structure. The fabrication process of DAML is compatible with the standard monolithic microwave integrated circuit (MMIC) techniques, and the hybrid ring coupler can be simply integrated into a plane-structural MMIC. The fabricated hybrid ring coupler shows wideband characteristics of the coupling loss of 3.57 /spl plusmn/ 0.22dB and the transmission loss of 3.80 /spl plusmn/ 0.08dB across the measured frequency range of 85 to 105GHz. The isolation characteristics and output phase differences are -34dB and 180/spl plusmn/1/spl deg/, at 94GHz, respectively.     

The Effect of Gate‐Dielectric Surface Energy on Pentacene Morphology and Organic Field‐Effect Transistor Characteristics

The effects of the surface energy of polymer gate dielectrics on pentacene morphology and the electrical properties of pentacene field‐effect transistors (FETs) are reported, using surface‐energy‐controllable poly(imide‐siloxane)s as gate‐dielectric layers. The surface energy of gate dielectrics strongly influences the pentacene film morphology and growth mode, producing Stranski–Krastanov growth with large and dendritic grains at high surface energy and three‐dimensional island growth with small grains at low surface energy. In spite of the small grain size (≈ 300 nm) and decreased ordering of pentacene molecules vertical to the gate dielectric with low surface energy, the mobility of FETs with a low‐surface‐energy gate dielectric is larger by a factor of about five, compared to their high‐surface‐energy counterparts. In pentacene growth on the low‐surface‐energy gate dielectric, interconnection between grains is observed and gradual lateral growth of grains causes the vacant space between grains to be filled. Hence, the higher mobility of the FETs with low‐surface‐energy gate dielectrics can be achieved by interconnection and tight packing between pentacene grains. On the other hand, the high‐surface‐energy dielectric forms the first pentacene layer with some voids and then successive, incomplete layers over the first, which can limit the transport of charge carriers and cause lower carrier mobility, in spite of the formation of large grains (≈ 1.3 μm) in a thicker pentacene film.     

Temperature influence on performance degradation of hydrogenated amorphous silicon solar cells irradiated with protons

This paper reports temperature influence on radiation degradation of hydrogenated amorphous silicon (a‐Si : H) solar cells. Degradation behaviors of a‐Si : H solar cells irradiated with protons at 331 K are compared with that at 298 K (room temperature). Variations with time in the post‐irradiation electrical properties are also investigated. It is found that the radiation degradation of the electrical properties at 331 K is significantly smaller than that at room temperature. Also, all the electrical properties (short‐circuit current, open‐circuit voltage, output maximum, and fill factor) recover with time after irradiation even at room temperature. The characteristic time of thermal annealing of short‐circuit current is larger as the temperature is higher. These results indicate that temperature during irradiation and elapsed time from irradiation to measurement is an important parameter for radiation degradation of a‐Si : H solar cells. Therefore, these parameters should be controlled in conducting the ground radiation tests. Copyright © 2012 John Wiley & Sons, Ltd.     

A Rigorous 2D Approximation Technique for 3D Waveguide Structures for BPM Calculations

We propose a rigorous 2D approximation technique for the 3D waveguide structures; it can minimize the well‐known approximation errors of the commonly used effective index method. The main concept of the proposed technique is to compensate for the effective cladding index in the equivalent slab model of the original channel waveguide from the modal effective index calculated by the nonuniform 2D finite difference method. With simulations, we used the proposed technique to calculate the coupling characteristics of a directional coupler by the 2D beam propagation method, and the results were almost exactly the same as the results calculated by the 3D beam propagation method.     

Thermal Resistance Measurement of LED Package with Multichips

Thermal transient measurements of high power GaN-based light-emitting diodes (LEDs) with multichip designs are presented and discussed in the paper. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The total thermal resistance from junction to ambient considering optical power is 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip packages, respectively. The contribution of each component to the total thermal resistance of the package can be determined from the cumulative structure function and differential structure function. The total thermal resistance of multichip packages is found to decrease with the number of chips due to parallel heat dissipation. However, the effect of the number of chips on thermal resistance of package strongly depends on the ratio of partial thermal resistance of chip and that of slug. Therefore, an important thermal design rule for packaging of high power multichip LEDs has been analogized.     

Variable structure observer of mismatched uncertain dynamical systems

To improve the steady state estimation error due to mismatched uncertainty, a variable structure observer for mismatched uncertain dynamical systems is proposed by using the generalised matrix inverse. Simulation results show that the estimation error is largely decreasing using the proposed observer.<>     

Study of Random-Dopant-Fluctuation (RDF) Effects for the Trigate Bulk MOSFET

A study of random-dopant-fluctuation (RDF) effects on the trigate bulk MOSFET versus the planar bulk MOSFET is performed via atomistic 3D device simulation for devices with a 20 nm gate length. For identical nominal body and source/drain doping profiles and layout width, the trigate bulk MOSFET shows less threshold voltage (V_th) lowering and variation. RDF effects are found to be caused primarily by body RDF. The trigate bulk MOSFET offers a new method of V_TH adjustment, via tuning of the retrograde body doping depth, to mitigate tradeoffs in V_TH variation and short-channel effect control.