Fault-Tolerant UAV Data Acquisition Schemes

Wireless Personal Communications - Through the use of UAV, the functional lifetime of WSN can be elongated in exchange for higher data delivery latency as the UAV replaces the multi-hop...     

Direct Physical Imaging and Chemical Probing of LiFePO4 for Lithium‐Ion Batteries

The control of unexpectedly rapid Li intercalation reactions without structural instability in olivine‐type LiFePO₄ nanocrystals is one of the notable scientific advances and new findings attained in materials physics and chemistry during the past decade. A variety of scientific studies and technological investigations have been carried out with LiFePO₄ to elucidate the origins of many peculiar physical aspects as well as to develop more effective synthetic processing techniques for better electrochemical performances. Among the several features of LiFePO₄ that have attracted much interest, in this article we address four important issues—regarding doping of aliovalent cations, distribution of Fe‐rich secondary metallic phases, nanoparticle formation during crystallization, and antisite Li/Fe partitioning—by means of straightforward atomic‐scale imaging and chemical probing. The direct observations in the present study provide significant insight into alternative efficient approaches to obtain conductive LiFePO₄ nanocrystals with controlled defect structures.     

Activatable Photosensitizers: Agents for Selective Photodynamic Therapy

Recent developments in the design of bifunctional and activatable photosensitizers rejuvenate the aging field of photodynamic sensitization and photodynamic therapy. While systematic studies have uncovered new dyes that can serve as potential photosensitizers, the most promising results have come from studies aimed at gaining precise control over the location and rate of cytotoxic singlet oxygen generation. As a consequence, higher selectivities and efficiencies in photodynamic treatment protocols are now within reach. This feature article highlights the variety of approaches that have been pursued to improve photodynamic therapy and to transform simple photosensitizers into smarter theranostic agents.     

A design of a high-speed and high-efficiency capsule endoscopy system

This paper presents a high-speed and high-efficiency capsule endoscopy system. Both a transmitter and a receiver were optimized for its application through an analysis of the human body channel. ON-OFF keying modulation is utilized to achieve low power consumption of the in-body transmitter. A low drop output regulator is adopted to prevent performance degradation in the event of a voltage drop in the battery. The receiver adopts superheterodyne structure to obtain high sensitivity, considering the link budget from the previous analysis. The receiver and transmitter were fabricated using the CMOS 0.13-μm process. The output power of the transmitter is -1.6 dB·m and its efficiency is 27.7%. The minimum sensitivity of the receiver is -80 dB·m at a bit error ratio (BER) of 3 × 10 (-6). An outer wall loop antenna is adopted for the capsule system to ensure a small size. The integrated system is evaluated using a liquid human phantom and a living pig, resulting in clean captured images.     

柔性有源OLED显示器制造几点技术方面的考虑

AMOLED在柔性显示领域前途似锦。LG显示展示了一款全彩4in柔性AMOLED样机,衬底为80μm厚的不锈钢薄片,曲率达到5cm弯曲半径。本文就此项柔性显示技术所面临的挑战进行了探讨．包括柔性衬底衬底的传送、如何获得特性稳定可靠的TFT以使OLED的亮度和一致性适用于此项技术的商业化推广。     

Effects of Interfacial Dielectric Layers on the Electrical Performance of Top‐Gate In‐Ga‐Zn‐Oxide Thin‐Film Transistors

We investigate the effects of interfacial dielectric layers (IDLs) on the electrical properties of top‐gate In‐Ga‐Zn‐oxide (IGZO) thin film transistors (TFTs) fabricated at low temperatures below 200°C, using a target composition of In:Ga:Zn = 2:1:2 (atomic ratio). Using four types of TFT structures combined with such dielectric materials as Si₃N₄ and Al₂O₃, the electrical properties are analyzed. After post‐annealing at 200°C for 1 hour in an O₂ ambient, the sub‐threshold swing is improved in all TFT types, which indicates a reduction of the interfacial trap sites. During negative‐bias stress tests on TFTs with a Si3N4 IDL, the degradation sources are closely related to unstable bond states, such as Si‐based broken bonds and hydrogen‐based bonds. From constant‐current stress tests of Id = 3 µA, an IGZO‐TFT with heat‐treated Si₃N₄ IDL shows a good stability performance, which is attributed to the compensation effect of the original charge‐injection and electron‐trapping behavior.     

An improved sensorless driving method for SRM using a phase-shift circuit technique

This paper presents an improved sensorless driving method for switched reluctance motor (SRM) using a phase-shift circuit technique. The conventional method consists of impressing short voltage pulses during unenergized phases, measuring the phase current pulses, and finding the correlation between the filtered current signals and rotor position. However, the filtering process causes a signal phase delay which varies with motor speed. This delay must be compensated for in providing the sensorless signal which is proper to the rotor position. A solution for this phase delay compensation, based on a simple analog and digital circuit, is proposed in this paper.     

Soluble pentacene thin-film transistor using a high solvent and heat resistive polymeric dielectric with low-temperature processability and its long-term stability

Solution processable organic thin-film transistors (OTFTs) were fabricated using 6,13-bis(triisopropyl-silylethynyl) pentacene (TIPS-pentacene) and low-temperature processable polyimide gate dielectric. The TIPS-pentacene OTFT with the dielectric was found to have a field-effect mobility of 0.15 cm²/Vs, which is comparable to that of OTFT with an inorganic dielectric. The OTFTs with the polyimide dielectric did not show any significant performance degradation as time passed. A field-effect mobility of the OTFTs in 60 days was found to be almost identical to that of pristine OTFT. The combination of TIPS-pentacene and our polyimide gate dielectric can be one of the potential candidates for the fabrication of stable OTFTs for large-area flexible electronics.     

An Area Optimization Method for Digital Filter Design

In this paper, we propose an efficient design method for area optimization in a digital filter. The conventional methods to reduce the number of adders in a filter have the problem of a long critical path delay caused by the deep logic depth of the filter due to adder sharing. Furthermore, there is such a disadvantage that they use the transposed direct form (TDF) filter which needs more registers than those of the direct form (DF) filter. In this paper, we present a hybrid structure of a TDF and DF based on the flattened coefficients method so that it can reduce the number of flip‐flops and full‐adders without additional critical path delay. We also propose a resource sharing method and sharing‐pattern searching algorithm to reduce the number of adders without deepening the logic depth. Simulation results show that the proposed structure can save the number of adders and registers by 22 and 26%, respectively, compared to the best one used in the past.     

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.