Obtaining depth map from segment-based stereo matching using graph cuts

In the paper, the algorithm of segment-based stereo matching using graph cuts is developed for extracting depth information from the stereo image pairs. The first step of the algorithm employs the mean-shift algorithm to segment the reference image, which ensures our method to correctly estimate in large untextured regions and precisely localize depth boundaries, followed by the use of Adaptive Support Weighted Self-Adaptation dissimilarity algorithm (ASW-SelfAd) for the estimation of initial disparity. This is followed by application of Singular Value Decomposition (SVD) in solving the robust disparity plane fitting. In order to ensure reliable pixel sets for the segment, we filter out outliers which contain occlusion region through three main rules, namely; cross-checking, judging reliable area and disparity distance measurement. Lastly, we apply improved clustering algorithm to merge the neighboring segments. The geometrical relationship of adjacent planes such as parallelism and intersection is employed for determination of whether two planes shall be merged. A new energy function is subsequently formulated with the use of graph cuts for the refinement of the disparity map. Finally, the depth information is extracted from the final disparity map. Experimental results on the Middlebury dataset demonstrate that our approach is effective in improving the state of the art.     

Red bean extract reduces inflammation and increases survival in a murine sepsis model

This study used in vitro and in vivo experimental models to investigate the anti-inflammatory potential of the butanol fraction of red bean ethanol extract (BF-RBEE), which contains the biologically active molecule catechin-7-β-d-glucopyranoside. Treatment with BF-RBEE inhibited nitric oxide production in lipopolysaccharide (LPS)-stimulated macrophages through suppression of extracellular signalregulated kinase and IκBα activation. In an in vivo murine sepsis model, oral administration of BF-RBEE improved mouse survival. Specifically, the survival rate of mice injected with LPS was 0 and 40% in ICR and BALB/c mice, respectively, whereas the survival of mice co-treated with BF-RBEE was 100% in both mouse types. This increase in survival with the BF-RBEE administration was correlated with decreased tumor-necrosis factor-α and interferon-γ and increased interleukin-10. Oral administration of BF-RBEE also inhibited total and ovalbumin-specific IgE production in experimental mice. These results suggest the possible usefulness of red beans in the treatment of inflammatory diseases.     

A line-voltage-sensorless synchronous rectifier

A line-voltage-sensorless control for three-phase pulsewidth-modulated (PWM) synchronous rectifiers is presented. A line synchronization and unity power factor control are described. Indirect synchronization without sensing the line voltage allows a standard vector-controlled inverter to be used as a synchronous rectifier without requiring any additional hardware. Furthermore, the line synchronization can be properly operated under line voltage distortion or notching and line frequency variation. All control functions are implemented with a single-chip microcontroller. It is shown via experimental results that the proposed controller gives good performance for the synchronous rectifier     

A Soft Resistive Acoustic Sensor Based on Suspended Standing Nanowire Membranes with Point Crack Design

An artificial basilar membrane (ABM) is an acoustic transducer that mimics the mechanical frequency selectivity of the real basilar membrane, which has the potential to revolutionize current cochlear implant technology. While such ABMs can be potentially realized using piezoelectric, triboelectric, and capacitive transduction methods, it remains notoriously difficult to achieve resistive ABM due to the poor frequency discrimination of resistive‐type materials. Here, a point crack technology on noncracking vertically aligned gold nanowire (V‐AuNW) films is reported, which allows for designing soft acoustic sensors with electric signals in good agreement with vibrometer output—a capability not achieved with corresponding bulk cracking system. The strategy can lead to soft microphones for music recognition comparable to the conventional microphone. Moreover, a soft resistive ABM is demonstrated by integrating eight nanowire‐based sensor strips on a soft trapezoid frame. The wearable ABM exhibits high‐frequency selectivity in the range of 319–1951 Hz and high sensitivity of 0.48–4.26 Pa^?1. The simple yet efficient fabrication in conjunction with programmable crack design indicates the promise of the methodology for a wide range of applications in future wearable voice recognition devices, cochlea implants, and human–machine interfaces.     

Advances in Vapor Pressure Modeling for Electronic Packaging

Two advanced techniques have been developed for modeling vapor pressure within the plastic IC packages during solder reflow. The first involves the extension of the "wetness" technique to delamination along multimaterial interface and during dynamic solder reflow. Despite its simplicity, this technique is capable of offering reliable and accurate prediction for packages with high flexural rigidity. For packages with low flexural rigidity, the new "decoupling" technique that integrates thermodynamics, moisture diffusion, and structural analysis into a unified procedure has been shown to be more useful. The rigorous technique has been validated on both leadframe-based as well as laminate-based packages. With high accuracy and computational efficiency, these dynamic modeling tools will be valuable for optimization of package construction, materials, and solder reflow profile against popcorn cracking for both SnPb and Pb-free solders     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

High-performance 94-GHz single balanced mixer using 70-nm MHEMTs and surface micromachined technology

We reported 94-GHz, low conversion loss, and high isolation single balanced active gate mixer based on 70-nm gate length InGaAs/InAlAs metamorphic high-electron mobility transistors (MHEMTs). This mixer showed that the conversion loss and isolation characteristics were 2.5/spl sim/3.5 dB and under -29 dB in the range of 92.95/spl sim/94.5 GHz, respectively. The low conversion loss of the mixer is mainly attributed to the high-performance of the MHEMTs exhibiting a maximum drain current density of 607 mA/mm, an extrinsic transconductance of 1015 mS/mm, a current gain cutoff frequency (f/sub t/) of 330 GHz, and a maximum oscillation frequency (f/sub max/) of 425 GHz. High isolation characteristics are due to hybrid ring coupler which adopted dielectric-supported air-gapped microstrip line structure using surface micromachined technology. To our knowledge, these results are the best performance demonstrated from 94 GHz single balanced mixer utilizing GaAs-based HEMTs in terms of conversion loss as well as isolation characteristics.     

Small‐Size and High‐Isolation MIMO Antenna for WLAN

A small‐sized (15 mm×30 mm) planar monopole MIMO antenna that offers high‐isolation performance is presented in this letter. The antenna is miniaturized using inductive coupling within a meander‐line radiator and capacitive coupling between a radiator and an isolator. High isolation is achieved by a T‐shaped stub attached to the ground plane between two radiators, which also contributes to the small size using a folded structure and the capacitive coupling with radiators. The proposed antenna operates for the WLAN band within 2.4 GHz to 2.483 GHz. The measured isolation (S₂₁) is about –30 dB, and the envelope correlation coefficient is less than 0.1.     

Specifying and proving properties of timed I/O automata using Tempo

Timed I/O automata (TIOA) is a mathematical framework for modeling and verification of distributed systems that involve discrete and continuous dynamics. TIOA can be used for example, to model a real-time software component controlling a physical process. The TIOA model is sufficiently general to subsume other models in use for timed systems. The Tempo Toolset, currently under development, is aimed at supporting system development based on TIOA specifications. The Tempo Toolset is an extension of the IOA toolkit, which provides a specification simulator, a code generator, and both model checking and theorem proving support for analyzing specifications. This paper focuses on the modeling of timed systems and their properties with TIOA and on the use of TAME4TIOA, the TAME (Timed Automata Modeling Environment) based theorem proving support provided in Tempo, for proving system properties, including timing properties. Several examples are provided by way of illustration.