The biomechanics of lumbar graded facetectomy under anterior-shear load

In this paper, an anatomically accurate three-dimensional finite-element (FE) model of the human lumbar spine (L2-L3) was used to study the biomechanical effects of graded bilateral and unilateral facetectomies of L3 under anterior shear. The intact L2-L3 FE model was validated under compression, tension, and shear loading and the predicted responses matched well with experimental data. The gross external (translational and coupled) responses, flexibilities, and facet load were delineated for these iatrogenic changes. Results indicted that unilateral facetectomy of greater than 75% and bilateral facetectomy of 75% or more resection markedly alter the translational displacement and flexibilities of the motion segment. This study suggests that fixation or fusion to restore strength and stability of the lumbar spine may be required for surgical intervention of greater than 75% facetectomy.     

Series Representations for Rice's Ie Function

Two new series representations for the Rice functionIe (k, x)are presented. One of the series involves the modified Struve functions and the other involves the modified Bessel functions. These two series complement each other in their convergence speeds as functions of the values ofkandx. The truncation error bounds are derived for both series. Therefore, they can be used alternatively with high efficiency and known precision.     

Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages

The anisotropic conductive adhesive (ACA) is a promising solder alternative candidate that shows potential for further pitch reduction. Although much work has been published on ACA joint behavior, study on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected. Material properties were characterized as close as possible to "stress test" conditions so as to allow more accurate correlation predictions. Reliability performance was obtained by assembling test chips of 200-/spl mu/m pitch onto BT-substrates, then subjecting them to reliability tests. Correlation analysis was conducted and key material properties that contributed to good reliability performance were identified. Findings indicated that the best properties for high reliability assemblies were: high adhesion strength after subjecting to "stress aging", low coefficient of moisture expansion (CME) and low elastic modulus (E).     

$nhbox{-ZnO}/nhbox{-GaAs}$ Heterostructured White Light-Emitting Diode: Nanoscale Interface Analysis and Electroluminescence Studies

n-ZnO/n-GaAs heterostructured light-emitting diodes have been fabricated by a low-cost ultrasonic spray pyrolysis technique. Nanoscale interface analysis was carried out with scanning transmission electron microscopy. An ~ 8.6-nm-thick amorphous GaAsZnInO was found in the n -ZnO/n-GaAs interface. A strong and broad white electroluminescence band centered at ~ 525 nm and a weak near-infrared emission peaked at ~ 815 nm were observed when n-GaAs was positively biased. The 815-nm emission is believed to be related to the interface layer, and the 525-nm emission is assigned to the recombination of electrons from conduction band to deep-level holes in the ZnO layer.     

Effects of substrate temperature on electrical and structural properties of copper thin films

This paper addresses the effects of substrate temperature on electrical and structural properties of dc magnetron sputter-deposited copper (Cu) thin films on p-type silicon. Copper films of 80 and 500 nm were deposited from Cu target in argon ambient gas pressure of 3.6 mTorr at different substrate temperatures ranging from room temperature to 250 °C. The electrical and structural properties of the Cu films were investigated by four-point probe and atomic force microscopy. Results from our experiment show that the increase in substrate temperature generally promotes the grain growth of the Cu films of both thicknesses. The RMS roughness as well as the lateral feature size increase with the substrate temperature, which is associated with the increase in the grain size. On the other hand, the resistivity for 80 nm Cu film decreases to less than 5 μΩ-cm at the substrate temperature of 100 °C, and further increase in the substrate temperature has not significantly decreased the film resistivity. For the 500 nm Cu films, the increase in the grain size with the substrate temperature does not conform to the film resistivity for these Cu films, which show no significant change over the substrate temperature range. Possible mechanisms of substrate-temperature-dependent microstructure formation of these Cu films are discussed in this paper, which explain the interrelationship of grain growth and film resistivity with elevated substrate temperature.     

Predictive Simulation of Advanced Nano-CMOS Devices Based on kMC Process Simulation

In this paper, accurate and advanced CMOS process and device simulations based on atomistic kinetic Monte Carlo (kMC) process simulator are presented. First, the methodology used to predict continuum 2-D/3-D doping profiles from 3-D atomistic distribution that can be directly transferred from process to device simulator is described. Calibration of damage evolution, dopant diffusion and clustering, interaction with interfaces, and the impact of impurities, which are crucial for accurate simulations, will be presented and discussed. Subsequently, comparison with a wide range of electrical-device characteristics showed that experimental results were remarkably well reproduced by the simulations. Finally, we shall demonstrate that device optimization can be achieved based on kMC process simulations, even for novel coimplant processes. This paves the way for the use of kMC in the design of devices and the optimization of device performance in technology computer-aided design for manufacturing.     

Moisture-induced failures of adhesive flip chip interconnects

Adhesive flip chip interconnect has been recognized as a promising substitute for solder interconnection due to its fine-pitch, lead-free, and low-temperature processing capabilities. As adhesives are made of polymers, moisture absorption by the polymeric resin remains as one of the principal contributors to adhesive joint failure mechanisms. In this research, the reliability performance of the adhesive flip chip in the pressure cooker test and moisture sensitivity test conditions was investigated. The failure modes were found to be interfacial delamination and bump/pad opening which may eventually lead to total loss of electrical contact. Different sizes of bump/pad opening in the interconnections were discussed in the context of the significance of mismatch in coefficient of moisture expansion (CME) between adhesive and other components in the package, which induces a hygroscopic swelling stress. The effect of moisture diffusion in the package and the CME mismatch were also evaluated from the standpoint of finite element modeling. In this study, it is concluded that hygroscopic swelling assisted by loss of adhesion strength upon moisture absorption is responsible for the moisture-induced failures in these adhesive flip chip interconnects.     

Bacteria-Responsive Self-Assembly of Antimicrobial Peptide Nanonets for Trap-and-Kill of Antibiotic-Resistant Strains

Bacterial trapping using nanonets is a ubiquitous immune defense mechanism against infectious microbes. These nanonets can entrap microbial cells, effectively arresting their dissemination and rendering them more vulnerable to locally secreted microbicides. Inspired by this evolutionarily conserved anti-infective strategy, a series of 15 to 16 residue-long synthetic β-hairpin peptides is herein constructed with the ability to self-assemble into nanonets in response to the presence of bacteria, enabling spatiotemporal control over microbial killing. Using amyloid-specific K114 assay and confocal microscopy, the membrane components lipoteichoic acid and lipopolysaccharide are shown to play a major role in determining the amyloid-nucleating capacity as triggered by Gram-positive and Gram-negative bacteria respectively. These nanonets displayed both trapping and killing functionalities, hence offering a direct improvement from the trap-only biomimetics in literature. By substituting a single turn residue of the non-amyloidogenic BTT1 peptide, the nanonet-forming BTT1-3A analog is produced with comparable antimicrobial potency. With the same sequence manipulation approach, BTT2-4A analog modified from BTT2 peptide showed improved antimicrobial potency against colistin-resistant clinical isolates. The peptide nanonets also demonstrated robust stability against proteolytic degradation, and promising in vivo efficacy and biosafety profile. Overall, these bacteria-responsive peptide nanonets are promising clinical anti-infective alternatives for circumventing antibiotic resistance.     

Effects of environmental uncertainty on organizational intention to adopt distributed work arrangements

Uncertainty in the external environmental context has been shown to affect organizational change and innovation. Distributed work arrangement is an organizational innovation that has the potential to enable a firm to meet the challenges of an uncertain environment more effectively. With the emergence of virtual organizations, such work arrangements are likely to gain increasing popularity. This exploratory empirical study employs a structural model to examine how environmental uncertainty affects organizational predisposition (adoption intention) toward distributed work arrangements. Environmental uncertainty has two different dimensions: environmental complexity (heterogeneity) and environmental variability (dynamism). In this paper, environmental dimensions are modeled to influence adoption of distributed work arrangements through shaping the organizational perceptions of three innovation characteristics: perceived relative advantage, compatibility and complexity. Data analyses using partial least squares statistical technique revealed that environmental complexity is negatively associated with perceived relative advantage, and perceived compatibility. Perceived relative advantage and perceived compatibility are in turn positively related to adoption intention for distributed work arrangements. However, environmental variability has no significant effect on the three innovation characteristics. Contrary to past findings that suggest organizations are more predisposed toward innovations in a complex environment, our study found that organizations in an environment of lower, rather than higher complexity are more likely to adopt distributed work arrangements. Implications for organizations are discussed.