对CFG桩质量缺陷的探讨

根据具体工程的概况及水文地质条件，分析了CFG桩在地下水位出现大面积缩颈现象和复合地基载荷试验达不到设计要求的原因，并介绍了地基补强措施，以满足工程质量的要求。     

个性化公开密钥系统的设计

论文提出利用用户提供的个性化信息来随机产生关联大素数,保证了素数选取的随机化、个性化,提高了RSA算法的安全性。     

基于服务器端会话追踪的Web查询服务的研究

在探讨了Web查询服务的典型模型后,论文阐述了服务器端会话追踪机制的实现方式,设计了基于服务器端会话追踪的Web查询服务的典型解决方案。该设计方案可以较为安全地保存和维护客户的上下文信息,可靠地跟踪用户查询所处的状态,有效地实现有状态的Web查询服务。     

信息安全风险评估的模糊多准则决策方法

基于ISO/IEC17799标准建立了一个综合的信息系统风险分析框架,并运用模糊多准则决策(FMCDM)方法计算信息安全风险,根据风险等级矩阵(RLM)对信息资产风险进行级别划分,最终建立评估信息资产相关风险的完整模型。     

电信企业信息化统一模型构建策略

电信企业信息化的实质就是赋予电信企业精细化的企业资源整合能力，本以此认识为出发点，通过定义基本的信息化业务元素，需求参数和基本信息处理机制，构建出带有行业共性的电信企业信息化统一模型，该模型针对目前电信企业信息化中常见的和潜在的问题提供了有效的解决措施。     

运动饮料配方设计概论

运动中，人体生理发生一系列的变化，包括水分损失、血糖／糖原消耗、电解质损失等，导致运动中／后的疲劳和运动能力下降。以运动中人体生理特点为基础，通过讨论运动前／中／后补充水、碳水化合物及电解质的问题，论证了运动饮料配方设计的原理依据。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

一种基于空间到达角的卫星电子侦察信号分选方法

在建立简化的卫星电子侦察空间模型的基础上，提出了一种利用空间到达角分选卫星电子侦察信号的新方法。通过仿真实验验证了这种方法的可行性。该方法可用于密集信号的预处理。     

New hybrid fuzzy controller for direct torque control induction motor drives

A new hybrid fuzzy controller for direct torque control (DTC) induction motor drives is presented in this paper. The newly developed hybrid fuzzy control law consists of proportional-integral (PI) control at steady state, PI-type fuzzy logic control at transient state, and a simple switching mechanism between steady and transient states, to achieve satisfied performance under steady and transient conditions. The features of the presented new hybrid fuzzy controller are highlighted by comparing the performance of various control approaches, including PI control, PI-type fuzzy logic control (FLC), proportional-derivative (PD) type FLC, and combination of PD-type FLC and I control, for DTC-based induction motor drives. The pros and cons of these controllers are demonstrated by intensive experimental results. It is shown that the presented induction motor drive is with fast tracking capability, less steady state error, and robust to load disturbance while not resorting to complicated control method or adaptive tuning mechanism. Experimental results derived from a test system are presented confirming the above-mentioned claims.     

有线电视系统工程的招标

针对有线电视系统工程建设的特点，依照《招标投标法》的规定和程序，对有线电视系统工程招标的种类、招标方式、招标工程必备的条件、标底的编制及审定、开标、评标和中标的原则进行详细介绍，对招标文件的编制进行具体说明。