低焊接裂纹敏感性高强钢Q550CFD的组织性能研究

以低焊接裂纹敏感性高强钢Q550CFD为试验材料,测试了该低碳贝氏体钢变形奥氏体的连续冷却转变行为,制定了CCT曲线,并研究了以5℃/s冷却到不同终冷温度(550～680℃)后缓冷(0.1℃/s)至室温时的组织转变规律.在此基础上,通过工业化试验,分析了不同冷却工艺条件下钢板的组织性能.试验结果表明,不同的终冷温度可得到两种具有不同马氏体/奥氏体(MA)组元分布的组织,一种出现在贝氏体铁素体(BF)条间,并与之一同形成粒状贝氏体;一种则在晶界处单独存在,含有该类MA组织的钢冲击韧性较低.通过回火处理,存在于晶界处的MA组织得到分解,冲击韧性可以得到提高.     

凹凸棒土与纳米二氧化硅对高强石膏浆体3D可打印性的影响

本文研究了凹凸棒土(ATP)和纳米二氧化硅(NS)对3D打印用α半水石膏浆体泵送性、流变性、支撑性等可打印性及固化体力学强度的影响.结果表明,掺入ATP后,泵送力维持在(0.57±0.02)kN,浆体剪切应力与剪切应变曲线不随掺量增加而发生明显变化,0 h、4 h打印体坍塌角分别从空白组的24°、32°降至掺量为2.8...     

分子动力学模拟用贵金属势函数的应用与发展

势函数是用来描述介观层次系统中分子或原子间相互作用的一种数学模型,是在介观层次上进行材料显微结构分子动力学模拟的关键。针对贵金属及其合金总结了分子动力学模拟研究中常用势函数的类型、数学形式和基本参数,介绍了各种势函数在实际研究中的具体应用情况,分析讨论了贵金属势函数的构建和应用中急需解决的问题、以及势函数研究的发展趋势。     

Induced Pluripotent Stem Cell-Derived Conditioned Medium Promotes Endogenous Leukemia Inhibitory Factor to Attenuate Endotoxin-Induced Acute Lung Injury

The conditioned medium of induced pluripotent stem cells (iPSC-CM) can attenuate neutrophil recruitment and endothelial leakage of lipopolysaccharide (LPS)-induced acute lung injury (ALI). Therefore, we investigated the mechanisms by which iPSC-CM regulate the interaction between neutrophils and the endothelium in ALI. Murine iPSCs (miPSCs) were delivered intravenously to male C57BL/6 mice (8–12 weeks old) 4 h after intratracheal LPS injection. A miPSC-derived conditioned medium (miPSC-CM) was delivered intravenously to mice after intratracheal LPS injection. DMSO-induced HL-60 cells (D-HL-60, neutrophil-like cells) and human umbilical vein endothelial cells (HUVECs) were used as in vitro models to assess the interaction of neutrophils and endothelial cells. miPSC-CM diminished the histopathological changes in the lungs and the neutrophil count in bronchoalveolar lavage fluids of ALI mice. miPSC-CM attenuated the expression of adhesion molecules in the lungs of ALI mice. Human iPSC conditioned medium (hiPSC-CM) reduced the expression of adhesion molecules in a HUVEC and D-HL-60 co-culture after LPS stimulation, which decreased the transendothelial migration (TEM) of D-HL-60. A human angiogenesis factors protein array revealed that leukemia inhibitory factor (LIF) was not detected in the absence of D-HL-60 and hiPSC-CM groups. hiPSC-CM significantly promoted the production of endogenous LIF in in vitro models. Administration of an anti-LIF antibody not only reversed the effect of iPSC-CM in ALI mice, but also blocked the effect of iPSC-CM on neutrophils TEM in in vitro models. However, a controlled IgG had no such effect. Our study demonstrated that iPSC-CM promoted endogenous LIF to inhibit neutrophils TEM and attenuate the severity of sepsis-induced ALI.     

溶剂热法制备硒化钨纳米花及其气敏性能研究

以N,N-二甲基甲酰胺为分散剂,亚硒酸钠和钨酸钠为原料,采用溶剂热法制备了由超薄二维层状纳米片堆叠而成的花状硒化钨纳米材料,并研究了其气敏性能。通过X射线粉末衍射（XRD）、扫描电子显微镜（SEM）和透射电子显微镜（TEM）等方法对合成材料进行了结构表征。结果表明：合成的花状纳米硒化钨为六方晶相,在三乙胺、氨水、三甲胺、苯胺、甲酰胺等胺类气体的检测中,对三乙胺气体具有高选择性和超快的响应恢复速率。在最佳工作温度220 ℃下,传感器对体积分数为50×10^-6的三乙胺的响应灵敏度达到20.1,其响应、恢复时间分别为6 s和3 s,最低检出限为0.3×10^-6。对硒化钨材料的气敏机理也进行了讨论,该材料在气敏领域有着潜在的应用前景。     

Effect of different templates on conductivity and strain sensing properties of natural rubber/reduced graphene and acidified multi-walled carbon nanotubes woven fabric composites

不同模板对天然橡胶/还原石墨烯和酸化多壁碳纳米管机织物复合材料导电性能和应变传感性能的影响 章婉琪,林炎坤,王 晶,姜 宽,贾红兵 （南京理工大学 教育部软化学和功能材料重点实验室,南京 210094） 制备了天然橡胶（NR）/还原石墨烯和酸化多壁碳纳米管机织物（GMWF）-M（密集）和NR/GMWF-S（稀疏）复合材料,研究了两种疏密程度不同的棉织品模板对GMWF复合材料导电性能和应变传感性能的影响。结果表明,NR/GMWF-M复合材料的导电性能明显优于NR/GMWF-S,但NR/GMWF-S的传感性能更佳。     

基于Kriging代理模型的TP304不锈钢裂尖驱动力概率预测（英文）

为了探究材料和载荷的随机性对TP304不锈钢裂尖驱动力的影响规律,通过将弹塑性有限元和Kriging代理模型相结合,实现裂尖驱动力的概率预测。为了提高有限元分析的效率,使用MATLAB对ABAQUS软件的前置处理和后置处理程序进行二次开发,实现随机样本的自动更改、批量计算和概率预测结果的自动分析。研究得到了随机因素作用下TP304不锈钢材料裂尖驱动力的统计分布规律,以及失效概率、失效概率密度函数、累计概率密度函数等概率特征,并对各随机因素的灵敏度进行了分析。最后,通过与Monte Carlo法对比分析了该方法的有效性和效率。结果表明,载荷和材料参数的随机性会显著影响TP304不锈钢裂纹尖端的驱动力,从而影响TP304不锈钢的失效概率,载荷和应变硬化指数对奥氏体TP304不锈钢材料裂尖驱动力的分散性影响最大。     

Chitosan–Polyelectrolyte complexation for the preparation of gel beads and controlled release of anticancer drug. I. Effect of phosphorous polyelectrolyte complex and enzymatic hydrolysis of polymer

Enzymic hydrolyzed chitosan was employed to prepare chitosan–tripolyphosphate and chitosan–polyphosphoric acid gel beads using a polyelectrolyte complexation method for the sustained‐release of anticancer agent, 6‐mercaptopurine (6‐MP). pH responsive swelling ability, drug‐release characteristics, and morphology of the chitosan gel bead depends on polyelectrolyte complexation mechanism and molecular weight of the enzymic hydrolyzed chitosan. The complexation mechanism of chitosan beads gelled in pentasodium tripolyphosphate or polyphosphoric acid solution was ionotropic crosslinking or interpolymer complex, respectively. The drug‐release patterns of all chitosan gel beads in pH 6.8 seemed to be diffusional based, which might be in accordance with the Higuchi model, whereas release profiles of the chitosan–tripolyphosphate gel beads in pH 1.2 medium seemed to be non‐Fickian diffusion controlled due to the swelling or matrix erosion of the beads. The rate of 6‐MP releasing from chitosan–tripolyphosphate or chitosan–polyphosphoric acid gel matrix were significantly increased with the decreased molecular weight of enzymic hydrolyzed chitosan. However, the dissolution rates of 6‐MP entraped in chitosan–tripolyphosphate and chitosan–polyphosphoric acid gel matrix were significantly slower than the dissolution rate of the original drug. These results indicate that the chitosan–polyphosphoric acid gel bead is a better polymer carrier for the sustained release of anticancer drugs in simulated intestinal and gastric juice medium than the chitosan–tripolyphosphate gel beads. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 1868–1879, 1999     

Effect of bump size on current density and temperature distributions in flip-chip solder joints

Three dimensional thermo-electrical analysis was employed to simulate the current density and temperature distributions for eutectic SnAg solder bumps with shrinkage bump sizes. It was found that the current crowding effects in the solder were reduced significantly for smaller solder joints. Hot-spot temperatures and thermal gradient were increased upon reducing the solder. The maximum temperature for solder joint with 144.7 μm bump height is 103.15 °C which is only 3.15 °C higher than the substrate temperature due to Joule heating effect. However, upon reducing the bump height to 28.9 μm, the maximum temperature in the solder increased to 181.26 °C. Serious Joule heating effect was found when the solder joints shrink. The higher Joule heating effect in smaller solder joints may be attributed to two reasons, first the increase in resistance of the Al trace, which is the main heating source. Second, the average and local current densities increased in smaller bumps, causing higher temperature increase in the smaller solder bumps.     

Radiation energy transfer and maximum conversion efficiency

Radiation energy transfer is modeled as the enthalpy flux of photons across the boundary of a thermodynamic system. It is proved that this energy transfer process can be treated as heat transfer. Compression work must be applied to the system to push the photons out. The energy transfer rate and maximum conversion efficiency computed from the model are identical to those determined from the Stefan–Boltzmann law and the Carnot efficiency for blackbody radiation.