Reconstruction of a signal using the spectrum-reversal technique

Our procedure of real-zero conversion uses a spectrum-reversal technique to convert the information of a bandlimited signal to real zeros. We conducted a simple reconstruction experiment and showed that our proposed method is essentially equivalent to the conventional technique of sine-wave crossings     

Athermal silica-based arrayed-waveguide grating multiplexer

A temperature dependent channel wavelength shift in a silica-based arrayed-waveguide grating multiplexer is successfully suppressed from 0.95 to 0.05 nm in the 0-85°C temperature range, which means that it can be used in practical WDM systems without the need for temperature control     

Interface structure in arsenide/phosphide heterostructun grown by gas-source MBE and low-pressure MOVPE

We have used cross-sectional scanning tunneling microscopy (STM) to study interface structure in arsenide/phosphide heterostructures grown by gas-source molecular beam epitaxy (GSMBE) and by low-pressure metalorganic vapor phase epitaxy (LP-MOVPE). High-resolution images of GSMBE samples consisting of GaAs interrupted at 200Å intervals with a 40 s P₂ flux reveal substantial, growth-temperature-dependent incorporation of phosphorus with nanometer-scale lateral variations in interface structure. STM images of InGaAs/InP multiple quantum well structures grown by LP-MOVPE show evidence of interface asymmetry and extensive atomic cross-incorporation at the interfaces. Data obtained by STM have been corroborated by high-resolution x-ray diffraction and reflection high-energy electron diffraction. Together, these studies provide direct information about nanometer-scale grading and lateral nonuniformity of arsenide/phosphide interfaces that can occur under these growth conditions.     

InxGa1−xAs ohmic contacts to n-type GaAs with a tungsten nitride barrier

Significant reduction of the contact resistance of In_0.7Ga_0.3As/Ni/W contacts (which were previously developed by sputtering in our laboratory) was achieved by depositing a W₂N barrier layer between the Ni layer and W layer. The In_0.7Ga_0.3 As/Ni/W₂N/W contact prepared by the radio-frequency sputtering technique showed the lowest contact resistance of 0.2 Ωmm after annealing at 550°C for 10 s. This contact also provided a smooth surface, good reproducibility, and excellent thermal stability at 400°C. The polycrystalline W₂N layer was found to suppress the In diffusion to the contact surface, leading to improvement of the surface morphology and an increase in the total area of the In_xGa−As between metal and the GaAs substrate. These improvements are believed to reduce the contact resistance.     

Strain effects in CdTe (111) epitaxial layers grown on GaAs (100) substrates by molecular beam epitaxy

Spectroscopic ellipsometry and photoreflectance measurements on CdTe/GaAs strained heterostructures grown by moleculclr beam epitaxy were carried out to investigate the effect of the strain and the dependence of the lattice parameter on the CdTe epitaxial layer thicknesses. Compressive strains exist in CdTe layers thinner than 2 μm. As the strain increases, the value of the critical-point energy shift increases linearly. These results indicate that the strains in the CdTe layers grown on GaAs substrates are strongly dependent on the CdTe layer thickness. Author to whom all correspondence should be addressed.     

Modulation and Equalisation Considerations for High Performance Radio LANs

The European Telecommunications Standards Institute (ETSI) has recently defined a European standard for a high performance radio LAN (known as HIPERLAN). To operate as wired LAN replacements, these systems will operate at 5.2 GHz and support instantaneous bit rates of just under 24 Mb/s. To counteract the time dispersive nature of the indoor radio channel, the use of adaptive equalisation is suggested. In this paper a number of possible modulation and equalisation techniques are presented and, in particular, the Bit Error Rate (BER) performance of quasi-coherent GMSK combined with Decision Feedback Equalisation is explored through computer simulation. The trade off between symbol spaced and fractionally spaced equalisation is considered together with the importance of feedfoward and feedback synchronisation to the channel's power delay profile. The paper also includes a comparison of the RLS and LMS based training algorithms and compares the modem developed under the ESPRIT III LAURA project with that specified in HIPERLAN.The application of dual antenna diversity is investigated and its impact on the number of received error free data packets obtained as a function of signal leval and rms delay spread. The use of such diversity is shown to greatly improve the BER performance of a HIPERLAN modem. The problem of frequency offset is considered and modifications are proposed to the HIPERLAN frame structure to improve the receiver's tolerance to such errors. Important practical issues such as frame and symbol synchronisation, frequency offset correction and hardware implementation are discussed from both the LAURA and HIPERLAN viewpoint.     

An EPR study of defects induced in 6H-SiC by ion implantation

Crystalline (0001) plane wafers of n-type 6H-SiC have been implanted at room temperature with 200 keV Ge⁺ ions in the dose range 10¹² to 10¹⁵ cm⁻². Electron paramagnetic resonance (EPR) measurements have been made on these samples both before and after annealing them at temperatures in the range room temperature to 1500°C. The as-implanted samples have a single isotropic and asymmetric line EPR spectrum whose width, ΔB_pp, increases with ion dose before falling when a buried continuous amorphous layer is produced. This increase is interpreted in terms of the change in the relative intensity of a line with g = 2.0028 ± 0.0002, ΔB_pp = 0.4 mT associated primarily with carbon dangling bonds in a-SiC and a line with g in the range 2.0033 to 2.0039 of uncertain origin. The variation with anneal temperature of the populations of these defects is reported.     

Synchronisation Techniques for HIPERLAN

Timing recovery in the High Performance Radio Local Area Network (HIPERLAN) standard is likely to be performed with the aid of synchronisation sequences embedded in the user data, which will be detected with matched filters. A directed search using a form of genetic algorithm has been performed to obtain suitable sequences of lengths up to 80 bits, and simulations of their performance have been undertaken. Performance of the sequences has been measured under the severe channel conditions that pertain in the indoor environment.     

Selective area epitaxy of CdTe

We have performed selective area epitaxy (SAE) of CdTe layers grown by molecular beam epitaxy using a shadow mask technique. This technique was chosen over other SAE techniques due to its simplicity and its compatibility with multiple SAE patterning steps. Features as small as 50 microns × 50 microns were obtained with sharp, abrupt side walls and flat mesa tops. Separations between mesas as small as 20 microns were also obtained. Shadowing effects due to the finite thickness of the mask were reduced by placing the CdTe source in a near normal incidence position. Intimate contact between the mask and the substrate was essential in order to achieve good pattern definition.     

A high-speed, low-power bipolar digital circuit for Gb/s LSI's:current mirror control logic

A novel low-power bipolar circuit for Gb/s LSIs, current mirror control logic (CMCL), is described. To reduce supply voltage and currents, the current sources of emitter-coupled-logic (ECL) series gate circuits are removed and the lower differential pairs are controlled by current mirror circuits. This enables circuits with the same function as two-stacked ECL circuits to operate at supply voltage of -2.0 V and reduces the current drawn through the driving circuits for the differential pairs to 50% of the conventional level shift circuits (emitter followers) in ECL. This CMCL circuit achieves 3.1-Gb/s (D-FF) and 4.3-GHz (T-FF) operation with a power supply voltage of -2.0 V and power dissipation of only 1.8 mW/(FF)