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91.
92.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
93.
On the effect of spatial variances in historical rainfall time series to CSO performance evaluation.
Historical, high-resolution rain series are the backbone of modern combined sewer overflow (CSO) structure design. These rain series are the input to the computational estimation of the performance of the measures with respect to CSO pollution abatement. However, those historical precipitation measurements are available at only a few locations. Frequently rain series have to be used from gauging stations at a significant distance. In order to judge and to compensate for this influence an estimate between rain characteristics and combined sewer outflow (CSO) performance indicators would be useful. In this paper such correlations have been sought for a collection of 37 rain series covering large areas of Europe. It was found that the mean annual rain volume can explain most of the variances for the performance indicators Number of overflows and CSO volume. For explaining the spatial differences in the efficiency of the CSO structure another rain characteristic, i.e. the maximum event with a return period of one year, is to be used. 相似文献
94.
Asakawa K. Matake S. Hotta Y. Hiraoka T. 《Advanced Packaging, IEEE Transactions on》2006,29(2):211-217
A new type of a flexible printed circuit board with landless vias is developed using a novel method called interconnection via nanoporous structure (INPS). This method can make wires and vias of the printed circuit board simultaneously by a single photo-exposure process. A new photo-induced selective plating method was used to impregnate a nanoporous substrate with copper, and a new photomask was designed, which constitutes of a completely vacant large hole for via and aggregation patterns of very fine holes for wire. Because of the simple process, the INPS board is characterized by landless vias and very fine circuit. Owing to the structure, it is also characterized by flexibility and detachable wires. 相似文献
95.
Goel S. Elgamel M.A. Bayoumi M.A. Hanafy Y. 《IEEE transactions on circuits and systems. I, Regular papers》2006,53(4):867-878
Scaling down to deep submicrometer (DSM) technology has made noise a metric of equal importance as compared to power, speed, and area. Smaller feature size, lower supply voltage, and higher frequency are some of the characteristics for DSM circuits that make them more vulnerable to noise. New designs and circuit techniques are required in order to achieve robustness in presence of noise. Novel methodologies for designing energy-efficient noise-tolerant exclusive-OR-exclusive- NOR circuits that can operate at low-supply voltages with good signal integrity and driving capability are proposed. The circuits designed, after applying the proposed methodologies, are characterized and compared with previously published circuits for reliability, speed and energy efficiency. To test the driving capability of the proposed circuits, they are embedded in an existing 5-2 compressor design. The average noise threshold energy (ANTE) is used for quantifying the noise immunity of the proposed circuits. Simulation results show that, compared with the best available circuit in literature, the proposed circuits exhibit better noise-immunity, lower power-delay product (PDP) and good driving capability. All of the proposed circuits prove to be faster and successfully work at all ranges of supply voltage starting from 3.3 V down to 0.6 V. The savings in the PDP range from 94% to 21% for the given supply voltage range respectively and the average improvement in the ANTE is 2.67X. 相似文献
96.
Supermedia-enhanced Internet-based telerobotics 总被引:4,自引:0,他引:4
Elhajj I. Ning Xi Wai Keung Fung Yun-Hui Liu Hasegawa Y. Fukuda T. 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》2003,91(3):396-421
This paper introduces new planning and control methods for supermedia-enhanced real-time telerobotic operations via the Internet. Supermedia is the collection of video, audio, haptic information, temperature, and other sensory feedback. However, when the communication medium used, such as the Internet, introduces random communication time delay, several challenges and difficulties arise. Most importantly, random communication delay causes instability, loss of transparency, and desynchronization in real-time closed-loop telerobotic systems. Due to the complexity and diversity of such systems, the first challenge is to develop a general and efficient modeling and analysis tool. This paper proposes the use of Petri net modeling to capture the concurrency and complexity of Internet-based teleoperation. Combined with the event-based planning and control method, it also provides an efficient analysis and design tool to study the stability, transparency, and synchronization of such systems. In addition, the concepts of event transparency and event synchronization are introduced and analyzed. This modeling and control method has been applied to the design of several supermedia-enhanced Internet-based telerobotic systems, including the bilateral control of mobile robots and mobile manipulators. These systems have been experimentally implemented in three sites test bed consisting of robotic laboratories in the USA, Hong Kong, and Japan. The experimental results have verified the theoretical development and further demonstrated the stability, event transparency, and event synchronization of the systems. 相似文献
97.
H. L. Du S. R. Rose Z. D. Xiang P. K. Datta X. Y. Li 《Materialwissenschaft und Werkstofftechnik》2003,34(4):421-426
The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl3 diffusion coating was studied in an environment of H2/H2S/H2O at 850oC. The kinetic results demonstrate that the TiAl3 coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al2O3 scale on the surface of the TiAl3‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate. 相似文献
98.
W. Wang J. Dai J. Tang D.-T. Jiang Y. Chen J. Fang J. He W. Zhou L. Spinu 《Journal of Superconductivity》2003,16(1):155-157
Ball-milling method was applied to dissolve Fe into titanium dioxide (TiO2). X-ray diffraction indicated the starting anatase changed to a rutile-type structure with oxygen deficiency after ball milling. Transmission electron microscopy and X-ray absorption experiments were conducted to examine the possible existence of magnetic impurities in the ball-milled powders after they were leached in HCl solutions. Temperature dependence of the resistivity shows semiconducting behavior and the magnetic hysteresis loops at 5 and 300 K exhibit ferromagnetic characteristics. Fe-doped TiO2 films were also prepared by pulsed laser deposition. The magnetic properties of the films are discussed. 相似文献
99.
Jokerst N.M. Gaylord T.K. Glytsis E. Brooke M.A. Cho S. Nonaka T. Suzuki T. Geddis D.L. Shin J. Villalaz R. Hall J. Chellapa A. Vrazel M. 《Advanced Packaging, IEEE Transactions on》2004,27(2):376-385
This paper explores design options for planar optical interconnections integrated onto boards, discusses fabrication options for both beam turning and embedded interconnections to optoelectronic devices, describes integration processes for creating embedded planar optical interconnections, and discusses measurement results for a number of integration schemes that have been demonstrated by the authors. In the area of optical interconnections with beams coupled to and from the board, the topics covered include integrated metal-coated polymer mirrors and volume holographic gratings for optical beam turning perpendicular to the board. Optical interconnections that utilize active thin film (approximately 1-5 /spl mu/m thick) optoelectronic components embedded in the board are also discussed, using both Si and high temperature FR-4 substrates. Both direct and evanescent coupling of optical signals into and out of the waveguide are discussed using embedded optical lasers and photodetectors. 相似文献
100.
The aim of this study was to evaluate the use of total coliforms (TC) and faecal coliforms (FC) using a membrane filtration method for precise monitoring of faecal pollution in Korean surface water. The samples were collected in Korea from both main rivers and their tributaries. Presumptive TC * FC were enumerated. The ratios of presumptive FC to TC were not constant, but varied widely, and TC were difficult to enumerate because of overgrowth by background colonies. For FC this was not the case. Seven hundred and three purified strains of presumptive TC * FC and their background colonies were biotyped using API 20E. Among 272 presumptive TC, non-faecal related species, Aeromonas hydrophila dominated (34.6%) and E. coli accounted for only 5.1%. In contrast, E. coli made up 89% of the 209 presumptive FC. Furthermore, of 164 background colonies on Endo Agar LES, 54.9% was A. hydrophila, while background colonies on m-FC Agar were few (58 strains), and despite their atypical colony appearance, most of them were biotyped as enteric bacteria. These results reveal that the detection of FC rather than TC using m-FC Agar is more appropriate for faecal pollution monitoring in eutrophicated surface water located in a temperate region. 相似文献