ICP-AES法测定封严涂层中BN含量

利用IC－AES法测定了封严涂层的BN，并对样品的溶解方法，仪器工作参数，光谱干扰等进行了研究。方法的相对标准偏差＜2％（n=10)，加标回收率在95％以上，方法简便，可靠，结果令人满意。     

修正步冷温度曲线试验研究

按修正步冷温度曲线对经步冷脆化的 2 .2 5Cr 1Mo和在加氢反应器内运行 5a的 2 2 5Cr 1Mo试块进行了修正步冷试验 ,评定了材料的回火脆性。结果表明 ,按修正步冷曲线进行修正步冷试验能使已经脆化的材料进一步脆化 ,为加氢反应器材料损伤的研究提供了一条途径。     

HAT循环构成热电冷三联产总能系统的可行性分析

对国内外在提高能源利用率方面的研究现状和发展趋势进行了综述，在前人研究的基础上提出以湿空气透平湿空气透平（HAT）循环构成热、电、冷三联产总能系统的能量利用形式，详细分析了构成该系统的相关技术、可行性及需要加以解决的几个问题。     

Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging

There is a plethora of techniques to measure the adhesion strength of metal/polymer interfaces. However, the practical adhesion strength, which is the work done in separating the film from the substrate (or one film from another), is very sensitive to the test methods and the mechanical effects, such as the residual stress, thickness and mechanical properties of the layers, strain rate, and phase angle. Deriving intrinsic-adhesion properties of the interfaces, which are independent of such parameters, from the practical adhesion-strength measurements is a formidable task. In the present work, data from the three commonly used adhesion tests; pull-out, 90°-peel, and T-peel tests are compared with the intrinsic-adhesion properties of the interface, such as the interface-fracture toughness or the interface-fracture energy, and their implications are discussed. Material systems analyzed were Cu-based lead frame/epoxy-molding compound (EMC) and Cu/Cr/polyimide.     

中频变频器UFV故障探析

本文对中频变频器的UFV故障进行了系统试验和原因分析，并对UFV故障的关键因素进行了详细探析。     

多媒体课件在开放实验室中的应用

介绍了制作多媒体课件的必要性，及所制作课件的特点。该课件与实验室管理系统配合起来，有利于实现实验室的全面开放。     

建筑师难以出精品之原因分析

指出当今建筑业良好的市场给建筑师们提供了展示自己作品的广大空间 ,但其精品却为之甚少。为此 ,对建筑业存在的一些问题及制约建筑师出精品的主、客观因素进行了分析 ,指出建筑师应提高自身素质 ,树立精品意识 ,增强市场竞争能力     

带疏水泵加热器出口主凝结水焓的计算方法

以火电厂热力系统热力单元矩阵分析法为基础，提出了一种更为科学有效的带疏水泵加热器出口主凝结水焓分析计算的新方法，应用表明，其结论与常规算法完全一致，图2表1参3。     

OPC技术在天然气流量计算中的应用

介绍了OPC技术及其应用于天然气流量计算的实现过程 ,设计了基于SY/T6 14 3《天然气流量的标准孔板计量方法》标准的天然气流量计算软件。该软件在新疆某输气管道项目和成都某天然气项目中都获得了成功应用     

A transmit/receive IF chip set for WCDMA mobiles in 0.35 /spl mu/m CMOS

An implementation of the IF section of WCDMA mobile transceivers with a set of two chips fabricated in an inexpensive 0.35-/spl mu/m two-poly three-metal CMOS process is presented. The transmit/receive chip set integrates quadrature modulators and demodulators, wide dynamic range automatic gain control (AGC) amplifiers, with linear-in-decibel gain control, and associated circuitry. This paper describes the problems encountered and the solutions envisaged to meet stringent specifications, with process and temperature variations, thus overcoming the limitations of CMOS devices, while operating at frequencies in the range of 100 MHz-1 GHz. Detailed measurement results corroborating successful application of the new techniques are reported. A receive AGC dynamic range of 73 dB with linearity error of less than /spl plusmn/2 dB and spread of less than 5 dB for a temperature range of -30/spl deg/C to +85/spl deg/C in the gain control characteristic has been measured. The modulator measurement shows a carrier suppression of 35 dB and sideband/third harmonic suppression of over 46 dB. The core die area of each chip is 1.5 mm/sup 2/.