首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   3561篇
  免费   190篇
  国内免费   13篇
电工技术   66篇
综合类   3篇
化学工业   698篇
金属工艺   146篇
机械仪表   249篇
建筑科学   51篇
矿业工程   2篇
能源动力   152篇
轻工业   413篇
水利工程   39篇
石油天然气   5篇
无线电   583篇
一般工业技术   751篇
冶金工业   221篇
原子能技术   51篇
自动化技术   334篇
  2024年   5篇
  2023年   47篇
  2022年   63篇
  2021年   111篇
  2020年   55篇
  2019年   81篇
  2018年   93篇
  2017年   79篇
  2016年   110篇
  2015年   92篇
  2014年   135篇
  2013年   210篇
  2012年   246篇
  2011年   311篇
  2010年   216篇
  2009年   208篇
  2008年   224篇
  2007年   172篇
  2006年   167篇
  2005年   122篇
  2004年   126篇
  2003年   100篇
  2002年   124篇
  2001年   100篇
  2000年   68篇
  1999年   64篇
  1998年   127篇
  1997年   70篇
  1996年   50篇
  1995年   28篇
  1994年   31篇
  1993年   24篇
  1992年   25篇
  1991年   14篇
  1990年   7篇
  1989年   7篇
  1988年   6篇
  1987年   7篇
  1986年   5篇
  1985年   3篇
  1984年   4篇
  1983年   6篇
  1982年   4篇
  1980年   2篇
  1979年   4篇
  1976年   2篇
  1972年   1篇
  1969年   2篇
  1967年   1篇
  1966年   1篇
排序方式: 共有3764条查询结果,搜索用时 15 毫秒
41.
This letter presents a compact size microstrip spiral resonator and its application to a low phase noise oscillator. This resonator has stopband characteristics to be used in the series feedback oscillator topology. The whole circuit area of the proposed resonator is within 1/10 wavelength, which results in the reduction of the circuit area and cost. A 10-GHz oscillator incorporated with this resonator was designed, fabricated and measured. It shows low phase noise performance of -95.4-dBc/Hz at 100 kHz offset.  相似文献   
42.
在20世纪90年代,球栅阵列封装(BGA)和芯片尺寸封装(CSP)在封装材料和加工工艺方面达到了极限。这2种技术如同20世纪80年代的表面安装器件(SMD)和70年代通孔安装器件(THD)一样,在电学、机械、热性能、尺寸、质量和可靠性方面达到最大值。目前,三维封装正在成为用于未来采用的先进印制板(PCB)制造工艺的下一个阶段。它们可以分为圆片级封装、芯片级封装、和封装面。叠层封装(PoP)是一种封装面叠层封装类型的三维封装技术[15]。  相似文献   
43.
A 12-b, 10-MHz, 250-mW, four-stage analog-to-digital converter (ADC) was implemented using a 0.8-μm p-well CMOS technology. The ADC based on a digitally calibrated multiplying digital-to-analog converter (MDAC) selectively employs a binary-weighted capacitor array in the front-end stage and a unit-capacitor array in the remaining back-end stages to obtain 12 b level linearity while maintaining high yield. All the analog and digital circuit functional blocks are fully integrated on a single chip, which occupies a die area of 15 mm2 (4.2 mm×3.6 mm). Measured differential nonlinearity (DNL) and integral nonlinearity (INL) of the prototype are less than ±0.8 LSB and ±1.8 LSB, respectively  相似文献   
44.
Binary blends of ethylene vinyl alcohol copolymers, containing 62 (EVOH-62) and 71 (EVOH-71) mole percent vinyl alcohols, with nylons (nylon-6, nylon-6/12, and nylon-12) have been prepared from melt mixing in a twin screw compounding machine. Morphological, thermal, rheological, and mechanical properties were determined. EVOH-62/nylon-6 and EVOH-71/nylon-6 blends showed homogeneous phase morphologies in the nylon-6-rich region, and fine phase separations (c.a. 2 × 10?7 m) in the EVOH-rich region. Melting point depression, positive deviations in viscosity and flexural modulus, and negative deviation in impact strength from the simple additive rule were generally observed. And the results were possibly interpreted in terms of compatibility and increased nylon/EVOH interactions over the nylon/nylon interactions. On the contrary, clean phase separations in large domains were observed from EVOH-71/nylon-6/12 and EVOH-71 /nylon-12 blends. Fibrillation was also obtained from EVOH rich blends. Probably due to the incompatible nature of these blends, yield at low rate of shear and a mechanical property drop were also observed.  相似文献   
45.
Conventional power sources encounter difficulties in achieving structural unitization with complex-shaped electronic devices because of their fixed form factors. Here, it is realized that an on-demand conformal Zn-ion battery (ZIB) on non-developable surfaces uses direct ink writing (DIW)-based nonplanar 3D printing. First, ZIB component (manganese oxide-based cathode, Zn powder-based anode, and UV-curable gel composite electrolyte) inks are designed to regulate their colloidal interactions to fulfill the rheological requirements of nonplanar 3D printing, and establish bi-percolating ion/electron conduction pathways, thereby enabling geometrical synchronization with non-developable surfaces, and ensuring reliable electrochemical performance. The ZIB component inks are conformally printed on arbitrary curvilinear substrates to produce embodied ZIBs that can be seamlessly integrated with complicated 3D objects (including human ears). The conformal ZIB exhibits a high fill factor (i.e., areal coverage of cells on underlying substrates, ≈100%) that ensures high volumetric energy density (50.5 mWh cmcell−3), which exceeds those of previously-reported shape-adaptable power sources.  相似文献   
46.
ZnS is a candidate to replace CdS as the buffer layer in Cu(In,Ga)Se2 (CIGS) solar cells for Cd‐free commercial product. However, the resistance of ZnS is too large, and the photoconductivity is too small. Therefore, the thickness of the ZnS should be as thin as possible. However, a CIGS solar cell with a very thin ZnS buffer layer is vulnerable to the sputtering power of the ZnO : Al window layer deposition because of plasma damage. To improve the efficiency of CIGS solar cells with a chemical‐bath‐deposited ZnS buffer layer, the effect of the plasma damage by the sputter deposition of the ZnO : Al window layer should be understood. We have found that the efficiency of a CIGS solar cell consistently decreases with an increase in the sputtering power for the ZnO : Al window layer deposition onto the ZnS buffer layer because of plasma damage. To protect the ZnS/CIGS interface, a bilayer ZnO : Al film was developed. It consists of a 50‐nm‐thick ZnO : Al plasma protection layer deposited at a sputtering power of 50 W and a 100‐nm‐thick ZnO : Al conducting layer deposited at a sputtering power of 200 W. The introduction of a 50‐nm‐thick ZnO : Al layer deposited at 50 W prevented plasma damage by sputtering, resulting in a high open‐circuit voltage, a large fill factor, and shunt resistance. The ZnS/CIGS solar cell with the bilayer ZnO : Al film yielded a cell efficiency of 14.68%. Therefore, the application of bilayer ZnO : Al film to the window layer is suitable for CIGS solar cells with a ZnS buffer layer. Copyright © 2012 John Wiley & Sons, Ltd.  相似文献   
47.
48.
We report a novel hybrid optical amplifier covering S+C+L bands with 105-nm total bandwidth using a silica fiber. The principle of amplification is based on the stimulated radiative transition of Er-ions for C-band and on the stimulated Raman scattering for S- and L-band, respectively. In this letter, we analyze the amplification characteristics for two types of active fiber mediums through numerical simulation. One is a silica fiber configured with Er-doped cladding and Ge-doped core and the other is a medium consisting of Er-doped fiber and dispersion-compensating fiber. By optimizing parameters such as fiber length and pump power, we newly achieve wide-band amplification with 105-nm bandwidth showing a flat gain characteristic over the entire S+C+L bands.  相似文献   
49.
Digital Multimedia Broadcasting (DMB) is an upcoming standard in Korea used to provide mobile multimedia broadcasting service based on the Eureka‐147 Digital Audio Broadcasting (DAB) system. The current dominant multimedia coding standard, MPEG‐4, is foreseen to play an important role in forthcoming DMB services. However, the current approaches for transporting MPEG‐4 content over DMB networks are not optimized. To address this issue we propose a novel MPEG‐4 stream multiplexer, called M4SMux, which provides better stream multiplexing and delivery over DMB networks. M4SMux features an MPEG‐4 elementary‐stream interleaving mechanism that reduces the multiplexing overhead and a multiplex configuration mechanism that utilizes M4SLinkTable for easy content access. In addition, we propose an error correction method which enhances transport efficiency.  相似文献   
50.
Vertical organic field-effect transistors (VOFETs) with nanoscale channel openings have been fabricated using pentacene as an active layer material. To achieve uniform nanoscale two-dimensional channel openings, a laser holography lithography has been introduced. Uniformly distributed and well-aligned holes with 250 nm diameter were successfully obtained with the laser holography lithography. VOFET devices with these channel openings have shown high on/off ratio of about 103 without any further treatment. Gate leakage current was also decreased with an additional insulating layer generated on the gate electrode sidewall via plasma oxidation.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号